https://publica.fraunhofer.de/entities/publication/24e4e05a-1f0e-4374-b9c8-cd1a4048280a
https://publica.fraunhofer.de/entities/publication/24e4f5c3-42e5-4e1b-a391-ce11152a02a6
https://publica.fraunhofer.de/entities/event/24e53f1a-f646-4591-8283-365973d628d8
https://publica.fraunhofer.de/entities/publication/24e544e1-fa87-43bb-9630-bf8201632d97
https://publica.fraunhofer.de/entities/publication/24e55f43-00e3-4bf6-b109-2dde97f94d05
https://publica.fraunhofer.de/entities/publication/24e573b1-a46c-49af-a54d-2842e30da086
https://publica.fraunhofer.de/entities/publication/24e580a5-8ed7-43a6-9f61-6a6943acef01
https://publica.fraunhofer.de/entities/publication/24e59983-a6b8-4ed2-840a-ccd74863d712
https://publica.fraunhofer.de/entities/publication/24e6277f-7e26-4fa8-997e-a64187017f41
https://publica.fraunhofer.de/entities/publication/24e642e3-7df4-4ca0-8679-733fa03e91bc
https://publica.fraunhofer.de/entities/publication/24e6e310-86c3-4a7e-a867-31f3ef817315
https://publica.fraunhofer.de/entities/publication/24e70caa-8601-45c1-8b62-c2a5e5590000
https://publica.fraunhofer.de/entities/publication/24e714dc-6732-496f-8809-dd50bcea75b8
https://publica.fraunhofer.de/entities/journal/24e789ca-f334-4d38-8605-b5b912262419
https://publica.fraunhofer.de/entities/publication/24e7a074-6918-4a8f-add2-bfdebac34948
https://publica.fraunhofer.de/entities/mainwork/24e7c47b-fc94-44ab-89ca-3f38256efa3f
https://publica.fraunhofer.de/entities/mainwork/24e7c715-b6d3-4247-8cd0-d7adaac9e198
https://publica.fraunhofer.de/entities/mainwork/24e7dc9a-8a24-4355-a0a5-994c04d5853e
https://publica.fraunhofer.de/entities/mainwork/24e7eed1-c4fc-4d35-aeb4-9c896919a9b4
https://publica.fraunhofer.de/entities/publication/24e7f03a-37af-4006-baed-8ec7a0c0f0d7
https://publica.fraunhofer.de/entities/mainwork/24e8158b-8f2b-4492-a122-7d3caddcabb5
https://publica.fraunhofer.de/entities/publication/24e8934d-2c9a-4a80-8973-2a3b8e3e9fce
https://publica.fraunhofer.de/entities/publication/24e8ee8a-fa46-4307-9f55-17ab385aa65d
https://publica.fraunhofer.de/entities/publication/24e8f2c3-8da2-405d-8b92-ea8c07c5f765
https://publica.fraunhofer.de/entities/mainwork/24e93f65-45b3-4950-b78a-f015eb7fd909
https://publica.fraunhofer.de/entities/publication/24e94383-806f-423b-b754-3b433c5df758
https://publica.fraunhofer.de/entities/publication/24e96ef1-3dcf-4877-a2e7-6fb9740dfe23
https://publica.fraunhofer.de/entities/publication/24e977db-55e2-41b1-bbf5-7d843b3e75b9
https://publica.fraunhofer.de/entities/mainwork/24e98c92-6134-4d94-ba16-6c622e0db428
https://publica.fraunhofer.de/entities/event/24e9f270-786b-4f4f-9048-b87927ed71cd
https://publica.fraunhofer.de/entities/mainwork/24ea18db-da76-4476-ae73-053a8d05b781
https://publica.fraunhofer.de/entities/publication/24ea28d4-b42b-4df6-9076-e916f339c69f
https://publica.fraunhofer.de/entities/publication/24ea4575-e8ff-4d9d-b76b-951a0f880dfe
https://publica.fraunhofer.de/entities/publication/24ea9bd3-2bc2-46a0-955c-5bc778ac5f18
https://publica.fraunhofer.de/entities/publication/24ead6ff-2cb2-4067-b8b9-3e88d0faed0e
https://publica.fraunhofer.de/entities/publication/24ead93f-b4e0-47c4-ad56-4cc09ae94dba
https://publica.fraunhofer.de/entities/event/24eb1198-a563-4163-8869-6e4d482114fb
https://publica.fraunhofer.de/entities/publication/24eb18be-b5ab-4cc0-b58c-f25921c2e971
https://publica.fraunhofer.de/entities/project/24eb211a-cbc7-4eb2-a74b-480bf65e0683
https://publica.fraunhofer.de/entities/patent/24eb258a-9728-4148-9a34-f774837c5704
https://publica.fraunhofer.de/entities/journal/24eb5326-981f-4b0c-bb92-67ac13454acf
https://publica.fraunhofer.de/entities/journal/24eb720b-1bd9-49ae-86de-9574a08a4a6d
https://publica.fraunhofer.de/entities/publication/24eb7a7d-d224-49a3-99cd-49c98f5e0b2d
https://publica.fraunhofer.de/entities/mainwork/24ebdc94-a71c-473b-bdd1-9f89ae312da4
https://publica.fraunhofer.de/entities/publication/24ebe30f-5c21-4cd5-9efe-2ceb30af99e0
https://publica.fraunhofer.de/entities/publication/24ebf0d6-bd9d-4df1-a7ce-df2880a83872
https://publica.fraunhofer.de/entities/publication/24ec3e54-6fdf-4fe5-9ea6-ab699bf7285c
https://publica.fraunhofer.de/entities/publication/24ec5186-f58b-4685-9fb3-af12d362ea43
https://publica.fraunhofer.de/entities/journal/24ec88dd-b360-4b15-8c92-08111425c8e2
https://publica.fraunhofer.de/entities/publication/24ecd428-078c-480a-8460-f70e3cb538fa
https://publica.fraunhofer.de/entities/publication/24ed022c-95ef-4850-a79b-6355de11be1c
https://publica.fraunhofer.de/entities/mainwork/24ed56eb-f70a-4264-ac26-123dc6536c62
https://publica.fraunhofer.de/entities/project/24ed6526-8936-4103-ac7f-2bac231c4ac3
https://publica.fraunhofer.de/entities/publication/24ed673f-a01e-4aa5-9280-56e70ab3257a
https://publica.fraunhofer.de/entities/mainwork/24ed9b6f-0458-4e45-ae6d-b235804fc4a1
https://publica.fraunhofer.de/entities/event/24ee1526-112f-4737-b405-0bca0281ba04
https://publica.fraunhofer.de/entities/mainwork/24ee1ad3-bcfc-4afe-bd68-d5f46fcba641
https://publica.fraunhofer.de/entities/publication/24ee23a0-657e-402e-983a-bb397021af5c
https://publica.fraunhofer.de/entities/event/24ee64b2-f9a2-4212-8080-179aca36a10a
https://publica.fraunhofer.de/entities/journal/24ee81af-417a-45e4-a3ec-29b4052e8973
https://publica.fraunhofer.de/entities/patent/24eeddbf-35f7-4385-a515-13cb5b48bb15
https://publica.fraunhofer.de/entities/publication/24eeeac3-c555-4f8d-9ad0-687314c34438
https://publica.fraunhofer.de/entities/publication/24ef6e98-30ae-42fe-9420-075cba1829af
https://publica.fraunhofer.de/entities/person/24ef7994-1e17-450e-878f-7b6f87d75849
https://publica.fraunhofer.de/entities/event/24ef90b7-4d59-41b9-bd9a-2a4d29712fac
https://publica.fraunhofer.de/entities/publication/24efb0c2-c9ca-4fbb-ac23-459e828a6899
https://publica.fraunhofer.de/entities/publication/24efb12f-0719-4479-998c-891e1973cea6
https://publica.fraunhofer.de/entities/publication/24efc036-58f6-43c7-a60f-f5423a94fb6b
https://publica.fraunhofer.de/entities/publication/24efd0f7-e02f-4d26-b859-851d4989a0fe
https://publica.fraunhofer.de/entities/publication/24efd76e-07f8-4ab4-af39-7ea8308e79a8
https://publica.fraunhofer.de/entities/publication/24f0649d-70f1-4266-b282-66577d3411e8
https://publica.fraunhofer.de/entities/publication/24f07312-7596-4bd8-a3f0-8b62cbb550c8
https://publica.fraunhofer.de/entities/mainwork/24f07b56-630d-4ce5-b34c-e606684f673e
https://publica.fraunhofer.de/entities/publication/24f0c053-9bfb-40a0-8a62-5d57462a3757
https://publica.fraunhofer.de/entities/orgunit/24f0ed56-6f98-41f8-82c1-09ef72fa07b6
https://publica.fraunhofer.de/entities/publication/24f11ddb-c473-468c-8611-91f5a94516f3
https://publica.fraunhofer.de/entities/publication/24f12669-39e8-4bfd-ba5b-b94b42bc2565
https://publica.fraunhofer.de/entities/publication/24f12b99-fd61-40ed-9fa7-32991bb4124c
https://publica.fraunhofer.de/entities/publication/24f167ae-8582-4af7-8f07-616cb5bfcfea
https://publica.fraunhofer.de/entities/publication/24f16a7b-9646-4ee5-96b1-a3fe2659dc12
https://publica.fraunhofer.de/entities/publication/24f16df1-daf3-4184-b63e-5534fd224133
https://publica.fraunhofer.de/entities/publication/24f19ecd-ac1d-4806-b9ab-fddd6d9df423
https://publica.fraunhofer.de/entities/mainwork/24f1d64f-1c1d-4513-b8d2-d72f04b4a7bd
https://publica.fraunhofer.de/entities/event/24f1e560-7fb3-412b-8246-bc6f5659687a
https://publica.fraunhofer.de/entities/publication/24f1f9d9-5581-4273-93ad-8f2c5cb65792
https://publica.fraunhofer.de/entities/publication/24f22d3d-6941-4c1a-9d83-170521a21887
https://publica.fraunhofer.de/entities/publication/24f23a40-ee17-4225-9623-3ad39cd5f53f
https://publica.fraunhofer.de/entities/publication/24f24229-4faf-4f32-94be-acdd04cfa3d1
https://publica.fraunhofer.de/entities/event/24f2500d-cf96-446b-b711-02c76791baff
https://publica.fraunhofer.de/entities/mainwork/24f2649e-d524-4879-9dae-cd39bd217f25
https://publica.fraunhofer.de/entities/publication/24f273bf-193f-4311-a6a4-34b13418b4c9
https://publica.fraunhofer.de/entities/publication/24f2a3eb-6b95-43e5-9e9a-e17f958291d6
https://publica.fraunhofer.de/entities/publication/24f2c1b0-817c-49dd-937e-8752111f1682
https://publica.fraunhofer.de/entities/publication/24f3114b-9407-4800-a7d7-c66c938b1e98
https://publica.fraunhofer.de/entities/publication/24f321ff-fd3e-41a8-b35d-5a870e253820
https://publica.fraunhofer.de/entities/publication/24f32295-3287-4aab-8254-b71aec125606
https://publica.fraunhofer.de/entities/event/24f34373-2a32-4742-bdeb-b13daa612388
https://publica.fraunhofer.de/entities/mainwork/24f34db7-078d-4d51-8afa-3fb78feea315
https://publica.fraunhofer.de/entities/publication/24f381fc-605e-4ee2-a6e4-1b0ed9296f9e
https://publica.fraunhofer.de/entities/publication/24f39135-64b4-4e07-9923-11378f1bc4e0
https://publica.fraunhofer.de/entities/mainwork/24f3a549-114b-4272-aa63-596020509659
https://publica.fraunhofer.de/entities/orgunit/24f430f2-4c88-47b5-8c94-6dcc4ebb8d02
https://publica.fraunhofer.de/entities/event/24f4702a-8886-4b15-a41b-d346c3dc76ad
https://publica.fraunhofer.de/entities/publication/24f4a21e-db3c-4519-9700-a3f102864fe3
https://publica.fraunhofer.de/entities/person/24f4be22-a8ad-4057-9c39-6fcc1c0b33ab
https://publica.fraunhofer.de/entities/event/24f4c17e-3e8d-4db7-8129-9b70dad01698
https://publica.fraunhofer.de/entities/project/24f50bea-7c62-4c3e-9183-e813da63bd68
https://publica.fraunhofer.de/entities/event/24f50e2c-097c-41df-9589-a7650cab7974
https://publica.fraunhofer.de/entities/publication/24f52c61-72ea-4d48-89fd-9e1ee075ab82
https://publica.fraunhofer.de/entities/publication/24f559fd-10fc-4ff0-84e8-7e6b5357dc92
https://publica.fraunhofer.de/entities/publication/24f58d84-feb2-4ac5-94b3-3cb49ec90e7f
https://publica.fraunhofer.de/entities/publication/24f5aef9-21af-46a6-9a5b-30daaa9e261f
https://publica.fraunhofer.de/entities/event/24f5d38b-a840-4543-808c-f81e25f036a8
https://publica.fraunhofer.de/entities/publication/24f60f2e-c45a-489e-8ad3-90631f4ac0f2
https://publica.fraunhofer.de/entities/publication/24f62338-bb35-4e7e-8d90-fd53a648b307
https://publica.fraunhofer.de/entities/orgunit/24f64cdd-7780-4a15-a3b1-3df508d74cc0
https://publica.fraunhofer.de/entities/publication/24f67390-157a-4beb-ae63-5d6d89fbcfeb
https://publica.fraunhofer.de/entities/mainwork/2583a9d1-6ecc-4115-af5a-3a3e0dd561f6
https://publica.fraunhofer.de/entities/publication/2583abb5-f2bb-48c7-a483-31078ca109e1
https://publica.fraunhofer.de/entities/publication/2583fefd-be36-4f0a-86e1-f97ae62402de
https://publica.fraunhofer.de/entities/publication/25841bb5-c458-4e5e-83ef-c04c975ceae4
https://publica.fraunhofer.de/entities/publication/25844f35-0f8e-4294-964f-ae083b887404
https://publica.fraunhofer.de/entities/event/258450e2-1d48-4397-a01c-635a3ca0e667
https://publica.fraunhofer.de/entities/publication/2584cb45-96ee-4329-bcac-a0ecdb795f29
https://publica.fraunhofer.de/entities/publication/2584fda0-7c04-4b01-8b2f-47fa072be7e9
https://publica.fraunhofer.de/entities/publication/2585014a-ef6c-4223-b8e8-559001abb0e2
https://publica.fraunhofer.de/entities/mainwork/25855e9e-5fa3-4d6c-874f-0d371f7fcbe8
https://publica.fraunhofer.de/entities/mainwork/25855fac-f560-457e-880b-c68e71abd009
https://publica.fraunhofer.de/entities/orgunit/2585a12a-bc72-475c-a975-fe31b44de28c
https://publica.fraunhofer.de/entities/publication/2585a41b-b950-44c5-bd48-84277a5d58cb
https://publica.fraunhofer.de/entities/publication/2585bd97-27c6-47c9-ab6f-b4103098adb5
https://publica.fraunhofer.de/entities/publication/2585c0d8-2876-4821-b556-be628d766f0a
https://publica.fraunhofer.de/entities/publication/2586286d-d8da-4546-8362-ca5ba726d2fb
https://publica.fraunhofer.de/entities/event/2586503e-5593-47ba-9ffa-0423b1bf1ed3
https://publica.fraunhofer.de/entities/publication/2586640a-6140-45a7-8f00-9d34d4bd6f6c
https://publica.fraunhofer.de/entities/publication/2586869b-1728-40ea-8cec-47beffc30387
https://publica.fraunhofer.de/entities/orgunit/2586d405-6999-4f11-9d47-3ab7f604878e
https://publica.fraunhofer.de/entities/event/2586ef90-6879-464e-a446-9fe944909e78
https://publica.fraunhofer.de/entities/publication/2586f557-ead4-42bd-aaa9-7cb539e472c0
https://publica.fraunhofer.de/entities/publication/2587286a-0c8e-45d1-b351-3fc9f2244d0a
https://publica.fraunhofer.de/entities/publication/258746d0-3e2b-415c-a662-21976f845e45
https://publica.fraunhofer.de/entities/publication/258747ea-8eb0-4f5c-9b72-1e13ce70a977
https://publica.fraunhofer.de/entities/publication/258795d9-050b-4b80-b1ff-8f74b29d19c5
https://publica.fraunhofer.de/entities/publication/2587d0fb-6745-460c-8bef-25ad50d3581b
https://publica.fraunhofer.de/entities/publication/2587d6b6-d83c-40cd-8830-301f58f1efc8
https://publica.fraunhofer.de/entities/mainwork/2587f5b7-b375-4bb5-b807-8e4e85136dc3
https://publica.fraunhofer.de/entities/publication/25882deb-7c17-4f0e-b6b7-8cdc078b4982
https://publica.fraunhofer.de/entities/publication/2588507f-2fab-4bdc-8cfa-1c7bd3be2c5a
https://publica.fraunhofer.de/entities/mainwork/258915a4-b6f7-447a-8483-1d927a3a3c69
https://publica.fraunhofer.de/entities/publication/25893683-68a7-4311-849e-b8c351c99221
https://publica.fraunhofer.de/entities/orgunit/2589991a-5fb2-4216-8eee-4274f441c8d8
https://publica.fraunhofer.de/entities/publication/2589e378-bac9-4378-930a-dfd6220fe7ab
https://publica.fraunhofer.de/entities/mainwork/2589eef6-53bb-4a93-b707-a7e4e97e4a6b
https://publica.fraunhofer.de/entities/event/258a52f9-6e84-4b78-a425-411402aa8d02
https://publica.fraunhofer.de/entities/publication/258a6194-3fa6-4e4e-a23b-f34103122960
https://publica.fraunhofer.de/entities/event/258ab6b6-b58f-4d4f-b6b3-ae4ceafebb91
https://publica.fraunhofer.de/entities/publication/258b07ce-9f24-441d-b735-72a5840fc483
https://publica.fraunhofer.de/entities/publication/258b1648-01b2-48ea-abf1-547328f05962
https://publica.fraunhofer.de/entities/publication/258b6a94-ed60-4d3b-bb01-f419776b26f4
https://publica.fraunhofer.de/entities/publication/258b6ce3-f7b4-433e-af32-83796bded0b8
https://publica.fraunhofer.de/entities/mainwork/258b7903-3817-49ce-a36f-0834dcf4cb2f
https://publica.fraunhofer.de/entities/publication/258c516b-d264-46ac-8c37-726451f47394
https://publica.fraunhofer.de/entities/patent/258c6775-c39e-4f10-828b-18132fd46d9b
https://publica.fraunhofer.de/entities/publication/258c9a45-0da4-44be-856f-13e3ae2064d8
https://publica.fraunhofer.de/entities/project/258cb0bc-9931-4807-abc0-97dba1491054
https://publica.fraunhofer.de/entities/publication/258cdd9d-f58d-45bb-97b1-7ede918465ee
https://publica.fraunhofer.de/entities/publication/258cdf9a-70a9-4938-8850-e86cddff572e
https://publica.fraunhofer.de/entities/publication/258d37ef-02d2-4e43-9cba-ad79d5bab13b
https://publica.fraunhofer.de/entities/event/258d5a58-28bf-4117-94d3-e297602ea5e3
https://publica.fraunhofer.de/entities/publication/258d77d7-f91f-4c1b-af76-43edc2bd8166
https://publica.fraunhofer.de/entities/publication/258e2d6f-bad9-4ac3-9731-ebedaac2563a
https://publica.fraunhofer.de/entities/publication/258e3f96-fddb-4fe3-a38c-b137dabf3dc8
https://publica.fraunhofer.de/entities/publication/258e7010-001a-4c69-99f3-96b288c8bfa0
https://publica.fraunhofer.de/entities/publication/258e7232-c1ca-4958-8ac5-a1064ebb00a8
https://publica.fraunhofer.de/entities/publication/258eaa29-63dd-4a51-a130-2f4a3ee4e580
https://publica.fraunhofer.de/entities/patent/258eba9e-2fef-47e6-9e01-fd7a06fb513e
https://publica.fraunhofer.de/entities/mainwork/258ed4b9-bff4-44b1-8edd-f428502e0251
https://publica.fraunhofer.de/entities/publication/258eef00-ec55-49d6-ba45-0e1311bf1b60
https://publica.fraunhofer.de/entities/publication/258f4d7c-a3da-48da-9160-1220671992e4
https://publica.fraunhofer.de/entities/publication/258f778d-10af-4a33-a6c4-7c0cda8ddb59
https://publica.fraunhofer.de/entities/publication/258fc340-7f15-4bcb-93f5-0e4a4b0ba47c
https://publica.fraunhofer.de/entities/publication/258fc514-87d1-4029-ace7-4e9dffc3032e
https://publica.fraunhofer.de/entities/publication/25900e7f-1927-4866-8912-6568ff93dfa0
https://publica.fraunhofer.de/entities/mainwork/2590373a-9f62-4b5e-b8da-f8e9ac5eadf2
https://publica.fraunhofer.de/entities/publication/25905fae-6c00-443e-8ea1-a7fa64149521
https://publica.fraunhofer.de/entities/publication/259067cf-c0ec-433e-b713-cbc2501e3994
https://publica.fraunhofer.de/entities/publication/2590c772-a6c8-496b-b95f-af1607ae871d
https://publica.fraunhofer.de/entities/event/2590e172-c95c-4afd-912c-c01b8a6589df
https://publica.fraunhofer.de/entities/publication/259117ef-726e-427b-9fe5-be25ec4b5af6
https://publica.fraunhofer.de/entities/journal/2591253c-0d3d-448c-8956-5ec0bb561a41
https://publica.fraunhofer.de/entities/publication/25913c30-e2a0-415d-b773-5712a4d74814
https://publica.fraunhofer.de/entities/patent/25914371-56a0-4f2b-b42d-d83d9e319949
https://publica.fraunhofer.de/entities/publication/2591740e-7c78-4411-b691-38296f818e70
https://publica.fraunhofer.de/entities/event/2591860f-27d5-4991-8b0f-4beccf4765ff
https://publica.fraunhofer.de/entities/publication/25918d3b-d540-4c5d-acb0-c8a601606e8d
https://publica.fraunhofer.de/entities/patent/2591adf3-94a6-4acf-926b-002f0f638598
https://publica.fraunhofer.de/entities/event/2591c978-a0e0-4bb5-bad8-0999fd1b0cea
https://publica.fraunhofer.de/entities/mainwork/2591f8f6-b748-4d8d-926a-e1174e73f5e0
https://publica.fraunhofer.de/entities/publication/2591fbed-1149-4c68-aed6-487e4893c7f5
https://publica.fraunhofer.de/entities/mainwork/25922864-662b-45fd-a74a-3236cdc43afb
https://publica.fraunhofer.de/entities/publication/25924ec3-6c3a-4ef5-b051-90a0370eb5ed
https://publica.fraunhofer.de/entities/publication/2592cada-18aa-4bff-b245-4239ece9fb38
https://publica.fraunhofer.de/entities/publication/2592cb94-61f1-4ae7-a767-f6a36b4e45f0
https://publica.fraunhofer.de/entities/journal/2592d858-afa7-4355-bcae-faf762076fac
https://publica.fraunhofer.de/entities/orgunit/2592de29-3f94-493a-bbfe-fd3df8c609ba
https://publica.fraunhofer.de/entities/mainwork/2592e2d6-9f91-474c-aec1-69914a87c957
https://publica.fraunhofer.de/entities/mainwork/25935867-2d57-42c3-a857-4b0fc1926c72
https://publica.fraunhofer.de/entities/publication/25937a11-4e3b-4a6e-a7a2-729deac1022c
https://publica.fraunhofer.de/entities/event/25939d19-2ff2-458c-8f70-b07e34a7fe21
https://publica.fraunhofer.de/entities/publication/2593b42c-32f2-4623-833c-421b542fb5b5
https://publica.fraunhofer.de/entities/publication/2593f321-d0d1-4701-bfcc-dc2e8bdafe44
https://publica.fraunhofer.de/entities/publication/2594037b-c641-4f85-b642-d417cc177426
https://publica.fraunhofer.de/entities/event/2594c719-abbf-4464-a518-f75bbf40de09
https://publica.fraunhofer.de/entities/mainwork/2594d617-7590-444c-9450-bb981b65d0d9
https://publica.fraunhofer.de/entities/publication/2594dcc0-cc21-4864-b059-9386bfe16aad
https://publica.fraunhofer.de/entities/publication/2594e3fe-9d73-44d2-a84c-672b6a635be1
https://publica.fraunhofer.de/entities/publication/2594eb1e-504e-4580-aaf6-cf92819c3a71
https://publica.fraunhofer.de/entities/publication/2594eeda-60f7-4b04-9498-d146b0d41c8b
https://publica.fraunhofer.de/entities/publication/2594f209-09b9-4e2a-bd8e-59d0044f3605
https://publica.fraunhofer.de/entities/publication/2594f999-ff32-4b7e-9d6f-8b8ad5dcfd4f
https://publica.fraunhofer.de/entities/person/25950531-a49c-44f8-ab71-c2d4e3733fd4
https://publica.fraunhofer.de/entities/publication/25951eb3-ed04-479b-bd26-e61967b89122
https://publica.fraunhofer.de/entities/publication/25954ffb-597f-42f2-ba79-616a8471e195
https://publica.fraunhofer.de/entities/publication/259557a2-7285-45c4-81a4-bf9dc3c44c17
https://publica.fraunhofer.de/entities/mainwork/25955d82-ba02-4533-89eb-1c2736fc1b7b
https://publica.fraunhofer.de/entities/publication/259571b0-ddce-4a44-8c1c-2a35509da29e
https://publica.fraunhofer.de/entities/publication/25958435-2890-4772-8038-8711c32c310f
https://publica.fraunhofer.de/entities/publication/25958794-6120-4d46-89b7-e2045def4a51
https://publica.fraunhofer.de/entities/publication/25958a6a-3b43-401d-a6f9-511d60afae5e
https://publica.fraunhofer.de/entities/publication/25958a8b-df28-4011-8d38-73ac07042c88
https://publica.fraunhofer.de/entities/event/25958f4b-77e9-47e6-b3f0-1a58922f9a63
https://publica.fraunhofer.de/entities/publication/2595b526-7dea-41ba-965a-15dc8b9a96d0
https://publica.fraunhofer.de/entities/event/2595c49b-39dc-4630-bced-42f02219715f
https://publica.fraunhofer.de/entities/event/2595e905-59be-4534-9f75-423de8c5ecfd
https://publica.fraunhofer.de/entities/publication/25967411-9ac9-4265-8265-6b194b9c6920
https://publica.fraunhofer.de/entities/event/259675b8-01a1-4658-b9be-dcee79e586f0
https://publica.fraunhofer.de/entities/mainwork/2596786c-4de4-4724-8eee-9a5075edd265
https://publica.fraunhofer.de/entities/mainwork/25969374-3d71-4181-867f-96ec4737d68f
https://publica.fraunhofer.de/entities/publication/2596afbd-a794-40d3-9e9d-aac0e459a966
https://publica.fraunhofer.de/entities/event/2596c2db-15b0-4676-aef1-a93dda63bf4c
https://publica.fraunhofer.de/entities/publication/2596f02b-f236-443a-8b80-bab579bb880c
https://publica.fraunhofer.de/entities/mainwork/25971063-e6db-4c75-98c6-19df1ec84f0b
https://publica.fraunhofer.de/entities/publication/25973bb6-70a3-4a9f-a4a3-2cd530104de4
https://publica.fraunhofer.de/entities/publication/25973fb2-02b2-49b2-b71a-727c213b1b73
https://publica.fraunhofer.de/entities/event/25978c28-b551-4afa-8151-b755327456c1
https://publica.fraunhofer.de/entities/publication/25979721-fb07-441b-b637-561c41fea3fb
https://publica.fraunhofer.de/entities/journal/2597c7b1-9033-4977-9ce1-2aa5772503e2
https://publica.fraunhofer.de/entities/publication/2598063b-97eb-4c09-b591-dfad944cbc89
https://publica.fraunhofer.de/entities/patent/2598648f-2e6d-47e7-a856-f0c0dc0a17de
https://publica.fraunhofer.de/entities/publication/2598a432-4266-4fc1-a03e-7038206cf07a
https://publica.fraunhofer.de/entities/publication/2598adbf-577c-4fa2-90dc-82ce45b78e41
https://publica.fraunhofer.de/entities/publication/2598af23-1508-4bc6-816e-a4b5a196e237
https://publica.fraunhofer.de/entities/publication/2598b059-ede8-4605-b202-b97840009c0f
https://publica.fraunhofer.de/entities/publication/2598e2c2-d572-4c9a-9a18-4c981d89c7fe
https://publica.fraunhofer.de/entities/publication/25992b34-c9f0-4830-a98c-673e5b47ab1e
https://publica.fraunhofer.de/entities/publication/25996361-2f85-487c-9b03-a92b5dabb493
https://publica.fraunhofer.de/entities/mainwork/259976e3-1c50-4d45-b643-08f30d48cdb4
https://publica.fraunhofer.de/entities/event/2599bbd3-2e7f-4cb8-ac25-e7ee21716e1c
https://publica.fraunhofer.de/entities/publication/2599dc04-2a76-4663-8ab1-5174327960b7
https://publica.fraunhofer.de/entities/publication/259a33e9-1b12-4203-81de-cdbd652d1026