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  4. Lock-In IR-Thermography - A Novel Tool for Material and Device Characterization
 
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2002
Journal Article
Title

Lock-In IR-Thermography - A Novel Tool for Material and Device Characterization

Abstract
A novel non-destructive and non-contacting technique for the spatially resolved detection of small leak-age currents in electronic devices and MOS materials is presented. Highly-sensitive lock-in infrared (IR-) thermography is used to localize leak-age current induced temperature variations down to 10 muK at a lateral resolution down to 5 mum. Leakage currents of about 1 mA can be localized within seconds and some muA may be detected after less than 1 h measurement.
Author(s)
Huth, S.
Breitenstein, O.
Huber, A.
Danz, D.
Lambert, U.
Altmann, F.
Journal
Diffusion and defect Data. B, Solid State Phenomena  
DOI
10.4028/www.scientific.net/SSP.82-84.741
Language
English
Fraunhofer-Institut für Werkstoffmechanik IWM  
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