https://publica.fraunhofer.de/entities/mainwork/ef040985-172f-4a10-aa96-147aec3001fa
https://publica.fraunhofer.de/entities/orgunit/ef0474e9-5c16-4e81-beb8-896af4cff9e5
https://publica.fraunhofer.de/entities/publication/ef0495dd-d0fa-4a4e-9be7-c2bd4bca589c
https://publica.fraunhofer.de/entities/mainwork/ef04a4f8-585a-4f71-b1f6-a538d8f206d3
https://publica.fraunhofer.de/entities/publication/ef04b676-5c39-4d9f-bf70-5bb350da2231
https://publica.fraunhofer.de/entities/publication/ef04cd30-bc39-4b2f-b773-a76d8d7780ff
https://publica.fraunhofer.de/entities/funding/ef04d0fa-5c9e-4c18-87c3-5a81628ac231
https://publica.fraunhofer.de/entities/mainwork/ef04f618-693e-421d-aeb8-d3fb0f1ba6eb
https://publica.fraunhofer.de/entities/publication/ef053199-c800-4850-9f6d-5e0837d688d6
https://publica.fraunhofer.de/entities/publication/ee25cc83-23c0-4d09-886d-1e4b72250dfd
https://publica.fraunhofer.de/entities/publication/ee263e3a-27c1-4497-93c9-ec3e7e47000a
https://publica.fraunhofer.de/entities/publication/ee268772-a0fd-49d6-b7a5-cf4c0213a02d
https://publica.fraunhofer.de/entities/event/ee269928-99ff-4eb4-ac50-656cd006f187
https://publica.fraunhofer.de/entities/mainwork/ee26a0e7-2adb-4193-af4d-910fac8eb587
https://publica.fraunhofer.de/entities/publication/ee26b451-7447-461a-83d3-86868d0fc629
https://publica.fraunhofer.de/entities/publication/ee26b70e-6839-4dd4-9ead-af9bb969db83
https://publica.fraunhofer.de/entities/event/ee26c155-8786-4903-aa26-3701f9af55e2
https://publica.fraunhofer.de/entities/publication/ee26f171-218b-4155-97dd-398b0deaf81b
https://publica.fraunhofer.de/entities/mainwork/ee272c54-8494-490b-a939-0f9397aa3a7b
https://publica.fraunhofer.de/entities/event/ee282ed4-257e-4862-a998-b40dfa629a30
https://publica.fraunhofer.de/entities/publication/ee288e93-91f9-4de7-b277-c5e1a01aa82c
https://publica.fraunhofer.de/entities/event/ee28b30a-e3d9-4350-b02a-afcb85ec18e5
https://publica.fraunhofer.de/entities/publication/ee28e7cb-cae1-455f-85f2-611165c2bfba
https://publica.fraunhofer.de/entities/publication/ee28edbf-6cba-4557-bca5-f7820c5870b0
https://publica.fraunhofer.de/entities/mainwork/ee28ff0a-453f-4d1e-8afc-c667b665e5c5
https://publica.fraunhofer.de/entities/publication/ee292e91-9b4f-4de8-b347-09c1bd2f210d
https://publica.fraunhofer.de/entities/publication/ee295270-9ce6-429b-ba31-fa4d3d19b6a5
https://publica.fraunhofer.de/entities/publication/ee296a48-779d-4b73-af30-8408ec1d5c3f
https://publica.fraunhofer.de/entities/publication/ee2981a2-dc98-4fc8-9d76-4137b56c433c
https://publica.fraunhofer.de/entities/publication/ee29a158-2fc0-4cbf-a7ba-23938da239c2
https://publica.fraunhofer.de/entities/publication/ee29ae41-bb6f-444d-a023-e3ddea5517ce
https://publica.fraunhofer.de/entities/publication/ee29cc69-25e5-4e64-b9f2-82a5f3772642
https://publica.fraunhofer.de/entities/event/ee2a13b0-b7c1-4584-b0ae-758349513d98
https://publica.fraunhofer.de/entities/event/ee2a3726-4a3a-4645-bf10-e241291a6a88
https://publica.fraunhofer.de/entities/publication/ee2a635a-b43c-4aad-ba43-f1bc8270d6d9
https://publica.fraunhofer.de/entities/publication/ee2a9905-013f-4a29-b592-4f9e9c53bc3a
https://publica.fraunhofer.de/entities/project/ee2ab324-7a55-45eb-bb46-5e2cbe8c489b
https://publica.fraunhofer.de/entities/publication/ee2ae550-5e0a-4448-8f5a-58a5035a036c
https://publica.fraunhofer.de/entities/publication/ee2b512c-b266-466d-851c-2cc957cb89c4
https://publica.fraunhofer.de/entities/publication/ee2ba009-ffea-476d-8e02-e07a34ccfa04
https://publica.fraunhofer.de/entities/event/ee2bb9a3-c6be-40a4-9f4e-91e9853bdd33
https://publica.fraunhofer.de/entities/publication/efd84666-4378-4ab3-84d6-76cd55113647
https://publica.fraunhofer.de/entities/event/efd859e8-f5dc-411e-8917-f8af6caa3c7a
https://publica.fraunhofer.de/entities/patent/efd889ed-663f-4f1a-a7f4-568ff2d89287
https://publica.fraunhofer.de/entities/publication/efd89e6c-a48a-45c2-a15e-897dde126278
https://publica.fraunhofer.de/entities/event/efd8a7e1-fe69-4bbc-ad10-265b2fbb262a
https://publica.fraunhofer.de/entities/publication/efd8b99f-71b0-4e5c-b556-b95140b65519
https://publica.fraunhofer.de/entities/publication/efd8e887-ada9-4041-b8bd-0d0615229519
https://publica.fraunhofer.de/entities/publication/efd93d79-7ac4-4de6-8969-8ae96e8af067
https://publica.fraunhofer.de/entities/publication/efd9d011-0b67-46c7-ba52-eca6b6fdaefd
https://publica.fraunhofer.de/entities/publication/efda0e42-e1dc-4fb9-8f50-11d6e6c4a4fe
https://publica.fraunhofer.de/entities/publication/efda29ea-938d-490c-904f-849e59ef3ceb
https://publica.fraunhofer.de/entities/publication/efda62f0-8dbc-4261-aa9e-2d437842ac71
https://publica.fraunhofer.de/entities/publication/efdaf28b-e36f-4127-a56b-29d2fe606842
https://publica.fraunhofer.de/entities/publication/efdaf437-5d0a-4c68-b3b9-47f46e5f36fa
https://publica.fraunhofer.de/entities/publication/efdb4470-98e8-4604-8535-e690985b745e
https://publica.fraunhofer.de/entities/project/efdb61e9-01bb-48cf-9423-8440c7ab0cef
https://publica.fraunhofer.de/entities/project/efdb6920-78d0-45c8-8456-1a386172af96
https://publica.fraunhofer.de/entities/publication/efdbbfab-6012-41f5-81a2-4e4e5c734f5a
https://publica.fraunhofer.de/entities/publication/efdbc8f2-f563-4a04-925a-c656c480dbbe
https://publica.fraunhofer.de/entities/event/efdc1a78-9483-4bee-b97e-7cdd2dbfb800
https://publica.fraunhofer.de/entities/publication/efdc459c-2a37-454a-a672-41bce142ccc3
https://publica.fraunhofer.de/entities/publication/efdc4757-987f-4c51-a66d-feb80ae0afc0
https://publica.fraunhofer.de/entities/mainwork/efdc4c8a-92f6-4f10-8f72-19fb8701ca65
https://publica.fraunhofer.de/entities/journal/efdc6123-94d5-441f-b532-f2ae92eedd41
https://publica.fraunhofer.de/entities/publication/efdc7b5b-ed29-4ca4-a85e-92eafc0479da
https://publica.fraunhofer.de/entities/publication/efdc8968-0da0-4b76-a2c5-6094255883a1
https://publica.fraunhofer.de/entities/publication/ee74b916-5598-46bf-add1-ee11868618bc
https://publica.fraunhofer.de/entities/publication/ee74d076-16ca-4e61-b612-43b09ca4c5ef
https://publica.fraunhofer.de/entities/project/ee74e7be-e68e-44af-9968-d448cdfba334
https://publica.fraunhofer.de/entities/patent/ee74fb20-b337-4d46-b8cf-9d60e8358443
https://publica.fraunhofer.de/entities/publication/ee7533c0-98f9-4d2c-a10f-4153ad38d114
https://publica.fraunhofer.de/entities/publication/ee7546df-4e83-41df-ac76-f4c4121ab6b1
https://publica.fraunhofer.de/entities/publication/ee755d92-8059-42ca-a3ba-c30a4d7d3c89
https://publica.fraunhofer.de/entities/event/ee757574-8dee-4f3a-8e29-b2eda705f2dc
https://publica.fraunhofer.de/entities/publication/ee75e7ae-a0fb-4689-8335-a0e0acfd4f5f
https://publica.fraunhofer.de/entities/publication/ee7642c0-1b82-438c-a373-0430e40d69f5
https://publica.fraunhofer.de/entities/publication/ee766e6f-d7f8-448f-b411-857c79959423
https://publica.fraunhofer.de/entities/publication/ee7678aa-1062-41fe-aa04-aeaba09e42b0
https://publica.fraunhofer.de/entities/publication/ee768d7a-eefc-47f2-8501-068ac9ed98a0
https://publica.fraunhofer.de/entities/publication/ee76a612-e278-41cc-a4d4-c729e597a505
https://publica.fraunhofer.de/entities/mainwork/ee76ab1d-393d-4b50-8f00-71189949fbe6
https://publica.fraunhofer.de/entities/publication/ee76eb46-f9a0-4321-a3e4-ac1030e42035
https://publica.fraunhofer.de/entities/journal/ee76fe1e-f6a0-4cf9-8273-c1a73ffd5020
https://publica.fraunhofer.de/entities/publication/ee770ff2-a1ae-4834-92f8-7a946d2b4b1c
https://publica.fraunhofer.de/entities/publication/ee7781e6-70a8-4923-9da3-e9d96bc6c18e
https://publica.fraunhofer.de/entities/mainwork/ee779cc2-db84-4b55-ab55-e187a1133956
https://publica.fraunhofer.de/entities/publication/ee77c5d5-63c9-40e1-aa81-b097e6304add
https://publica.fraunhofer.de/entities/event/ee781230-8c12-417f-b50c-dd8360ede51a
https://publica.fraunhofer.de/entities/event/ee781525-b078-4098-b53a-961d848712d6
https://publica.fraunhofer.de/entities/project/ee784fc2-d0ad-4e3c-ab8f-8f91f6783fd6
https://publica.fraunhofer.de/entities/publication/ee78a313-2ee0-42c0-a81e-ee64a8713d4b
https://publica.fraunhofer.de/entities/publication/ee78f7a7-984d-4e52-ab34-f0e87127e06c
https://publica.fraunhofer.de/entities/journal/ee794a59-7e6c-4e7c-a782-1851f030a417
https://publica.fraunhofer.de/entities/publication/ee797fb5-2a49-4515-a8c9-24028c5fe70e
https://publica.fraunhofer.de/entities/event/ee79c09b-ab44-4aef-8249-7a856a432a78
https://publica.fraunhofer.de/entities/mainwork/ee79ceaa-ede5-477b-9d8c-f4015a861e0a
https://publica.fraunhofer.de/entities/publication/ee79faa3-5605-4151-8ca8-f84aabb96dfb
https://publica.fraunhofer.de/entities/publication/ee7a71dd-810a-4d9a-950f-c399e379bce3
https://publica.fraunhofer.de/entities/publication/eebe0ab1-8513-4d9e-a39c-e548297f40b8
https://publica.fraunhofer.de/entities/event/eebe3475-55b7-4706-a3f2-4c343c9f0fc7
https://publica.fraunhofer.de/entities/publication/eebe41f7-6ea5-4202-a4ae-9d4f554ea607
https://publica.fraunhofer.de/entities/publication/eebe57b6-207e-404c-8df6-b669fcfcddf0
https://publica.fraunhofer.de/entities/event/eebeb3cd-bc59-4eaf-99fc-dd6760cdadd6
https://publica.fraunhofer.de/entities/publication/eebeb77b-011d-4fdd-b7e6-827731805ecf
https://publica.fraunhofer.de/entities/publication/eebeda19-df3b-4ede-be0c-39032691e80c
https://publica.fraunhofer.de/entities/publication/eebf3d5c-b684-4c0c-95a6-80787a40da82
https://publica.fraunhofer.de/entities/publication/eebf6101-d500-46cb-92b2-62ecba93f0c0
https://publica.fraunhofer.de/entities/publication/eebf66b5-6270-49cf-a1c5-ab5c76475803
https://publica.fraunhofer.de/entities/publication/eebfb45a-cf54-40d0-9ae2-35baa9bed63d
https://publica.fraunhofer.de/entities/publication/eebfc0a3-231a-4ef9-b577-87e7e6cbab1a
https://publica.fraunhofer.de/entities/publication/eec008c4-fe15-4940-943a-220ea375cc2f
https://publica.fraunhofer.de/entities/mainwork/eec04b68-c012-4a62-b1fc-e1b91a97ef13
https://publica.fraunhofer.de/entities/patent/eec04f24-b679-430a-865e-668ca10e6bbe
https://publica.fraunhofer.de/entities/publication/eec0c9b5-d404-4ce0-90af-61a039a76d70
https://publica.fraunhofer.de/entities/publication/eec0d701-1130-4e72-aad8-c9c2dde41b43
https://publica.fraunhofer.de/entities/event/eec0e98c-faa2-4514-8097-2260489fe6eb
https://publica.fraunhofer.de/entities/mainwork/eec0fd03-9ac7-47ca-b265-96e225045593
https://publica.fraunhofer.de/entities/publication/eec1202d-54c8-488a-a661-6e8cb35f8e18
https://publica.fraunhofer.de/entities/publication/eec126f3-b8dc-4db9-a3b6-83e2f64fd809
https://publica.fraunhofer.de/entities/publication/eec12e4e-31da-4be6-8979-badd7f4357aa
https://publica.fraunhofer.de/entities/mainwork/eec13a68-bf3a-450a-91c0-0bf4a9d9bd05
https://publica.fraunhofer.de/entities/project/eec15e05-5a44-44ed-9582-0fc69c6ae383
https://publica.fraunhofer.de/entities/project/eec16122-20d2-442d-a6c8-a46a8a71cb9d
https://publica.fraunhofer.de/entities/publication/eec1a437-7978-4f82-bbde-ab9830b28dd4
https://publica.fraunhofer.de/entities/publication/eec1b54a-a0bf-45d3-a075-6297d221f328
https://publica.fraunhofer.de/entities/publication/eec2205b-4742-456d-bc47-176818b37722
https://publica.fraunhofer.de/entities/publication/ef8ce858-45e1-4bd8-9018-5a199eaea5b0
https://publica.fraunhofer.de/entities/publication/ef8d1b23-09ba-4148-b279-2f41e2e9fdc1
https://publica.fraunhofer.de/entities/publication/ef8d50e6-3de8-4e6f-8bbc-aed7e75a27de
https://publica.fraunhofer.de/entities/patent/ef8d8f04-01b8-450e-8dbf-77f5b8cb0fd8
https://publica.fraunhofer.de/entities/publication/ef8d952f-e659-4568-a4df-c4c224d441be
https://publica.fraunhofer.de/entities/publication/ef8dc404-8404-4025-9d73-b29328067316
https://publica.fraunhofer.de/entities/publication/ef8dcebe-348b-4977-a9a3-c125ea7f6f5e
https://publica.fraunhofer.de/entities/publication/ef8ddca9-2bdc-41e5-9629-2870f36af5cd
https://publica.fraunhofer.de/entities/publication/ef8df736-91a5-483c-9efc-1ae42b3007ab
https://publica.fraunhofer.de/entities/mainwork/ef8e0212-d52f-43be-a075-04c70d74a04c
https://publica.fraunhofer.de/entities/publication/ef8e198e-3969-4acc-bb29-44d6b1b5d97b
https://publica.fraunhofer.de/entities/publication/ef8e33f2-db27-4b6c-9851-5f65941589f6
https://publica.fraunhofer.de/entities/journal/ef8e514d-2ef8-4e74-93f1-bd3426c393b4
https://publica.fraunhofer.de/entities/publication/ef8e6817-d44b-48ce-ae84-235554b91af7
https://publica.fraunhofer.de/entities/person/ef8e74c0-36b1-48bc-8a5f-08660b0419ed
https://publica.fraunhofer.de/entities/event/ef8ef69d-bb69-4a23-b197-0b37184415f6
https://publica.fraunhofer.de/entities/publication/ef8f15bf-77ba-4053-9e0f-075b751f0e77
https://publica.fraunhofer.de/entities/publication/ef8f5e2f-53e6-4f39-a6b1-1a0b168b6fc4
https://publica.fraunhofer.de/entities/event/ef8f7a37-3469-4db9-9345-b6c0766c4759
https://publica.fraunhofer.de/entities/publication/ef8f8320-930d-4319-aec9-a98344c33e5c
https://publica.fraunhofer.de/entities/publication/ef8fc903-d4b8-4e39-a6ea-a318d6c9ffbf
https://publica.fraunhofer.de/entities/publication/ef8fd804-f9e0-4c6c-802d-bd6a9e16597c
https://publica.fraunhofer.de/entities/patent/ef9046d2-01d0-41dd-b28c-09ec8c009f06
https://publica.fraunhofer.de/entities/patent/ef907240-06d0-4f62-a64b-f16a1bf6d827
https://publica.fraunhofer.de/entities/publication/ef90c2b8-2f83-438a-9ae2-c73d493a4d76
https://publica.fraunhofer.de/entities/publication/f06ce1d5-ca25-4779-b1c8-65b57eff1db4
https://publica.fraunhofer.de/entities/publication/f06d1e55-cc97-4773-993c-e138d6689cc1
https://publica.fraunhofer.de/entities/publication/f06d231c-0c5b-4494-bcf7-57baac300311
https://publica.fraunhofer.de/entities/publication/f06d250d-5d96-4c78-a26b-cae88c9c70cf
https://publica.fraunhofer.de/entities/publication/f06d4ae6-1ed0-4270-a357-0b2951dcc0a0
https://publica.fraunhofer.de/entities/publication/f06d665e-1804-4ece-830d-2a48c0bbb292
https://publica.fraunhofer.de/entities/publication/f06d6b95-9a06-4a27-be3f-10e5f90cc35f
https://publica.fraunhofer.de/entities/orgunit/f06d6da9-b014-4f23-a12b-77e9fcc63c9d
https://publica.fraunhofer.de/entities/publication/f06d846a-cd75-4e6c-b092-cb960bae9175
https://publica.fraunhofer.de/entities/publication/f06d9c4f-0f99-423b-9883-889a649421f2
https://publica.fraunhofer.de/entities/publication/f06dd281-9aee-4ffb-816e-e143667b5928
https://publica.fraunhofer.de/entities/publication/f06df29d-7eb2-4c07-9302-3740357ba3b9
https://publica.fraunhofer.de/entities/publication/f06dfdca-2c5e-429b-8f51-773e4799f51f
https://publica.fraunhofer.de/entities/person/f06e03c5-1df3-4866-bca1-0aa6e363f862
https://publica.fraunhofer.de/entities/publication/f06e1163-f8c0-4219-8195-98b5c7a58024
https://publica.fraunhofer.de/entities/orgunit/f06e1879-8ca1-4e4d-8b7d-09f13b060276
https://publica.fraunhofer.de/entities/event/f06e51f3-97c6-4606-9a14-a6878b310496
https://publica.fraunhofer.de/entities/publication/f06e9615-b53b-4888-8abf-8577559e7559
https://publica.fraunhofer.de/entities/mainwork/f06eed45-5646-430c-a123-62d4c757b66e
https://publica.fraunhofer.de/entities/event/f06eee4e-5196-4df5-86f2-519d7a1e01d3
https://publica.fraunhofer.de/entities/event/f06f18df-63cf-47d7-8ebe-59fff64ec08f
https://publica.fraunhofer.de/entities/event/f06f3776-9fa7-4e69-8494-80db4a554ab2
https://publica.fraunhofer.de/entities/publication/f06f4b04-bca0-4aec-84f0-ff50369b3987
https://publica.fraunhofer.de/entities/mainwork/f06f4ba9-ece1-4068-9625-76a058ef1d72
https://publica.fraunhofer.de/entities/publication/f06f7012-64c6-4488-9afc-c4b0ed8274a8
https://publica.fraunhofer.de/entities/orgunit/f06f781f-bb54-4d63-9ca5-36cfd64427bf
https://publica.fraunhofer.de/entities/publication/f06fc26d-fc91-4d71-a878-fcb118bb1b9d
https://publica.fraunhofer.de/entities/publication/f06fc550-54ae-427a-b6d2-a8b77b927290
https://publica.fraunhofer.de/entities/publication/f06fcad9-70d9-459e-93cd-7ac6f537b056
https://publica.fraunhofer.de/entities/publication/f07014ef-49c4-4998-bda7-a914994dc745
https://publica.fraunhofer.de/entities/publication/f07035db-06e0-4a98-af9a-9af577d10a60
https://publica.fraunhofer.de/entities/publication/f070674e-7b8b-4159-aab9-27f06d0ec088
https://publica.fraunhofer.de/entities/patent/f0709646-6343-45d7-8fd7-fc36a74bd7d3
https://publica.fraunhofer.de/entities/publication/f070d6d2-86d2-45d1-bc03-314c6eff0cf9
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https://publica.fraunhofer.de/entities/project/f5007953-4226-4358-8c16-8be081939c8b
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https://publica.fraunhofer.de/entities/publication/f500d7d3-3a51-4e67-af2a-c4b88d285f82
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https://publica.fraunhofer.de/entities/mainwork/f502cdd4-1b92-4011-8c05-85e40e8aa6c4
https://publica.fraunhofer.de/entities/event/f502ec52-88ba-4fee-afce-7a67434da40c
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https://publica.fraunhofer.de/entities/publication/f50384b2-d70b-4110-84a6-2cfebfbfb4a1
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https://publica.fraunhofer.de/entities/journal/f5048901-066f-434d-b3e5-e436ddd2e6e6
https://publica.fraunhofer.de/entities/event/f504cef8-92ba-4884-8724-b43f80021dd6
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https://publica.fraunhofer.de/entities/publication/f5050214-d863-4153-9035-b82cc223c05d
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https://publica.fraunhofer.de/entities/publication/f506403b-f49c-434a-9f90-d132bf65d4aa
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https://publica.fraunhofer.de/entities/mainwork/f5072217-389b-421a-8a91-9911653de81d
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https://publica.fraunhofer.de/entities/publication/f5077ebd-e5ed-479b-b794-c416d75cd96a
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