https://publica.fraunhofer.de/entities/event/279c4802-ea59-415b-9667-5a041f2d0def
https://publica.fraunhofer.de/entities/publication/279c7257-8282-4cab-97f1-93559450cb01
https://publica.fraunhofer.de/entities/publication/279c8110-1cf8-4bca-ab4d-03d27e05089c
https://publica.fraunhofer.de/entities/journal/279ca8a1-2597-4e67-a362-d82c13db5b44
https://publica.fraunhofer.de/entities/event/279d1efa-61aa-44d6-b734-b661dd5b5572
https://publica.fraunhofer.de/entities/event/279d20ff-491f-4560-9ea9-46eeb80e0a85
https://publica.fraunhofer.de/entities/journal/279d3755-aced-44ea-904d-82c2d370669f
https://publica.fraunhofer.de/entities/publication/279d3d58-9343-40df-8692-674692b8f026
https://publica.fraunhofer.de/entities/publication/279d7254-619d-40f1-9601-3a2d94473e04
https://publica.fraunhofer.de/entities/publication/279dc452-c4a7-46d0-b6ed-ab790e7c07e1
https://publica.fraunhofer.de/entities/event/279dd14b-289f-416c-ae0b-2ce8a2210aea
https://publica.fraunhofer.de/entities/publication/279e1df2-7cb9-4d08-ab78-372e330281a3
https://publica.fraunhofer.de/entities/publication/279e2c51-70cf-4863-807e-56803705120c
https://publica.fraunhofer.de/entities/orgunit/279e2fce-b1fb-4110-8318-1310932bfba0
https://publica.fraunhofer.de/entities/event/279e31f9-7892-46ed-8b07-2d49e0d02cbc
https://publica.fraunhofer.de/entities/event/279e64ed-c7f2-4b14-ac5f-2e22678ada08
https://publica.fraunhofer.de/entities/publication/279e75bb-395b-42da-a342-ee6e31471703
https://publica.fraunhofer.de/entities/event/279ee531-4191-48b7-9994-bc1aaab62ea7
https://publica.fraunhofer.de/entities/journal/279ee6f9-32b7-49a3-a613-553e47c7e4a6
https://publica.fraunhofer.de/entities/event/279f122b-913c-4c00-8743-e1ed84ed53fc
https://publica.fraunhofer.de/entities/publication/279f422e-3199-421a-9376-2292ceea48f8
https://publica.fraunhofer.de/entities/publication/279f79b5-88df-4a26-8076-beab22d4a7b1
https://publica.fraunhofer.de/entities/journal/279fab86-606b-49e7-baa9-a0e1c2ab744d
https://publica.fraunhofer.de/entities/mainwork/279fcfb3-c04c-41ff-ba53-220582506be9
https://publica.fraunhofer.de/entities/publication/279fd2dc-3e42-4c49-888f-e63353fc0625
https://publica.fraunhofer.de/entities/publication/279fe991-1344-4cb1-8b87-30612a22aa24
https://publica.fraunhofer.de/entities/publication/27a01034-d86b-469c-9c8e-445c3bc43663
https://publica.fraunhofer.de/entities/event/27a09d91-5c5a-444c-a850-b7c5772e0a0c
https://publica.fraunhofer.de/entities/mainwork/27a0b94e-c6af-459d-890f-97d41dd72b9c
https://publica.fraunhofer.de/entities/publication/27a0cb4a-1c99-4662-8f15-1aca61580f72
https://publica.fraunhofer.de/entities/publication/27a16b33-989c-40c8-b699-5147fcfa683b
https://publica.fraunhofer.de/entities/journal/27a16c4a-60c9-4225-8a75-f07f5994f0d8
https://publica.fraunhofer.de/entities/publication/27a1c278-f685-434a-9558-bb8a080d05fa
https://publica.fraunhofer.de/entities/publication/27a1c305-43c0-4efe-9fd4-3e3ae4160c9d
https://publica.fraunhofer.de/entities/publication/27a1dfe7-7fb4-43fa-a31a-a740bbf7d652
https://publica.fraunhofer.de/entities/event/27a1f558-0aad-473a-a72e-ead4661c670f
https://publica.fraunhofer.de/entities/event/27a21bf6-cbd3-4b15-b533-29991b304547
https://publica.fraunhofer.de/entities/publication/27a24dca-6f09-4910-83c5-7ed833dbb9ec
https://publica.fraunhofer.de/entities/mainwork/27a2e205-b62e-4bb5-8f88-8f1d795039bb
https://publica.fraunhofer.de/entities/publication/27a2f808-b082-47e7-ac00-f074a39eb369
https://publica.fraunhofer.de/entities/publication/27a3247f-d04a-4114-bdf1-d311a31a7c10
https://publica.fraunhofer.de/entities/publication/27a33062-382d-4dee-9f7e-bddd6bb7fe09
https://publica.fraunhofer.de/entities/publication/27a33a53-ae19-4b2d-880b-f2563bddd2a3
https://publica.fraunhofer.de/entities/publication/27a35b98-0e2f-464d-8df8-0d6889c6e2d3
https://publica.fraunhofer.de/entities/patent/27a36c83-f0d0-4494-9b85-91ae89890f44
https://publica.fraunhofer.de/entities/publication/27a37c5d-12c8-4b50-a44b-4478342c1a5e
https://publica.fraunhofer.de/entities/event/27a38eca-4e87-41e7-a62b-8a2471f0e7df
https://publica.fraunhofer.de/entities/publication/27a3a6f4-41fd-4320-8fa9-6d8796dcb0f5
https://publica.fraunhofer.de/entities/publication/27a41d9f-b940-45f4-a67c-22f95b3cc2f5
https://publica.fraunhofer.de/entities/publication/27a471fd-5eee-4921-8e64-b765c9983a63
https://publica.fraunhofer.de/entities/mainwork/27a4730e-bf8f-4d7e-ace4-a241ada2e460
https://publica.fraunhofer.de/entities/patent/27a477e8-48f6-40d6-8458-68eb1d439d78
https://publica.fraunhofer.de/entities/publication/27a48aab-e610-4201-8191-abf5772fdee4
https://publica.fraunhofer.de/entities/orgunit/27a49161-20e1-44e3-becc-b8818cf3e759
https://publica.fraunhofer.de/entities/publication/27a4bf62-5360-4b81-80bd-13c01b5e1799
https://publica.fraunhofer.de/entities/event/27a4d042-601d-4699-8e42-94a173a6109f
https://publica.fraunhofer.de/entities/publication/27a4dd88-6bb4-4192-b591-0eef757f4a72
https://publica.fraunhofer.de/entities/patent/27a4e02c-0e6c-4741-95c9-74f8997c661f
https://publica.fraunhofer.de/entities/orgunit/27a4f856-a687-4baa-8457-7cc0556e933b
https://publica.fraunhofer.de/entities/publication/27a4fce5-d70c-4a74-9805-745d95d8e74d
https://publica.fraunhofer.de/entities/publication/27a55242-d1d8-474c-8ef0-eb410fb6a81d
https://publica.fraunhofer.de/entities/publication/27a58d33-ec7e-4173-8717-20a51b428d3d
https://publica.fraunhofer.de/entities/publication/27a5b8b3-c9ae-460f-8e36-7777d442290b
https://publica.fraunhofer.de/entities/publication/27a5e90e-e74e-4f4c-b5ea-a7cc9df9cc9a
https://publica.fraunhofer.de/entities/patent/27a5f358-6404-41dd-8f15-641184420662
https://publica.fraunhofer.de/entities/mainwork/27a60e92-b1b5-45dc-a1a4-9467bef11efe
https://publica.fraunhofer.de/entities/journal/27a60eb4-1c14-473c-aec6-bcdca0260eae
https://publica.fraunhofer.de/entities/publication/27a61796-71ae-428d-9f8c-e7ff5192dc8f
https://publica.fraunhofer.de/entities/publication/27a66340-71f6-4cbb-bb8f-dabad8f75d4e
https://publica.fraunhofer.de/entities/mainwork/27a6a65d-20a4-4099-a5c2-e52e2b160b8e
https://publica.fraunhofer.de/entities/journal/27a7470a-f47e-422d-bbb9-69fc4002c143
https://publica.fraunhofer.de/entities/publication/27a74e35-1b6a-455d-b1c0-30da22c88079
https://publica.fraunhofer.de/entities/publication/27a75675-e1a4-4605-8c39-2f2aa6a175c7
https://publica.fraunhofer.de/entities/publication/27a77164-fedd-4d9b-81a7-865fe96d5e88
https://publica.fraunhofer.de/entities/orgunit/27a7b22d-2d28-404f-b897-83aa1ce933b3
https://publica.fraunhofer.de/entities/publication/27a7e865-dc17-4761-8101-3bdccb62b2bb
https://publica.fraunhofer.de/entities/publication/27a7fcc0-3388-472f-925b-144bf35ae820
https://publica.fraunhofer.de/entities/mainwork/27a826c4-27c0-4c2e-b04c-36d66973cec7
https://publica.fraunhofer.de/entities/event/27a83efc-06df-48d3-90e8-b808528f1631
https://publica.fraunhofer.de/entities/publication/27a85768-a527-44ba-9b48-70b777257250
https://publica.fraunhofer.de/entities/person/27a85da0-17bc-4abb-8f07-7c37db0a6374
https://publica.fraunhofer.de/entities/publication/27a86e0e-1f10-4f33-b351-df3e8d33a724
https://publica.fraunhofer.de/entities/patent/27a8c2cf-4d81-4a78-ab1e-7a8674be5609
https://publica.fraunhofer.de/entities/publication/27a91bc2-6f73-411c-adaf-9d167f071a27
https://publica.fraunhofer.de/entities/publication/27a92cc7-396e-4286-b479-fde258541f26
https://publica.fraunhofer.de/entities/publication/27a939ac-0f36-43bf-bea7-d29953f8b4f7
https://publica.fraunhofer.de/entities/patent/27a9597a-b41b-4709-b1b7-33ef77ba36b0
https://publica.fraunhofer.de/entities/publication/27a968ab-c1a7-4fdc-aff9-63c06e369692
https://publica.fraunhofer.de/entities/publication/27a98764-5280-4735-a7e6-12dbdbd39af4
https://publica.fraunhofer.de/entities/event/27a9d787-4ebb-44d7-bc30-aa3afba3d527
https://publica.fraunhofer.de/entities/publication/27a9f96a-e0ef-47bc-bc31-59c7cba0b39a
https://publica.fraunhofer.de/entities/mainwork/27aa0e72-4d01-4187-9063-459481b29a4c
https://publica.fraunhofer.de/entities/publication/27aa2daa-22d3-4e79-af09-c70f7cf86b45
https://publica.fraunhofer.de/entities/publication/27aa56ce-25be-464d-a882-cc2cee659747
https://publica.fraunhofer.de/entities/journal/27aa5eed-3d0d-4554-a08d-4b842fc08d1b
https://publica.fraunhofer.de/entities/publication/27aaa0eb-588f-415c-b873-0a623314a3ed
https://publica.fraunhofer.de/entities/event/27aad8d3-7de7-428a-bb3f-fda3f6cba0d8
https://publica.fraunhofer.de/entities/person/27aae984-7752-4f52-8eb1-401106d3e816
https://publica.fraunhofer.de/entities/event/27ab26ba-d9d5-4aa6-b811-d13eefdd7b87
https://publica.fraunhofer.de/entities/mainwork/27ab4a8b-e39c-450f-b5cf-60e86d485308
https://publica.fraunhofer.de/entities/event/27ab6771-54e5-462b-8b6c-a9302221d9fd
https://publica.fraunhofer.de/entities/mainwork/27ab6b37-0ba4-413b-be48-cfee8940bdcb
https://publica.fraunhofer.de/entities/event/27ab9f12-0333-4df0-bf4d-c8ecafab0b98
https://publica.fraunhofer.de/entities/publication/27abb3ee-4c07-48b0-abc8-c1f7dc81569e
https://publica.fraunhofer.de/entities/publication/27ac2b6f-8d24-4a3d-a3f1-d233c32fe43f
https://publica.fraunhofer.de/entities/mainwork/27ac68d5-44ad-41b0-b557-c999b2f77cd6
https://publica.fraunhofer.de/entities/publication/27ac9718-2575-486f-8f6a-9b9f29436033
https://publica.fraunhofer.de/entities/publication/272dbba7-3871-4490-985e-145963e3da10
https://publica.fraunhofer.de/entities/publication/272dbcf1-109f-4379-badf-7109d09be252
https://publica.fraunhofer.de/entities/journal/272dece2-d62a-4b5c-9ac9-c4b2c7af4b9e
https://publica.fraunhofer.de/entities/event/272df27d-6b5f-4332-93e4-f6441793ffe0
https://publica.fraunhofer.de/entities/publication/272e4d93-c174-456f-85bb-2bea03a28112
https://publica.fraunhofer.de/entities/publication/272e88f9-343a-45d9-a4c6-b32071aca4c1
https://publica.fraunhofer.de/entities/publication/272e8afc-1650-4ff1-9fb2-99131130dfcc
https://publica.fraunhofer.de/entities/mainwork/272e8dc0-50bd-4e8c-a776-d50a1da1be50
https://publica.fraunhofer.de/entities/publication/272e9900-4829-4e54-95bf-75ca2871a35f
https://publica.fraunhofer.de/entities/publication/272ea28b-78af-45c4-986e-622c8d911682
https://publica.fraunhofer.de/entities/mainwork/272eb44f-1bcc-4ce6-83c0-b973ea3ca676
https://publica.fraunhofer.de/entities/event/272ed024-30a7-4f00-af00-31e96a0bc7cc
https://publica.fraunhofer.de/entities/publication/272ef376-c19e-4f02-88a2-e2f4225caa13
https://publica.fraunhofer.de/entities/mainwork/272ef4d1-6120-43b9-803a-015d25eef385
https://publica.fraunhofer.de/entities/event/272f0d57-f6b7-4692-a091-6a2d39c0a2a1
https://publica.fraunhofer.de/entities/event/27300423-791c-4783-a602-95ac3aba4833
https://publica.fraunhofer.de/entities/event/273010e5-7e21-4c07-b62e-b08afe8bd267
https://publica.fraunhofer.de/entities/publication/273052b4-1ee5-4dd3-b63f-58539ba218ba
https://publica.fraunhofer.de/entities/publication/27305db7-8a12-46ed-ad54-776520c411c8
https://publica.fraunhofer.de/entities/publication/2730900c-e961-4260-b0eb-3af569a97911
https://publica.fraunhofer.de/entities/mainwork/273096ab-7199-46ab-8ec4-01e4460716a8
https://publica.fraunhofer.de/entities/mainwork/2730c132-d8d4-4b90-9a68-ff33721a1619
https://publica.fraunhofer.de/entities/publication/2730ef86-0f21-4ae0-b539-3ddb55fe6468
https://publica.fraunhofer.de/entities/mainwork/2731179d-a027-4533-9bc2-86f2cc63b4ff
https://publica.fraunhofer.de/entities/orgunit/27316468-d351-4abf-8389-a06b140e37af
https://publica.fraunhofer.de/entities/publication/27317821-54ad-4143-b001-05cfee25daa9
https://publica.fraunhofer.de/entities/event/273186a7-a3f9-44d0-9129-2b7756b20039
https://publica.fraunhofer.de/entities/event/2731a648-65ef-49cf-8387-c30a9fbb282a
https://publica.fraunhofer.de/entities/mainwork/2731b771-0e44-4daf-b0c9-ab46a02998b2
https://publica.fraunhofer.de/entities/event/2731daf3-33b7-4f31-ab72-3eb42ac033b9
https://publica.fraunhofer.de/entities/publication/2731f0c4-7782-46a3-a7ed-db3054c09485
https://publica.fraunhofer.de/entities/publication/2731fce4-5e8d-4d94-8c68-9e099710e5c4
https://publica.fraunhofer.de/entities/mainwork/27320d1f-6919-4fd4-b8e8-6f7899f14660
https://publica.fraunhofer.de/entities/mainwork/2732a139-e895-43ea-8f86-be49624c6c77
https://publica.fraunhofer.de/entities/publication/2733698e-686b-4588-b5a5-df9bf93be5c9
https://publica.fraunhofer.de/entities/publication/27342ad5-e7e0-4f58-ad24-822fea66d38f
https://publica.fraunhofer.de/entities/publication/273441fc-e2b3-41bb-b97f-e8bd0b9295bc
https://publica.fraunhofer.de/entities/journal/273456ad-a573-400a-b604-466096115c27
https://publica.fraunhofer.de/entities/event/27349cbd-252d-43c3-b619-581677b2ba5e
https://publica.fraunhofer.de/entities/publication/2734d405-3c7a-4c21-ba95-f04c0ebe5b4a
https://publica.fraunhofer.de/entities/mainwork/2735272a-21bd-47b8-b9f3-f45f0644abaf
https://publica.fraunhofer.de/entities/person/27353112-6072-4585-8bea-a4834fec0454
https://publica.fraunhofer.de/entities/event/2735520a-95bc-403a-b668-b02b2e0592e0
https://publica.fraunhofer.de/entities/mainwork/27357837-fc4b-4a58-96c9-2bcca47edb38
https://publica.fraunhofer.de/entities/publication/27358d18-f252-4404-a4bc-21ca0e1e9921
https://publica.fraunhofer.de/entities/publication/27358f0d-11e6-4c01-bbea-e464d73fd46a
https://publica.fraunhofer.de/entities/publication/2735fbd6-7237-4519-ac69-c7ed07bac37c
https://publica.fraunhofer.de/entities/publication/27369c07-3fe0-4e74-b147-865214bd440e
https://publica.fraunhofer.de/entities/publication/2736a058-d41b-4a73-9b72-3688861ba6cd
https://publica.fraunhofer.de/entities/publication/2736a2d1-356f-459e-9ce7-f9d72d9c5fd4
https://publica.fraunhofer.de/entities/publication/2736bd53-25cd-4cea-bedd-3e7685beb51f
https://publica.fraunhofer.de/entities/publication/2736deb9-43f6-416c-8ff0-1b4fbc85e357
https://publica.fraunhofer.de/entities/event/2736fe6c-d17d-46c0-8fa4-8672344d1a59
https://publica.fraunhofer.de/entities/mainwork/27370584-9d34-4879-8a41-9f5fa5fae574
https://publica.fraunhofer.de/entities/patent/27372140-e85e-4df6-ad93-25fcff368ccd
https://publica.fraunhofer.de/entities/mainwork/27372be2-0fd0-4da9-9d91-d4755c9c5537
https://publica.fraunhofer.de/entities/publication/2737360d-0c34-4e52-96bf-39fd8b5e35bc
https://publica.fraunhofer.de/entities/publication/27374daa-4fa4-48d2-8c98-8b7999fd3174
https://publica.fraunhofer.de/entities/publication/27375328-4326-4b2d-b779-27841c812706
https://publica.fraunhofer.de/entities/event/27377d09-89f1-4101-9e5e-eef94aecfb95
https://publica.fraunhofer.de/entities/publication/2737b26a-0687-48ba-9e6a-4d069e6f5872
https://publica.fraunhofer.de/entities/patent/2737b422-3fc2-46a4-9cb1-d115629fc18a
https://publica.fraunhofer.de/entities/publication/2737e940-d2e4-4d79-9ffe-a7097f3664ac
https://publica.fraunhofer.de/entities/patent/2737ed5f-4b59-4af5-a503-3c68842c8ff4
https://publica.fraunhofer.de/entities/publication/27388331-688e-497e-bd11-3cd4c6ce009d
https://publica.fraunhofer.de/entities/mainwork/2738cd65-cccf-4220-bc53-4251d8d420aa
https://publica.fraunhofer.de/entities/publication/2738ecce-22e9-4f5d-a972-c6a028791cb3
https://publica.fraunhofer.de/entities/publication/2739399a-a61a-41e5-b553-b89efa427db9
https://publica.fraunhofer.de/entities/mainwork/273942a1-6915-4e80-95a0-1eddbea41181
https://publica.fraunhofer.de/entities/publication/27396468-369b-424a-802a-dcc0bd9f8839
https://publica.fraunhofer.de/entities/publication/2739716d-b960-47ac-a9f6-baab30a3944a
https://publica.fraunhofer.de/entities/publication/27397bcd-bbd8-4792-b31a-4bb2956aab4b
https://publica.fraunhofer.de/entities/publication/2739859d-c299-4bb2-b8b6-bbef7c981445
https://publica.fraunhofer.de/entities/publication/273988a1-c3bb-477e-9758-97dc53246af9
https://publica.fraunhofer.de/entities/orgunit/2739894b-aa15-4b27-8f62-702a2b57b24c
https://publica.fraunhofer.de/entities/publication/2739b158-f8eb-4ce3-a7bb-0f32f1c1bd7c
https://publica.fraunhofer.de/entities/event/2739bcd0-f046-45b8-a9d6-60e7c336e7b8
https://publica.fraunhofer.de/entities/publication/273a3d35-c13a-4c4c-93df-52303776eca7
https://publica.fraunhofer.de/entities/person/273a949b-de49-4402-a850-cc4e15e357e0
https://publica.fraunhofer.de/entities/publication/273ab801-3912-410e-89bf-c7f55a035740
https://publica.fraunhofer.de/entities/publication/273abe19-a07f-4328-aaa0-db112c836641
https://publica.fraunhofer.de/entities/publication/273afc58-1183-4875-abfd-a8cd2a1b01a2
https://publica.fraunhofer.de/entities/event/273b3d2d-43f3-4ef5-95a0-2766652eced2
https://publica.fraunhofer.de/entities/publication/273b4d31-392d-4556-b9a5-8e9b5f40397f
https://publica.fraunhofer.de/entities/publication/273b5c35-fa48-47d1-b8e8-b1ef99127aec
https://publica.fraunhofer.de/entities/publication/273b5d35-5cae-4b0c-9075-5bce3994d8f1
https://publica.fraunhofer.de/entities/publication/273b6e0d-4cf3-4e1a-983b-95fce4c79b9b
https://publica.fraunhofer.de/entities/orgunit/273b736e-e6d4-4f3c-aa15-bf3b8f19fe9e
https://publica.fraunhofer.de/entities/publication/273b93d1-db7d-4f87-b47f-49f0b0da04e9
https://publica.fraunhofer.de/entities/mainwork/273be0be-6051-4619-a8d8-af687b893713
https://publica.fraunhofer.de/entities/event/273c3fd1-a59a-4d65-9087-c86be9c51f0e
https://publica.fraunhofer.de/entities/mainwork/273ca0ef-c9ea-40a0-aec8-629cab84709d
https://publica.fraunhofer.de/entities/event/273ca767-e694-494b-8516-e1517ed481c7
https://publica.fraunhofer.de/entities/orgunit/273cae13-8e77-4ae7-ac81-8aae29821c23
https://publica.fraunhofer.de/entities/publication/273cb73c-f0e9-4ad2-aea4-6f44be94161d
https://publica.fraunhofer.de/entities/publication/273cc5bf-d54d-4a09-be23-92a8334a04f5
https://publica.fraunhofer.de/entities/publication/273ce0d1-d0c5-413d-8240-49de8611c716
https://publica.fraunhofer.de/entities/publication/273d481f-073b-4ef8-b0c2-6c72c4b3f92c
https://publica.fraunhofer.de/entities/publication/273e2baa-769a-4468-ba68-e64ef507dff3
https://publica.fraunhofer.de/entities/publication/273e39aa-a748-423f-9b23-bff8a57c9a1d
https://publica.fraunhofer.de/entities/publication/273e5840-64ad-4b7d-a61e-04b90dd384fc
https://publica.fraunhofer.de/entities/publication/273e83d3-0e27-482d-bd5a-3d30c13c3e87
https://publica.fraunhofer.de/entities/publication/273ea20c-3b42-43ef-850c-b94a5fb10d0d
https://publica.fraunhofer.de/entities/publication/273eb67a-ebaa-4700-b4cc-d06b723dbf45
https://publica.fraunhofer.de/entities/publication/273ec015-e950-461a-826a-b1455c54baac
https://publica.fraunhofer.de/entities/publication/273eede3-b49d-46dc-a86e-5dfd53a46141
https://publica.fraunhofer.de/entities/publication/273f0cd9-3d44-4195-88e4-b894985e0aa7
https://publica.fraunhofer.de/entities/publication/273f26f7-c15e-4524-8629-d3b5e24fd3da
https://publica.fraunhofer.de/entities/publication/273f33d9-cf48-4df8-b06f-f7fd0a1d681e
https://publica.fraunhofer.de/entities/publication/273f90d1-417e-42e4-a36f-ae3167973d02
https://publica.fraunhofer.de/entities/publication/273fd5c7-fe67-41c1-be88-059e9cac2f11
https://publica.fraunhofer.de/entities/publication/273ffaa6-c4ff-4a8b-9de2-a7bd0bc6efb3
https://publica.fraunhofer.de/entities/patent/27404afd-f0c1-40b0-b8c3-0ca77da90839
https://publica.fraunhofer.de/entities/publication/27404de7-3fce-4d29-abfd-ad50e6b60b01
https://publica.fraunhofer.de/entities/publication/27405a67-2b63-420c-9ce7-9cffb6fe7cb4
https://publica.fraunhofer.de/entities/publication/2740b37f-2005-49e0-a08d-f1ce11826150
https://publica.fraunhofer.de/entities/publication/2740bcb9-1fdf-49bc-92c6-6121262a29d4
https://publica.fraunhofer.de/entities/mainwork/2740ccd6-a647-41e5-bd1f-72daf817e004
https://publica.fraunhofer.de/entities/event/2740d749-ad20-411b-a070-0a9fcc0ab894
https://publica.fraunhofer.de/entities/publication/2740e79d-87da-41b6-9e44-60fdd3bf4a76
https://publica.fraunhofer.de/entities/publication/2740f40a-4e77-43f3-a298-2055caab4974
https://publica.fraunhofer.de/entities/project/27410117-8d51-4e47-b358-2d4c621ca10d
https://publica.fraunhofer.de/entities/publication/27413e17-be9a-4d1e-b134-dcdd8a3570bd
https://publica.fraunhofer.de/entities/publication/2741547a-008e-4811-8895-4a6130eb11c2
https://publica.fraunhofer.de/entities/publication/27416470-739e-4a26-92fe-257ab90f1b0b
https://publica.fraunhofer.de/entities/journal/27422d6c-de84-4a03-9bc8-3fdf2f3ffb61
https://publica.fraunhofer.de/entities/publication/27425aa7-6e01-4fc2-9b96-1d9e28d50067
https://publica.fraunhofer.de/entities/publication/27426605-6440-46ab-8a18-9b078dbec278
https://publica.fraunhofer.de/entities/publication/2742799d-9110-421f-b6a5-53def0a9aa47
https://publica.fraunhofer.de/entities/publication/2742b4e4-bad9-4626-ae59-bb8e40c1fd77
https://publica.fraunhofer.de/entities/publication/2742cec5-dde6-4df7-97ea-3c62a291ec6c
https://publica.fraunhofer.de/entities/publication/2742d11e-d825-4778-b596-4c329c3b0990
https://publica.fraunhofer.de/entities/publication/2742f647-d5c8-41db-82ba-39cc5e76e782
https://publica.fraunhofer.de/entities/publication/27431590-fdac-4a11-82a3-26cbd96708e7
https://publica.fraunhofer.de/entities/publication/2743281d-ea4a-41ee-990c-1a3049a9dc64
https://publica.fraunhofer.de/entities/person/27433511-812a-44ae-99e9-02d8040de729
https://publica.fraunhofer.de/entities/publication/2743cc1b-5f2b-44ac-984c-020c9e9924ca
https://publica.fraunhofer.de/entities/mainwork/2743dc18-20bd-4ec6-bc6d-543dd80f5c71
https://publica.fraunhofer.de/entities/mainwork/27442a43-8c3b-4efd-8f94-f72d288a18f1
https://publica.fraunhofer.de/entities/event/27443bb4-47c4-41c8-b377-0ef2d2239755
https://publica.fraunhofer.de/entities/event/27443e14-0f2b-4acf-b1e8-97dfecb2159e
https://publica.fraunhofer.de/entities/publication/27447d12-c99c-48c3-b3d3-7b53bc59d66d
https://publica.fraunhofer.de/entities/mainwork/2744c152-96a8-4544-aae2-1a9f5c0f5fdf
https://publica.fraunhofer.de/entities/mainwork/2744c383-5075-4954-9a8c-43097878296b
https://publica.fraunhofer.de/entities/publication/2744e44f-0513-455b-a876-772c67555e06
https://publica.fraunhofer.de/entities/mainwork/274524fe-9c0f-420d-89a3-2d9fefc415aa
https://publica.fraunhofer.de/entities/publication/27454a24-98ce-4026-ada6-9ba5a4b39071
https://publica.fraunhofer.de/entities/publication/27456772-b3cf-4d9e-9e6c-31809e1642e6
https://publica.fraunhofer.de/entities/publication/2745776d-f32c-4e1e-a989-0cc1b58a5be1
https://publica.fraunhofer.de/entities/publication/2745c54b-d1b8-4ab7-8f21-94777aded8c9
https://publica.fraunhofer.de/entities/publication/2745d7b3-3dac-4328-a2e6-c742d383f405
https://publica.fraunhofer.de/entities/mainwork/2745e71d-51d6-4b34-95d1-74632b3ebdff
https://publica.fraunhofer.de/entities/publication/274633aa-a3e3-4733-9bbe-fb71772faa85
https://publica.fraunhofer.de/entities/publication/27464454-4d0e-473c-99ee-571dd6e397a0