https://publica.fraunhofer.de/entities/publication/e01b20df-27f5-4a4c-afa7-765d2da83c3d
https://publica.fraunhofer.de/entities/publication/e01b240f-54e1-4f54-b38b-6a47ee16d166
https://publica.fraunhofer.de/entities/publication/e01bd76a-8b72-4edd-929b-2622190369a8
https://publica.fraunhofer.de/entities/publication/e01c0d9d-13d2-42dd-845e-d70c8afd85c2
https://publica.fraunhofer.de/entities/publication/e01c20f5-f5e2-4cba-bc1a-5f8e51bb98a4
https://publica.fraunhofer.de/entities/publication/e01c2729-2baa-47ad-989b-89f57eabb373
https://publica.fraunhofer.de/entities/patent/e01c4452-4788-4764-bf60-97411fb28bde
https://publica.fraunhofer.de/entities/publication/e01c503d-4e8e-40ed-9fbc-9e35e4ec50b1
https://publica.fraunhofer.de/entities/publication/e01c75ce-960b-4782-97df-9bb29fd9dabd
https://publica.fraunhofer.de/entities/publication/e01ca9b9-58ab-4b6e-aa22-63e71b3f7fd7
https://publica.fraunhofer.de/entities/event/e01cf6aa-529f-4d35-b7b8-d58581302e24
https://publica.fraunhofer.de/entities/publication/e01d2d99-5490-45b7-8d15-27a64fc86510
https://publica.fraunhofer.de/entities/mainwork/e01d40cc-0101-481d-9abe-c39e2a58a02d
https://publica.fraunhofer.de/entities/publication/e01d45ea-0be5-4682-bc75-001001188c18
https://publica.fraunhofer.de/entities/publication/e01d8f07-7d71-44db-a89a-a92d5e213359
https://publica.fraunhofer.de/entities/publication/e01ddd1b-1004-4e16-bdd6-ef1282b58805
https://publica.fraunhofer.de/entities/event/e01de8fb-68e2-4fab-8918-e3ec37f6504f
https://publica.fraunhofer.de/entities/person/e01dfb62-d48d-4e54-8eef-a17c50a74e1d
https://publica.fraunhofer.de/entities/publication/e01e1df0-f58a-4abf-8726-b7097bc102d3
https://publica.fraunhofer.de/entities/publication/e01e80ab-7993-492e-a9d7-d3cd8071ae71
https://publica.fraunhofer.de/entities/publication/e01ec86c-5b04-49f9-886f-36ceeedf561e
https://publica.fraunhofer.de/entities/mainwork/e01ecc1e-47af-4768-b0e1-f1478bbbb1d6
https://publica.fraunhofer.de/entities/event/e01ef5f5-dab6-4d6f-a4f8-5c8504fa76b5
https://publica.fraunhofer.de/entities/publication/e01ef8eb-cc75-4404-a394-7555b9a438fc
https://publica.fraunhofer.de/entities/publication/e01f6e17-6441-4605-80de-3761c490d9aa
https://publica.fraunhofer.de/entities/event/e01fa3f6-d89b-4a85-b88d-20e660051636
https://publica.fraunhofer.de/entities/publication/e01fb682-8bf6-453f-a914-2cf41d6c007a
https://publica.fraunhofer.de/entities/publication/e01fcb7e-4c04-4dab-9a29-83856c2e941c
https://publica.fraunhofer.de/entities/event/e01fff8c-b8f4-4ece-bb0d-0d631e2272aa
https://publica.fraunhofer.de/entities/publication/e0201585-9c4e-480f-81bd-40082dc8967e
https://publica.fraunhofer.de/entities/orgunit/e02039a1-5b01-423e-95a3-1f0b00f28df2
https://publica.fraunhofer.de/entities/publication/e0203fd6-94cb-49b4-8f0f-e1040232f832
https://publica.fraunhofer.de/entities/publication/e0205bf4-6708-4aad-8676-388d265b7760
https://publica.fraunhofer.de/entities/publication/e020653e-1ff0-496d-9436-40bcddb8a0f2
https://publica.fraunhofer.de/entities/event/e0207204-91e8-4507-8252-805197a467ee
https://publica.fraunhofer.de/entities/publication/e02117ef-5eb1-4646-ba64-cdc0f4542414
https://publica.fraunhofer.de/entities/publication/e0212484-a2cd-42d8-86a5-24cffe73a012
https://publica.fraunhofer.de/entities/publication/e021a53a-530b-4556-a552-7415b108e1a3
https://publica.fraunhofer.de/entities/publication/e021ba98-7fca-45c6-a1ed-c9c7fc3cdf50
https://publica.fraunhofer.de/entities/publication/e021f0ae-7507-4536-a6ed-3da8ecc65ffd
https://publica.fraunhofer.de/entities/publication/e021f36b-877c-41ed-8e0c-ee89a821d4e1
https://publica.fraunhofer.de/entities/publication/e021f698-4f20-4367-9191-bce75c99e2e0
https://publica.fraunhofer.de/entities/event/e021fce0-4853-4ebc-a19a-a34bc1c4dd8f
https://publica.fraunhofer.de/entities/publication/e022012b-899b-4a09-9d99-b83af02ccccf
https://publica.fraunhofer.de/entities/mainwork/e02277d9-fab4-48e1-a506-31b30dc9cbb9
https://publica.fraunhofer.de/entities/publication/e0230b9e-50ad-4fe8-9bd4-e46dd983f408
https://publica.fraunhofer.de/entities/publication/e0231b14-a69a-403a-a9a0-7ae16930fce3
https://publica.fraunhofer.de/entities/publication/e023278c-6701-4a3c-b8cd-aed1625871fb
https://publica.fraunhofer.de/entities/publication/e0233970-bb4a-49c7-ae5e-e10133fb6656
https://publica.fraunhofer.de/entities/event/e02379ae-4c62-4a8a-be0b-41530917a81f
https://publica.fraunhofer.de/entities/mainwork/e023968a-1ff8-4fb8-b327-e3a012f11642
https://publica.fraunhofer.de/entities/publication/e02397ab-b1b6-4c37-8b24-858d37b3e1b9
https://publica.fraunhofer.de/entities/publication/e023b125-dbe2-475c-ba5a-2d19b7ef9cc1
https://publica.fraunhofer.de/entities/publication/e023dd35-be43-489c-9081-a61f8ad7e9cd
https://publica.fraunhofer.de/entities/publication/e0241afe-e8af-4654-81f5-877ca79a3ef5
https://publica.fraunhofer.de/entities/publication/e0242a1c-939a-4906-856b-f9684c3ed62e
https://publica.fraunhofer.de/entities/event/e0244ebf-d5b5-43e4-bc6c-82055c7d4d6f
https://publica.fraunhofer.de/entities/event/e0246155-609f-4c72-afae-63379bd03e99
https://publica.fraunhofer.de/entities/journal/e0248c94-f537-497a-aead-3b27bad2062f
https://publica.fraunhofer.de/entities/publication/e024a9a4-a07f-48a8-a555-1fa92cac0b28
https://publica.fraunhofer.de/entities/publication/e024b81c-a70b-49d7-a4e1-401975696580
https://publica.fraunhofer.de/entities/publication/e024c779-8eb4-4955-b7c3-2c68f71aef85
https://publica.fraunhofer.de/entities/publication/e024cc04-483e-4858-818e-e7b8a4d1ac86
https://publica.fraunhofer.de/entities/mainwork/e024f19e-5cec-42b7-b778-99b261e4a6d8
https://publica.fraunhofer.de/entities/publication/e025290b-194e-4f51-ba23-76b758fee145
https://publica.fraunhofer.de/entities/publication/e0252b27-57d7-4f63-bd5f-31e1df7b1480
https://publica.fraunhofer.de/entities/mainwork/e025655b-14e2-41f8-991b-dcd1f7119b03
https://publica.fraunhofer.de/entities/journal/e02572ce-7997-4d20-aff4-17f463795ee2
https://publica.fraunhofer.de/entities/publication/e02578e8-af55-42d3-92a1-7c3d59b5cdcc
https://publica.fraunhofer.de/entities/publication/e025aab0-e8e3-4115-bf94-d7e1bb971355
https://publica.fraunhofer.de/entities/publication/e025ddb0-2937-4f01-b3bf-b5019738e563
https://publica.fraunhofer.de/entities/mainwork/e025e349-fd11-45e0-8b04-c97f305cda82
https://publica.fraunhofer.de/entities/publication/e0261ac0-af07-469b-b209-a24e96310a9d
https://publica.fraunhofer.de/entities/publication/e02649f9-21db-4357-8adf-61b73a6eb477
https://publica.fraunhofer.de/entities/publication/e0265b26-7ba4-4e56-a4c6-294c0903d834
https://publica.fraunhofer.de/entities/event/e026817b-4ac4-46b9-926f-b96fdb700f69
https://publica.fraunhofer.de/entities/publication/e02681e2-f444-4970-8a5f-f120392ddf92
https://publica.fraunhofer.de/entities/publication/e026a9f0-fb61-4798-9f9d-5898ab92d6d0
https://publica.fraunhofer.de/entities/publication/e026b858-67ce-4cf5-bd47-7877a5d1cc44
https://publica.fraunhofer.de/entities/publication/e026bc5d-d404-473c-8148-5d5ee91d2d92
https://publica.fraunhofer.de/entities/project/e026ce16-ad36-43c2-8f16-468eb2a46941
https://publica.fraunhofer.de/entities/mainwork/e026f238-6ded-4c7a-b9b9-b75bb5f4bcdf
https://publica.fraunhofer.de/entities/publication/e026f393-0394-4815-a27e-b2878f2f322b
https://publica.fraunhofer.de/entities/mainwork/e027130f-db93-4932-9eed-b6aee974da48
https://publica.fraunhofer.de/entities/publication/e027b417-5da9-43ab-b8fd-25747f691831
https://publica.fraunhofer.de/entities/person/e027f7ca-0593-49b7-ac26-a0368115eb32
https://publica.fraunhofer.de/entities/publication/e02919a4-362b-4144-88ed-af6438a7fc39
https://publica.fraunhofer.de/entities/publication/e0292a69-83ac-4922-8699-beb54b383eeb
https://publica.fraunhofer.de/entities/publication/e0298714-df07-4312-b707-fcc3c236165c
https://publica.fraunhofer.de/entities/mainwork/e0299d6b-0ce9-409b-97ce-09746a493c37
https://publica.fraunhofer.de/entities/publication/e0299fa2-65b0-46d1-9973-ed0fa7378118
https://publica.fraunhofer.de/entities/project/e029ac4c-c85c-43e3-9c86-67a0cd8b43e4
https://publica.fraunhofer.de/entities/publication/e029f02a-0e1f-49d9-b349-dffa4ef265da
https://publica.fraunhofer.de/entities/publication/e029f4fb-9c44-47fc-b198-a00318a7501b
https://publica.fraunhofer.de/entities/mainwork/e029fbc2-c2e7-4e05-a562-9ad76319444e
https://publica.fraunhofer.de/entities/orgunit/e029fd32-032b-4a52-8f09-9ff91bc508e9
https://publica.fraunhofer.de/entities/mainwork/e02a01a9-28ce-4f18-8126-ebdc79df0ba9
https://publica.fraunhofer.de/entities/publication/e02a1434-f507-4d20-91ec-9766e6418677
https://publica.fraunhofer.de/entities/mainwork/e02a538a-f6d6-44c4-bea6-6f223d6d9634
https://publica.fraunhofer.de/entities/mainwork/e02a7172-8767-4772-9bec-cb35e6ae92e9
https://publica.fraunhofer.de/entities/orgunit/e02a7d23-486a-4b1a-b281-722160d21fc0
https://publica.fraunhofer.de/entities/event/e02a8bff-ff33-4ba7-8d96-6619c1e46581
https://publica.fraunhofer.de/entities/publication/e02a8c84-7ba0-42e0-8154-4086eefe0984
https://publica.fraunhofer.de/entities/publication/e02ae9f2-5bc1-4454-a426-38e9d5dcc2a9
https://publica.fraunhofer.de/entities/mainwork/e02b14b9-8772-4086-aef1-78aa5d9a8928
https://publica.fraunhofer.de/entities/publication/e02b16f8-7527-401e-b694-acaa5eadce1e
https://publica.fraunhofer.de/entities/publication/e02b3387-cf5c-49db-97c2-6ad75140e21d
https://publica.fraunhofer.de/entities/publication/e02b51c5-8c47-45f5-bb9d-b52b4e983b9e
https://publica.fraunhofer.de/entities/journal/e02b5983-4cc9-41ab-86c8-eeba7c1bfdb6
https://publica.fraunhofer.de/entities/publication/e02b6c4e-9e9e-4d22-9147-92404b9d9cb6
https://publica.fraunhofer.de/entities/event/e02b8db6-6da0-4905-b3da-efa84096f0d4
https://publica.fraunhofer.de/entities/mainwork/e02baf8a-ed1b-44c5-8091-6b06304d96ed
https://publica.fraunhofer.de/entities/publication/e02bdb52-7804-45fc-a99b-e37685ec2f4a
https://publica.fraunhofer.de/entities/orgunit/e02be279-5caf-4630-81e2-142dc2331cda
https://publica.fraunhofer.de/entities/publication/e02c7213-4394-403f-b802-32e7764add57
https://publica.fraunhofer.de/entities/publication/e02caf82-ad9e-457c-b24f-3f4721f85803
https://publica.fraunhofer.de/entities/project/e02ce558-a086-4a9e-9f45-bca6c1a71d01
https://publica.fraunhofer.de/entities/publication/e02d2b9f-dbb0-4eb3-985a-34b7a03fa641
https://publica.fraunhofer.de/entities/publication/e02d437c-e235-4f5a-b91c-5cb597433211
https://publica.fraunhofer.de/entities/publication/e02d8340-01f5-41f0-a3ff-993ca7c68a7d
https://publica.fraunhofer.de/entities/publication/e02da683-28f3-4672-a707-001dc2e6a485
https://publica.fraunhofer.de/entities/event/e02dacf4-5b66-4b0f-95f0-177ba26f1ca1
https://publica.fraunhofer.de/entities/publication/e02dad5f-8299-42cc-be76-39e4bc09612e
https://publica.fraunhofer.de/entities/publication/e02dba19-b5cc-4558-be3c-46fa31840c9e
https://publica.fraunhofer.de/entities/publication/e02dbe7e-126f-4347-afe2-c235ca7acbd8
https://publica.fraunhofer.de/entities/patent/e02dc939-dbbd-491d-bbd8-03d8796fc835
https://publica.fraunhofer.de/entities/event/e02df121-e463-4343-9c81-7fc7cc069821
https://publica.fraunhofer.de/entities/publication/e02e04cd-606e-4eba-9702-6d4540af923f
https://publica.fraunhofer.de/entities/mainwork/e02e1478-01ed-426a-8471-77a49c1fa391
https://publica.fraunhofer.de/entities/publication/e02e2a00-d390-4d6a-af73-129d2a35d8da
https://publica.fraunhofer.de/entities/publication/e02e303e-df94-42bf-afa1-eaed310500fe
https://publica.fraunhofer.de/entities/mainwork/e02ea2ae-e34f-4cd5-b1b9-da855100e7f7
https://publica.fraunhofer.de/entities/mainwork/e02eccf3-775b-44f5-96dc-d9569a52c1fa
https://publica.fraunhofer.de/entities/mainwork/e02f7af1-3d68-43f7-9375-60b53a49e719
https://publica.fraunhofer.de/entities/event/e02fa875-41a5-443a-a5bf-409781548735
https://publica.fraunhofer.de/entities/publication/e02fb36e-4589-4fa3-b591-926d6fe9242f
https://publica.fraunhofer.de/entities/publication/e02fb3c8-9ec4-4a2e-b361-dbff886530fa
https://publica.fraunhofer.de/entities/project/e030388e-be4b-453b-b4d8-76babe675fb7
https://publica.fraunhofer.de/entities/publication/e0306d47-b51c-43b3-96a2-a7f781dff802
https://publica.fraunhofer.de/entities/publication/e0309794-dfa3-4141-a5c7-f4d609c2252d
https://publica.fraunhofer.de/entities/publication/e030ffde-d771-42a6-b41a-82a28cef39b1
https://publica.fraunhofer.de/entities/publication/e0311496-f9ca-4e45-ad54-374b6af3454b
https://publica.fraunhofer.de/entities/publication/e031266a-764e-494c-ae1a-c18dfc0b1b68
https://publica.fraunhofer.de/entities/publication/e0313a15-a4e9-4d99-9121-1eb3edcb89b5
https://publica.fraunhofer.de/entities/publication/e0313c5c-15a4-4db5-a5dc-f00810d26c2c
https://publica.fraunhofer.de/entities/publication/e0315d3b-3aad-4f9d-9dd1-db2f975dccc4
https://publica.fraunhofer.de/entities/publication/e0318dde-e5ee-406c-89d8-c36367a7fc4c
https://publica.fraunhofer.de/entities/mainwork/e031bb5e-ae91-4c5e-a29b-ed4a0422e8ca
https://publica.fraunhofer.de/entities/publication/e031ce0d-4192-4291-97ef-0fef762648fb
https://publica.fraunhofer.de/entities/publication/e031ce90-4a63-4d44-8027-4c8689997917
https://publica.fraunhofer.de/entities/publication/e031d869-e096-40b0-9c6e-f03fc9ef60a6
https://publica.fraunhofer.de/entities/publication/e031fc50-f868-4768-b095-2531ecd05279
https://publica.fraunhofer.de/entities/publication/e0321daf-6de5-46c4-b271-c52c990cd2d5
https://publica.fraunhofer.de/entities/publication/e0323b7f-86f1-4981-add0-50e1424f7e3d
https://publica.fraunhofer.de/entities/publication/e032536b-9b65-4e95-8794-b234cbc3a030
https://publica.fraunhofer.de/entities/publication/e0326656-ffa0-444a-981d-4d6bfb352bf2
https://publica.fraunhofer.de/entities/mainwork/e03291aa-3215-4c26-88d8-921dc3b8b80d
https://publica.fraunhofer.de/entities/publication/e032de69-b729-491e-87ef-07f723dda2c4
https://publica.fraunhofer.de/entities/publication/e032f311-4426-46d9-af87-8d93fd5d3c06
https://publica.fraunhofer.de/entities/journal/e0332ef2-5e45-476d-b709-dd8e82d01247
https://publica.fraunhofer.de/entities/publication/e0336fb7-9b6c-4449-9d52-a975c0c0b14a
https://publica.fraunhofer.de/entities/patent/e0337374-1cda-4c2f-aac4-b34665b4388f
https://publica.fraunhofer.de/entities/publication/e033a6c4-7f97-48b2-a1a7-a0bf7e2ec080
https://publica.fraunhofer.de/entities/publication/e033d90d-8811-4336-b7a9-e146ac25d3c1
https://publica.fraunhofer.de/entities/publication/e033f351-2cb5-4738-bde3-71db40179bad
https://publica.fraunhofer.de/entities/event/e0340816-30da-4165-8d39-b916d8cf7051
https://publica.fraunhofer.de/entities/project/e0342efb-27a9-40d4-94f7-a50a8d96275c
https://publica.fraunhofer.de/entities/publication/e034ae88-f1ba-4480-a9a0-720071fbe372
https://publica.fraunhofer.de/entities/publication/e034eef1-f810-4b85-bc72-9429ef4c5cb2
https://publica.fraunhofer.de/entities/mainwork/e03500ea-b8ee-467a-a180-48ab7944cc31
https://publica.fraunhofer.de/entities/mainwork/e0356c45-33a8-4ec2-96d7-7ded5bea1b92
https://publica.fraunhofer.de/entities/publication/e0357914-b60d-4f40-ada6-d83b2411a3ab
https://publica.fraunhofer.de/entities/publication/e03590ac-410d-4f15-a1f1-dbfa53f47976
https://publica.fraunhofer.de/entities/publication/e0359130-c90f-4619-b86d-2eb59e49cbe7
https://publica.fraunhofer.de/entities/publication/e035ba93-6e35-46b1-991d-55fcf7c4c803
https://publica.fraunhofer.de/entities/mainwork/e035bd87-adc1-402e-9c20-db3bf3cb2622
https://publica.fraunhofer.de/entities/orgunit/e035d1d0-7ddc-4e6d-a937-5cef8460bad1
https://publica.fraunhofer.de/entities/mainwork/e0361e70-fc8f-4443-a89b-b2dc951c8a53
https://publica.fraunhofer.de/entities/publication/e03648ee-bfd6-42c8-9b47-1fab79b53de6
https://publica.fraunhofer.de/entities/publication/e036531b-3808-47f4-9e84-a16ed9490071
https://publica.fraunhofer.de/entities/publication/e036a17c-d8f3-42dc-a518-2ea0319e63eb
https://publica.fraunhofer.de/entities/publication/e036d5c3-6f1d-45ca-a265-7676662ff89c
https://publica.fraunhofer.de/entities/publication/e03783c2-c763-432f-ba6e-d3b8252cde50
https://publica.fraunhofer.de/entities/publication/e0379224-3692-4923-9c14-57c04d185973
https://publica.fraunhofer.de/entities/patent/e037befc-ee0c-40a2-a2c5-59aaa82102d9
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