https://publica.fraunhofer.de/entities/publication/a50229b8-cbfe-454f-8158-b3aba169af46
https://publica.fraunhofer.de/entities/publication/a3095baa-7d2d-4071-82f2-d7562434994e
https://publica.fraunhofer.de/entities/publication/a2cd9e90-a1fb-451f-86c3-e99ba1f76ddb
https://publica.fraunhofer.de/entities/publication/9847d8bc-20e9-42e1-9010-dc175ae75608
https://publica.fraunhofer.de/entities/publication/987e2f7f-b13e-4933-a293-4cbceb7b90ec
https://publica.fraunhofer.de/entities/publication/976f144f-2f14-4b95-a19c-30b2853e55e4
https://publica.fraunhofer.de/entities/publication/987407c6-eca9-4ff1-8a5f-cefee388335c
https://publica.fraunhofer.de/entities/publication/976bf917-df5c-43b3-a0f9-0e5c904184ec
https://publica.fraunhofer.de/entities/publication/98367dac-2abe-4dfc-a2d7-21ccc65343ad
https://publica.fraunhofer.de/entities/publication/986e2748-5a99-49ba-bd51-26e7db8140eb
https://publica.fraunhofer.de/entities/publication/984899f5-7460-4216-a46b-0ae774228963
https://publica.fraunhofer.de/entities/publication/989c4f92-f6bf-4786-8046-7fdf5f3735df
https://publica.fraunhofer.de/entities/publication/966d85bc-f94c-4098-8334-9a8383781a99
https://publica.fraunhofer.de/entities/publication/9674db80-fc4e-407e-b65d-0ac4c4b339de
https://publica.fraunhofer.de/entities/publication/8526c02d-aeb9-46ed-a94e-b1dd645f814a
https://publica.fraunhofer.de/entities/publication/733d7d2c-2fec-4f47-bbb1-48f61f83d2b8
https://publica.fraunhofer.de/entities/publication/969f3ecd-e2a9-435f-839d-b617f85950c2
https://publica.fraunhofer.de/entities/publication/849378f4-b374-4f3e-b277-0a1c5e3917e4
https://publica.fraunhofer.de/entities/publication/96711609-929e-4c71-bc69-18e942214718
https://publica.fraunhofer.de/entities/publication/97de3843-adee-4354-a386-8d14e605b805
https://publica.fraunhofer.de/entities/publication/8525fe2a-9e50-453e-91ae-d0a537cde0c1
https://publica.fraunhofer.de/entities/publication/73abec3b-9996-4d02-be83-dbf68a5f1933
https://publica.fraunhofer.de/entities/publication/72e4e051-ed25-426c-a5a8-51b584f5bfe2
https://publica.fraunhofer.de/entities/publication/72baaecd-d12a-4581-8511-f9d18a21e3c8
https://publica.fraunhofer.de/entities/publication/7383e5c3-f6c6-4846-b317-1cdd5e8a546b
https://publica.fraunhofer.de/entities/publication/72cc8350-651a-4125-be5a-2a26b5851274
https://publica.fraunhofer.de/entities/publication/72b9c612-5af1-49cd-88e5-b8276643cb56
https://publica.fraunhofer.de/entities/publication/72d517d0-6a9d-4acb-897d-c4abd19ab4fb
https://publica.fraunhofer.de/entities/publication/72c0fb38-7484-461b-a789-201a7805f05a
https://publica.fraunhofer.de/entities/publication/73b867f0-509b-481e-a248-bb3da8f5273d
https://publica.fraunhofer.de/entities/publication/6c17c246-cb3f-435f-83a3-4baad5de758d
https://publica.fraunhofer.de/entities/publication/6c386452-9045-42c5-abe7-786db0fc2c3b
https://publica.fraunhofer.de/entities/publication/6c245638-90b8-4c81-8b5b-6a7725a7033a
https://publica.fraunhofer.de/entities/publication/6bcbeb84-233e-45d7-a872-1e377561b0cf
https://publica.fraunhofer.de/entities/publication/6c0fe56e-3541-4714-83d5-047a4b9ef0ff
https://publica.fraunhofer.de/entities/publication/6c109e2a-de16-4db3-832d-048a3f492b16
https://publica.fraunhofer.de/entities/publication/6c3bee0e-07ae-4b5c-b0e6-a4edf8d17846
https://publica.fraunhofer.de/entities/publication/6bcc1a5a-04f1-471a-8ad9-701b79d99a57
https://publica.fraunhofer.de/entities/publication/6bcd1500-9536-4ead-a422-e4da99eb2e1c
https://publica.fraunhofer.de/entities/publication/7451418c-f63b-41b5-befc-37c4f8d992e1
https://publica.fraunhofer.de/entities/publication/7447ce83-5bf4-40d0-b284-7752d8320c77
https://publica.fraunhofer.de/entities/publication/744c8a6b-8002-4f90-a71b-fc6e08787d57
https://publica.fraunhofer.de/entities/publication/742ea588-dd54-48d5-b393-856a7ece1571
https://publica.fraunhofer.de/entities/publication/73d5b645-3d01-4daf-80e4-cdb3e78549e8
https://publica.fraunhofer.de/entities/publication/7428a9f2-d950-4753-a8cb-e32686b45e5d
https://publica.fraunhofer.de/entities/publication/7443e496-890b-4f5e-a275-26dac887e1d4
https://publica.fraunhofer.de/entities/publication/73fc75e3-6fd1-4dda-8cc5-d69477e7060c
https://publica.fraunhofer.de/entities/publication/7451f315-5a86-4445-a6a5-88487cd3151d
https://publica.fraunhofer.de/entities/publication/6d72b06c-fea4-43e2-91ad-6d60373db7ff
https://publica.fraunhofer.de/entities/publication/6d31c457-448a-4d29-85cc-a77292d22dcc
https://publica.fraunhofer.de/entities/publication/6d6dcff6-2ab8-4d28-8820-bf199c497378
https://publica.fraunhofer.de/entities/publication/6d11a9f0-7f5a-4576-8e68-a1d3158af222
https://publica.fraunhofer.de/entities/publication/6e0c3543-b7b9-4bbb-8351-4a13455c0aa3
https://publica.fraunhofer.de/entities/publication/6d55e107-018a-4987-a33b-223fa0b2e022
https://publica.fraunhofer.de/entities/publication/6dff63e5-8121-400d-a0f4-c9fd70433de3
https://publica.fraunhofer.de/entities/publication/6d7e1b5c-518f-4fd2-a8b5-c530732e6ef1
https://publica.fraunhofer.de/entities/publication/6d52193a-b6ff-4312-bc0f-37e411c14937
https://publica.fraunhofer.de/entities/publication/6f7a4b96-27fe-441c-bd8a-8db6f7de5f8a
https://publica.fraunhofer.de/entities/publication/703d7fca-ab8b-422f-9189-53821ab2ae4a
https://publica.fraunhofer.de/entities/publication/70410184-5731-4301-848b-224f69319f11
https://publica.fraunhofer.de/entities/publication/6f669b66-4ff5-4af7-89f5-e92824a522fc
https://publica.fraunhofer.de/entities/publication/70a6243a-60d4-40a7-8093-98b2254392ea
https://publica.fraunhofer.de/entities/publication/6f73e255-d45a-4818-8922-c5f043b0c6dc
https://publica.fraunhofer.de/entities/publication/6f6f45bb-3740-4d0b-a4c4-62532f5e5534
https://publica.fraunhofer.de/entities/publication/6f6a15b8-a702-4c53-b398-861f454ed39d
https://publica.fraunhofer.de/entities/publication/704f311b-bc6e-405f-9996-3b4583353bf4
https://publica.fraunhofer.de/entities/publication/704da940-9b09-4e8c-9269-dbb1950cb3f6
https://publica.fraunhofer.de/entities/publication/74fc86c7-88f8-4c4a-8e6d-ade785080a1d
https://publica.fraunhofer.de/entities/publication/76a8a5b1-a6c2-453a-8546-1fe9a5ec8544
https://publica.fraunhofer.de/entities/publication/782779b9-4b07-4d6a-8733-2dd453e663fc
https://publica.fraunhofer.de/entities/publication/7822020c-b91e-4820-8354-d1261650e75e
https://publica.fraunhofer.de/entities/publication/76a1dd8e-5544-41e6-a702-46ad9562bcfd
https://publica.fraunhofer.de/entities/publication/74dc5a3f-2d20-4e64-9cf3-a64d4ffdd987
https://publica.fraunhofer.de/entities/publication/74df999b-16d7-445e-8ded-cf40baaac5f1
https://publica.fraunhofer.de/entities/publication/782b7771-fbd5-47f6-a5b8-483d81498c4b
https://publica.fraunhofer.de/entities/publication/769a9daf-caad-41c1-9788-9ce35e0fe405
https://publica.fraunhofer.de/entities/publication/5d217e1d-9524-44de-afa3-002906629019
https://publica.fraunhofer.de/entities/publication/5d1dca1c-9dc4-4dca-9b2d-f32d265b3b06
https://publica.fraunhofer.de/entities/publication/5d29db6c-f666-4a8d-be55-24dd8cc59117
https://publica.fraunhofer.de/entities/publication/5d2a3dfe-cd27-412a-9c85-fda4e624965a
https://publica.fraunhofer.de/entities/publication/5d448652-33a2-4369-bacd-d1d873ca87e4
https://publica.fraunhofer.de/entities/publication/5b3a6387-b978-43ec-a01b-e0cec762531e
https://publica.fraunhofer.de/entities/publication/5d48c596-63b7-4f52-bc79-f3473626ef40
https://publica.fraunhofer.de/entities/publication/779d5260-d2b3-43a8-a63d-ed91841280fa
https://publica.fraunhofer.de/entities/publication/779a2fb4-3b17-4a50-befc-7e04c4c22b52
https://publica.fraunhofer.de/entities/publication/59ff2489-a4dd-4527-a851-bd02955ba389
https://publica.fraunhofer.de/entities/publication/5a642a53-b87b-424d-986e-b29103339d25
https://publica.fraunhofer.de/entities/publication/5a63406c-95d8-4e1d-ab02-dd10f12e5c75
https://publica.fraunhofer.de/entities/publication/59ea0e98-9d29-408e-9e7b-141811f16ad0
https://publica.fraunhofer.de/entities/publication/5a5a6b90-c36d-497f-834b-f881573712c8
https://publica.fraunhofer.de/entities/publication/5a62466d-dfff-4692-b602-4398e33bf7d6
https://publica.fraunhofer.de/entities/publication/5a0ae231-a7a9-42de-b53b-0ad52ebfb9ce
https://publica.fraunhofer.de/entities/publication/5a05b517-d9f7-4bc4-a014-f376077a778d
https://publica.fraunhofer.de/entities/publication/c59651e3-567a-4adb-9afd-bcd4f8589566
https://publica.fraunhofer.de/entities/publication/c577fa7f-e0ba-4c74-a937-c8592d20ca5d
https://publica.fraunhofer.de/entities/publication/c2f763b9-620e-4e15-93f3-786bfe730d3f
https://publica.fraunhofer.de/entities/publication/c5f7bd17-c6c7-4cbb-b117-838359e40dfa
https://publica.fraunhofer.de/entities/publication/c309a615-28b8-48dc-a5d8-b3127abcddf6
https://publica.fraunhofer.de/entities/publication/c3eec2fd-d0a8-44c0-90aa-68efbea816b6
https://publica.fraunhofer.de/entities/publication/c2eb43ef-6353-4df0-87b0-cc89e3876481
https://publica.fraunhofer.de/entities/publication/c5f4ca5b-804d-47cb-ba12-ba387ea0cb7c
https://publica.fraunhofer.de/entities/publication/c58858af-2ab7-4241-96d2-5089160e5428
https://publica.fraunhofer.de/entities/publication/c4f2f0e4-7a43-4ff7-affc-32b36b16c5fb
https://publica.fraunhofer.de/entities/publication/c4671192-8523-4b07-bddb-dabba8a527e4
https://publica.fraunhofer.de/entities/publication/c46bd14f-0c8a-438f-9970-1e9d46e01d8e
https://publica.fraunhofer.de/entities/publication/c4cdf748-8150-44f1-acba-cb22d0fc80d1
https://publica.fraunhofer.de/entities/publication/c4e33a10-0b9b-40ba-a38c-3211ea0ffe23
https://publica.fraunhofer.de/entities/publication/c639683f-0a76-4e2f-bd20-9cc71420c42d
https://publica.fraunhofer.de/entities/publication/c469b9ab-7d1c-4a78-a357-ae9cea3d8fe2
https://publica.fraunhofer.de/entities/publication/c484a97c-da5d-43ea-a52d-6a1e3303bad2
https://publica.fraunhofer.de/entities/publication/c5107e04-f90d-49a9-af07-e85813c5459f
https://publica.fraunhofer.de/entities/publication/c2b07763-ed24-4773-934a-76a10433e92b
https://publica.fraunhofer.de/entities/publication/c3cb8166-5ac5-41f4-9260-894a1476ba9f
https://publica.fraunhofer.de/entities/publication/c2cb78cb-fb04-4676-ba17-aad169e69203
https://publica.fraunhofer.de/entities/publication/c2c25aad-cd25-4dd4-8c19-84203238f50b
https://publica.fraunhofer.de/entities/publication/c1be5d89-224c-4d2b-8cdb-6e7a8c60a2d7
https://publica.fraunhofer.de/entities/publication/c3c41ceb-b82a-41cf-b0b1-f1ca223e091b
https://publica.fraunhofer.de/entities/publication/c3a5108b-64dd-4545-b203-8fcfac7a89b9
https://publica.fraunhofer.de/entities/publication/c1bc6802-d786-45d2-8b97-3d2937fed819
https://publica.fraunhofer.de/entities/publication/c3bb67e8-5e3b-4225-8342-bbc70023e151
https://publica.fraunhofer.de/entities/publication/d08645bc-5047-45ad-b19c-30da475f51c2
https://publica.fraunhofer.de/entities/publication/d0e3d187-20ce-4f32-8a0d-0835f8e37d2d
https://publica.fraunhofer.de/entities/publication/d0e68423-e781-4d32-919f-7a891429381e
https://publica.fraunhofer.de/entities/publication/d06dd473-9096-43cf-bcd9-315e4dc58e22
https://publica.fraunhofer.de/entities/publication/d061376c-b88d-4a29-b1eb-39e0d0e5660b
https://publica.fraunhofer.de/entities/publication/d0656988-2431-4f7e-8c3a-6949715b56e4
https://publica.fraunhofer.de/entities/publication/d0cd81d6-736b-4bb6-af2f-4542037654b7
https://publica.fraunhofer.de/entities/publication/d07b7377-ae9f-42c8-bdad-2b2acea5aa4e
https://publica.fraunhofer.de/entities/publication/d08d24ad-4989-4e47-b8f4-b18281d15003
https://publica.fraunhofer.de/entities/publication/c09737dd-6cb3-45af-8367-d6a14ed86669
https://publica.fraunhofer.de/entities/publication/c088fe1d-d49d-4d34-bdde-9e69faae5bc5
https://publica.fraunhofer.de/entities/publication/c071eced-e337-43ce-94ba-790e90ddfc1f
https://publica.fraunhofer.de/entities/publication/cec885db-deaf-4694-bc08-09dc2eeec808
https://publica.fraunhofer.de/entities/publication/c08915c9-2dec-44bd-98c0-a6d0ee8276fd
https://publica.fraunhofer.de/entities/publication/c082a2e1-5aee-4df9-8e94-6789654445a5
https://publica.fraunhofer.de/entities/publication/ceb50ae7-504b-4272-8f98-aefd7de3a3ca
https://publica.fraunhofer.de/entities/publication/c7de3033-f8f0-41d9-82f3-4f5d911666a3
https://publica.fraunhofer.de/entities/publication/ced5f416-6b0c-4360-815a-99142998c97d
https://publica.fraunhofer.de/entities/publication/6eaa2e73-ecb0-4aaf-b34c-a056249e16be
https://publica.fraunhofer.de/entities/publication/6ec74887-c2f8-4ff9-ac44-d3e6bdadd672
https://publica.fraunhofer.de/entities/publication/6ecc5cce-ad38-419b-84ea-4dbac86de87b
https://publica.fraunhofer.de/entities/publication/6d3d286c-1777-4de4-98c9-0aab701f6eaf
https://publica.fraunhofer.de/entities/publication/70bbd497-966a-4d13-9e05-730ce56b92ba
https://publica.fraunhofer.de/entities/publication/7070620d-953f-4063-b72f-e20754505ed8
https://publica.fraunhofer.de/entities/publication/6e382338-0674-46de-8ff4-0241f9eccad9
https://publica.fraunhofer.de/entities/publication/709a13e0-1656-483e-8aa1-0160213c667d
https://publica.fraunhofer.de/entities/publication/700c6d8f-8c95-489e-be1c-d59b3e070056
https://publica.fraunhofer.de/entities/publication/70815b78-622e-4928-9120-c1dfe8d35949
https://publica.fraunhofer.de/entities/publication/7603ea74-70c0-4946-bd5a-c7a90e533ffc
https://publica.fraunhofer.de/entities/publication/730076da-6528-4226-906e-a48707e9dcdf
https://publica.fraunhofer.de/entities/publication/7604f173-2547-491f-8a1a-c369262dc10f
https://publica.fraunhofer.de/entities/publication/7306f38c-e2b4-4cb5-807f-9402ed171120
https://publica.fraunhofer.de/entities/publication/72f47be7-8a08-4421-9ec5-1efa247f00c7
https://publica.fraunhofer.de/entities/publication/7634cc0c-2251-4325-bab8-86972165705e
https://publica.fraunhofer.de/entities/publication/762069e2-173b-40a1-bca3-ee7c0f7ac726
https://publica.fraunhofer.de/entities/publication/760186a7-89e4-4cb3-8329-2f9404ce15b7
https://publica.fraunhofer.de/entities/publication/7308f6a1-cdba-499b-8149-3802caccc818
https://publica.fraunhofer.de/entities/publication/750f750a-90b6-4c09-898b-54efb4213b17
https://publica.fraunhofer.de/entities/publication/7646c9e8-252b-4793-b870-52f0560ed1c2
https://publica.fraunhofer.de/entities/publication/764d9110-12d9-466d-9ca8-dba7dcedbaa1
https://publica.fraunhofer.de/entities/publication/7507c271-229e-4637-a7c4-f55f00b43b71
https://publica.fraunhofer.de/entities/publication/7644d9e6-2a20-4cd7-a242-b98fc0bc31fd
https://publica.fraunhofer.de/entities/publication/766244a4-21cc-4150-935b-445e5f0c4049
https://publica.fraunhofer.de/entities/publication/766bc34d-bc8a-4bba-8212-1d7b3a41a611
https://publica.fraunhofer.de/entities/publication/766e54b0-64ff-47eb-951f-231a64d34b9c
https://publica.fraunhofer.de/entities/publication/765a2d68-9e70-456e-9959-f4590a51bcd3
https://publica.fraunhofer.de/entities/publication/5c7e4829-e418-44ad-bd58-bae0154fc523
https://publica.fraunhofer.de/entities/publication/5c5a6e95-d0ff-443c-91bc-51c068caf89f
https://publica.fraunhofer.de/entities/publication/5cf1ae94-e4d5-4d2f-8c11-685ef3415a98
https://publica.fraunhofer.de/entities/publication/5ce873e1-f010-4657-8f61-e1744d0fc08f
https://publica.fraunhofer.de/entities/publication/5cff12d8-2165-4d1b-a702-a1d1772bd4e9
https://publica.fraunhofer.de/entities/publication/5cf02115-3983-4516-ab41-b5c5ef757b9d
https://publica.fraunhofer.de/entities/publication/5d089d2a-8439-42d2-a5bf-53f0c92a0e49
https://publica.fraunhofer.de/entities/publication/5c6a895f-e101-4ca1-a81d-1bda15e4af93
https://publica.fraunhofer.de/entities/publication/5cef808a-5917-408f-9990-c7314e4f3f8d
https://publica.fraunhofer.de/entities/publication/4c63e051-9901-4972-9359-937703f688c5
https://publica.fraunhofer.de/entities/publication/3d1f7fd7-f706-4286-a86e-f6a1e325a7ce
https://publica.fraunhofer.de/entities/publication/45af3688-d364-4be2-a86a-6c130e4c3243
https://publica.fraunhofer.de/entities/publication/47081a58-2f9c-4a25-826e-bacfb98373cb
https://publica.fraunhofer.de/entities/publication/49e86616-d26e-406d-b9d7-8d5dd64ba576
https://publica.fraunhofer.de/entities/publication/3d22849f-0a7d-4df8-9747-541587acf970
https://publica.fraunhofer.de/entities/publication/4ac1e5f0-67d1-43bd-b8e7-595afb5034ad
https://publica.fraunhofer.de/entities/publication/4c622121-9d60-4fd5-8e12-9f974e9a56b5
https://publica.fraunhofer.de/entities/publication/4ac01fe6-b4de-4b32-afb9-816dda440836
https://publica.fraunhofer.de/entities/publication/c412d5d4-a736-4014-a715-b2decd85a617
https://publica.fraunhofer.de/entities/publication/bdcfb645-4b33-4314-961b-559f35cefe0c
https://publica.fraunhofer.de/entities/publication/bdbb57df-c00c-4017-9057-ff3e5d516ef0
https://publica.fraunhofer.de/entities/publication/bde265dd-7dbd-42fc-88f2-a79f7b3011ca
https://publica.fraunhofer.de/entities/publication/bdf12eef-7211-4d44-9bef-96c1787a1028
https://publica.fraunhofer.de/entities/publication/c559659e-d8e4-4b55-b1ff-4937355508cd
https://publica.fraunhofer.de/entities/publication/bde8cdfb-8783-41b8-9a60-dfadfdac0210
https://publica.fraunhofer.de/entities/publication/bdecf5ad-c27e-45b7-a6ea-f5eaf460b166
https://publica.fraunhofer.de/entities/publication/c53789b5-5cb7-4e9e-bfc0-4a64eb55f026
https://publica.fraunhofer.de/entities/publication/c37cb703-27ae-46fa-b61b-6eaf21efdef3
https://publica.fraunhofer.de/entities/publication/c38f8af9-ad9c-4813-a70c-f224e048ea6b
https://publica.fraunhofer.de/entities/publication/c38f0ec0-c631-4303-9521-1c87bc35e298
https://publica.fraunhofer.de/entities/publication/c28f96b0-a35d-4399-b82b-cc07b99dcd20
https://publica.fraunhofer.de/entities/publication/c1954fd1-74dd-4a43-ac44-b5764db8e1dd
https://publica.fraunhofer.de/entities/publication/c2ad8f0b-988c-4dbe-9740-5c5c00716a38
https://publica.fraunhofer.de/entities/publication/c2982d13-1c84-48a1-ab20-8e3e9c7bfb85
https://publica.fraunhofer.de/entities/publication/c3223368-7260-47f8-a3e5-dd07e573d4b0
https://publica.fraunhofer.de/entities/publication/c19dd3d4-b189-4823-ad59-5286f092b390
https://publica.fraunhofer.de/entities/publication/d29c72a6-a553-441c-8f3b-ba9d1253e5bc
https://publica.fraunhofer.de/entities/publication/d0f4064b-60ab-49d2-a13c-4576af54550d
https://publica.fraunhofer.de/entities/publication/d2b7dd7a-e471-425c-8e15-76b45553ada1
https://publica.fraunhofer.de/entities/publication/d14e719d-b9f2-497b-bb33-3d8338531e8c
https://publica.fraunhofer.de/entities/publication/d2b1dd17-d8b0-4eb2-91e5-867caaf9d986
https://publica.fraunhofer.de/entities/publication/d11fd180-aeb8-4af7-a8a2-31db94962b42
https://publica.fraunhofer.de/entities/publication/d14f6453-e021-477d-8cb6-bced470a352b
https://publica.fraunhofer.de/entities/publication/d145c955-b26d-4b78-ae29-bd8b0d532f18
https://publica.fraunhofer.de/entities/publication/d147d2ac-492c-4ea9-abd8-80695c222d02
https://publica.fraunhofer.de/entities/publication/d03d6fd6-1a8b-4c26-910b-c91930496a7d
https://publica.fraunhofer.de/entities/publication/d011f670-03d1-4701-90a9-80781fadc78d
https://publica.fraunhofer.de/entities/publication/d0050c9e-d08e-4dae-8204-a1c4a4a8d318
https://publica.fraunhofer.de/entities/publication/d03810d9-a512-4f3d-8ee3-7b37041ab4dc
https://publica.fraunhofer.de/entities/publication/d017fcfc-c669-4616-8263-7c62a5bce1ca
https://publica.fraunhofer.de/entities/publication/d02070b6-6131-46fd-9723-f01795ac0a82
https://publica.fraunhofer.de/entities/publication/d01035d3-3dc3-4480-9e62-e755f5ace442
https://publica.fraunhofer.de/entities/publication/cff9aba1-c528-4575-9e35-1cf2f607d383
https://publica.fraunhofer.de/entities/publication/d03473dc-56b5-4615-8a82-325b4cdf7ab8
https://publica.fraunhofer.de/entities/publication/bec77cba-04ff-4fdd-b47c-45d2a6027c8e
https://publica.fraunhofer.de/entities/publication/bf78b0e6-9c94-4859-897c-6bfa3bc75827
https://publica.fraunhofer.de/entities/publication/bed1e16a-b03d-4889-9cfa-fcf5d790ed2d
https://publica.fraunhofer.de/entities/publication/bf56a0f2-2abf-4dd9-87d3-6afeb8d1d50c
https://publica.fraunhofer.de/entities/publication/bf7d300d-244b-44bb-b1b4-59ebd21c40c1
https://publica.fraunhofer.de/entities/publication/dcc4361b-3f5f-4ba8-a97c-fc65e8643166
https://publica.fraunhofer.de/entities/publication/dde911b2-cdc2-43b3-94d9-a10dc0c00001
https://publica.fraunhofer.de/entities/publication/ddfd019d-9fb6-4deb-b8fe-9672598a7cd5
https://publica.fraunhofer.de/entities/publication/dd152ef2-875d-40bf-9d3a-dd966439c23a
https://publica.fraunhofer.de/entities/publication/dd306e47-f0f6-4b2d-982c-50a1e8141a2e
https://publica.fraunhofer.de/entities/publication/dcc63b97-b1ac-4059-b458-8af76899aa21
https://publica.fraunhofer.de/entities/publication/de110400-45b0-41a7-aa7e-77875fcfc185
https://publica.fraunhofer.de/entities/publication/dd38d6c8-3ef9-4e2a-a348-e131ab1b0267
https://publica.fraunhofer.de/entities/publication/de0c158d-6382-41a5-a86b-2174325a2d9b
https://publica.fraunhofer.de/entities/publication/dd47fc33-817a-4b16-a6e9-957faa7d525b
https://publica.fraunhofer.de/entities/publication/d76a6294-6785-4e67-9b09-c110c8e1565f
https://publica.fraunhofer.de/entities/publication/d73de23f-86f5-424c-a1f2-efcb41df3032
https://publica.fraunhofer.de/entities/publication/d7a2378d-6689-4955-8a24-57791318eac5
https://publica.fraunhofer.de/entities/publication/d73a5837-6d6a-4c62-b7b3-6deca7f59f0d
https://publica.fraunhofer.de/entities/publication/d79e476c-75c9-4ca9-9e5a-943259fbea26
https://publica.fraunhofer.de/entities/publication/d85fe5b3-495a-4b60-8a2a-77d145cb873d
https://publica.fraunhofer.de/entities/publication/d71eb908-f77c-446b-964d-40e2499409eb
https://publica.fraunhofer.de/entities/publication/d73c0321-5b5c-42bf-85e7-b94bbc295d0e
https://publica.fraunhofer.de/entities/publication/d76acb20-1855-45cb-815d-e1127ef8ba29
https://publica.fraunhofer.de/entities/publication/d49f7114-c811-4c2c-a005-2e3f57e27d8b
https://publica.fraunhofer.de/entities/publication/c7083358-2a84-4f65-a26a-1b206ef59fa0
https://publica.fraunhofer.de/entities/publication/d49ecc8c-a13d-4f7a-ab0d-7ea526b6139f
https://publica.fraunhofer.de/entities/publication/c64c2ac9-f148-4042-9f98-06385dcf2fdb
https://publica.fraunhofer.de/entities/publication/c7004693-f651-4189-9631-edef36ff6878
https://publica.fraunhofer.de/entities/publication/c6eb2d3b-4074-411a-8841-edde185ef6f7
https://publica.fraunhofer.de/entities/publication/c6f224f1-2081-4e40-af87-98ec6e7980ba
https://publica.fraunhofer.de/entities/publication/c64ad059-a7f2-420e-b323-f0a3cc0bc7e1
https://publica.fraunhofer.de/entities/publication/c6ebb2f8-cce6-402f-94dd-323cab3065e7
https://publica.fraunhofer.de/entities/publication/c760648c-2e6c-439a-9e10-2ff21955d340
https://publica.fraunhofer.de/entities/publication/c79d2abe-b69c-42ae-84f0-06f5a6dca085
https://publica.fraunhofer.de/entities/publication/c80d2cd2-86f2-4e3e-a622-c330465b0aa2