English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Have you forgotten your password?
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Embedded die packages and modules for power electronics applications
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
2016
Conference Paper
Title
Embedded die packages and modules for power electronics applications
Author(s)
Boettcher, L.
Karaszkiewicz, S.
Manessis, D.
Ostmann, A.
Mainwork
12th International Conference and Exhibition on Device Packaging 2016
Conference
International Conference and Exhibition on Device Packaging (DPC) 2016
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
