https://publica.fraunhofer.de/entities/patent/4b4bd6fb-8ad7-4434-9d0e-7f00ab128f20
https://publica.fraunhofer.de/entities/publication/4b4c1308-d140-446c-84d2-22ee1cca6a76
https://publica.fraunhofer.de/entities/publication/4b4c378e-a220-43b6-823f-021b8cd26bc7
https://publica.fraunhofer.de/entities/event/4b4c3d30-93d9-42ec-ac27-8afcda4e0966
https://publica.fraunhofer.de/entities/publication/4b4c5c66-8614-4184-8dec-3d2cc3cf13a8
https://publica.fraunhofer.de/entities/mainwork/4b4c65f7-2335-4a49-8744-343371f981ed
https://publica.fraunhofer.de/entities/mainwork/4b4c79d1-44b5-4c0a-bc49-12c8d1c47557
https://publica.fraunhofer.de/entities/mainwork/4b4cb9bb-8cc8-45e5-b6e4-f91a427e2824
https://publica.fraunhofer.de/entities/orgunit/4b4cf60e-acbf-4d5b-a538-fb3222379b78
https://publica.fraunhofer.de/entities/publication/4b4d3448-d4b6-43b4-9d34-8008cfddfc67
https://publica.fraunhofer.de/entities/publication/4b4d3f3c-342a-48d7-9b27-63920f6d01da
https://publica.fraunhofer.de/entities/patent/4b4d4306-e31e-4fd4-89fa-5de5c568ec6f
https://publica.fraunhofer.de/entities/publication/4b4d569e-dff5-4b37-bd4e-6e220e9bdcfe
https://publica.fraunhofer.de/entities/publication/4b4da8a0-5d13-43c3-9e2a-86687b194db1
https://publica.fraunhofer.de/entities/publication/4b4da9aa-2097-4f75-9319-d3a96952385f
https://publica.fraunhofer.de/entities/event/4b4e1f2d-e9b6-49d4-887a-526c7fb33901
https://publica.fraunhofer.de/entities/publication/4b4e7441-e0f4-4a4c-893b-53c3ff7492ef
https://publica.fraunhofer.de/entities/event/4b4e88e7-ccf1-4809-bbe2-5f781ea1dbf6
https://publica.fraunhofer.de/entities/mainwork/4b4ebb82-68bf-4136-8f3d-6b3767e85e1c
https://publica.fraunhofer.de/entities/publication/4b4ec450-d5b5-4ebd-aa97-3d9b31fc67a3
https://publica.fraunhofer.de/entities/orgunit/4b4eeb99-5e3c-4c78-8e9a-f5a5f84a21d3
https://publica.fraunhofer.de/entities/publication/4b4f2d24-057c-4ec1-b702-c0745436fcae
https://publica.fraunhofer.de/entities/publication/4b4f302a-6515-4d69-a70b-eef51baaa361
https://publica.fraunhofer.de/entities/publication/4b4f3a8d-2184-4b32-a60f-c4e10657a6c3
https://publica.fraunhofer.de/entities/orgunit/4b4f5270-6ff4-4083-b9f7-fdb7642410d2
https://publica.fraunhofer.de/entities/publication/4b4f59fe-19ef-45d0-8708-5c85e50c4273
https://publica.fraunhofer.de/entities/publication/4b4f748d-a333-4f2b-888a-f1dd3e6ebff9
https://publica.fraunhofer.de/entities/publication/4b4f8ae3-8a0a-442d-9073-aa92ccb31051
https://publica.fraunhofer.de/entities/event/4b4f9038-969e-42d4-87b3-572058babe3c
https://publica.fraunhofer.de/entities/mainwork/4b4faf1d-a423-4c6e-a613-727713a5e0a1
https://publica.fraunhofer.de/entities/publication/4b4fc49b-9c71-4b38-a28e-c9fc8e8df974
https://publica.fraunhofer.de/entities/orgunit/4b4fdf83-1083-4a62-a255-eaf15324429e
https://publica.fraunhofer.de/entities/publication/4b50016e-b72a-4245-8b43-60180524b35d
https://publica.fraunhofer.de/entities/mainwork/4b505852-1592-4a9e-9bbc-fa59ccb257bc
https://publica.fraunhofer.de/entities/publication/4b506123-4a9d-4074-8dff-220bda87d559
https://publica.fraunhofer.de/entities/mainwork/4b50b010-9d77-4429-a346-2b931809d997
https://publica.fraunhofer.de/entities/publication/4b50b1f0-62d4-48d9-a282-df30dddcfe05
https://publica.fraunhofer.de/entities/funding/4b50dfa5-ba49-4ea4-98fb-5b9349ea2123
https://publica.fraunhofer.de/entities/mainwork/4b50e502-baf3-431b-80f7-2ede43333551
https://publica.fraunhofer.de/entities/publication/4b50fe24-e4ae-4800-9740-115b22b37d9f
https://publica.fraunhofer.de/entities/publication/4b516be0-85cf-4608-a914-f719d5b81bfa
https://publica.fraunhofer.de/entities/event/4b51aaf8-5234-4e33-91e2-2f7d85a3b8fe
https://publica.fraunhofer.de/entities/event/4b51c4e0-52c0-4a42-940c-435ee44d2cfa
https://publica.fraunhofer.de/entities/mainwork/4b51e14b-9cb8-45d8-9268-febb4b9601f6
https://publica.fraunhofer.de/entities/publication/4b5218ce-05d9-455f-bc3a-9ad531e48fea
https://publica.fraunhofer.de/entities/mainwork/4b524b4b-b013-472b-852c-226d3fc26536
https://publica.fraunhofer.de/entities/event/4b52684f-dd92-4a95-989d-ea633b129054
https://publica.fraunhofer.de/entities/publication/4b528c93-7b40-4954-8f8f-b8d7cc44c8b1
https://publica.fraunhofer.de/entities/publication/4b52a185-017d-4b49-9986-3c545f988ce3
https://publica.fraunhofer.de/entities/publication/4b52b1de-4a73-46d5-8621-846a72e1ea44
https://publica.fraunhofer.de/entities/publication/4b52c68c-e675-4c67-838c-1a216c71e5a3
https://publica.fraunhofer.de/entities/publication/4b52d163-1ddf-4ddc-8f32-78d4d13e4c19
https://publica.fraunhofer.de/entities/person/4b52ecbe-e786-469f-a63b-f749c1f07236
https://publica.fraunhofer.de/entities/event/4b531811-73e8-465e-a0e4-909dddef4c8a
https://publica.fraunhofer.de/entities/publication/4b531a24-3480-44d9-ae2e-736c79838f75
https://publica.fraunhofer.de/entities/project/4b531db1-9b55-4819-90ee-777baf3b5a81
https://publica.fraunhofer.de/entities/publication/4b53264d-8db0-4e71-939d-4a4569870a66
https://publica.fraunhofer.de/entities/publication/4b535324-bc1d-4107-822a-93f3a79eeffe
https://publica.fraunhofer.de/entities/publication/4b537269-312b-4302-b1f5-f4cf3b56de33
https://publica.fraunhofer.de/entities/publication/4b5374aa-60b8-4b35-990f-7a1409dc963d
https://publica.fraunhofer.de/entities/publication/4b5391e2-4f74-4b45-8e8c-3e4765fb48d5
https://publica.fraunhofer.de/entities/journal/4b53a5d2-da20-413f-8c0f-d0d45e5f3622
https://publica.fraunhofer.de/entities/publication/4b53ac8e-c5ba-483e-8720-603b7b0a71de
https://publica.fraunhofer.de/entities/event/4b53b77a-6618-4439-a73e-b6eb3ee766c3
https://publica.fraunhofer.de/entities/patent/4b54730a-7252-46cf-86ba-648525c6fb62
https://publica.fraunhofer.de/entities/person/4b548f7d-305f-43d0-a9f6-a2607a046664
https://publica.fraunhofer.de/entities/publication/4b54c596-1ae0-4f1e-9147-e1c194793516
https://publica.fraunhofer.de/entities/publication/4b54f11d-d68e-4578-8fc7-2ccad314f429
https://publica.fraunhofer.de/entities/project/4b554f7f-f376-4a6c-b304-14e06039dddf
https://publica.fraunhofer.de/entities/publication/4b5580b5-4090-46e6-932e-19b1cd13fa70
https://publica.fraunhofer.de/entities/event/4b55b661-c4cf-423c-9bd4-19cb5b9f8391
https://publica.fraunhofer.de/entities/publication/4b55b9ad-40a0-40b2-bad7-9416395835b8
https://publica.fraunhofer.de/entities/publication/4b55bd7a-b9d4-490e-8f13-c64d6cdb1775
https://publica.fraunhofer.de/entities/patent/4b55ce4f-2528-470d-a825-93864b12db2a
https://publica.fraunhofer.de/entities/publication/4b55ef8b-4df7-459f-a662-f7f5e3c3b257
https://publica.fraunhofer.de/entities/publication/4b55fd6a-aacd-4f3d-8fed-48302f74b9f5
https://publica.fraunhofer.de/entities/publication/4b563397-73a6-44b9-9677-4e47d499b1c3
https://publica.fraunhofer.de/entities/publication/4b56393b-5b8d-40c8-9d95-9a64d7ce5198
https://publica.fraunhofer.de/entities/event/4b564dfa-615c-4463-8670-60322a25d44d
https://publica.fraunhofer.de/entities/mainwork/4b566288-de1f-41d7-b22f-96a91d0b06db
https://publica.fraunhofer.de/entities/event/4b569002-2619-4e7f-825a-ccf9ac0e11da
https://publica.fraunhofer.de/entities/publication/4b569553-e3e5-44f3-a3f2-e6466be053c7
https://publica.fraunhofer.de/entities/publication/4a8af316-5fb6-4f20-9ac8-7cfed3cb3382
https://publica.fraunhofer.de/entities/publication/4a8b255b-9e30-420b-850a-b3031175a92b
https://publica.fraunhofer.de/entities/event/4a8b3c4f-5173-4274-bc00-c05c9d69a718
https://publica.fraunhofer.de/entities/publication/4a8b9f02-9157-4df2-87ea-dd87e03387f4
https://publica.fraunhofer.de/entities/publication/4a8be9e3-f1b3-4be3-b9c5-e85912db1f77
https://publica.fraunhofer.de/entities/publication/4a8bee73-fa23-4097-a9cd-57034d3146a6
https://publica.fraunhofer.de/entities/publication/4a8bf2ca-c619-4fdd-90a2-483a7a297a86
https://publica.fraunhofer.de/entities/publication/4a8c030d-9606-4481-a888-7cf63d344473
https://publica.fraunhofer.de/entities/event/4a8c3559-e8c3-4bff-8aed-ee2fc69ad84c
https://publica.fraunhofer.de/entities/publication/4a8c8f04-f768-4f32-81de-985eef7aed3f
https://publica.fraunhofer.de/entities/mainwork/4a8ca1d6-fb08-443b-a3bb-fc23f32525c8
https://publica.fraunhofer.de/entities/publication/4a8d4742-0274-44e4-a667-a9d97d90376d
https://publica.fraunhofer.de/entities/publication/4a8d4e9a-ccad-45aa-973f-f9fba1859f11
https://publica.fraunhofer.de/entities/publication/4a8d5e52-b43b-40ab-9011-eb621109b167
https://publica.fraunhofer.de/entities/publication/4a8d8a73-d46a-40e0-bd9c-d29cf18d1cc1
https://publica.fraunhofer.de/entities/mainwork/4a8dae61-f35f-4b29-b817-a582f3243cd5
https://publica.fraunhofer.de/entities/project/4a8dbd44-0bd6-471c-a352-23fccc462a89
https://publica.fraunhofer.de/entities/mainwork/4a8dfbdc-bf76-4a99-8d65-b351347c70e9
https://publica.fraunhofer.de/entities/mainwork/4a8e1c9e-3b77-4b8c-b3a3-d5d1bc6ae32d
https://publica.fraunhofer.de/entities/publication/4a8e1d46-29b9-4db0-ae13-8a96c98a2723
https://publica.fraunhofer.de/entities/publication/4a8e5121-03f0-43a9-91f7-c194917bc6a2
https://publica.fraunhofer.de/entities/event/4a8e562d-d300-40bf-8dd2-7fe78fbb61d2
https://publica.fraunhofer.de/entities/publication/4a8e5eff-e22f-4749-acac-3fdbe4368c66
https://publica.fraunhofer.de/entities/publication/4a8e70ee-4856-4f5a-9d5e-7bc39835f2ee
https://publica.fraunhofer.de/entities/publication/4a8ec7f8-4a34-4971-acb1-dbab76122368
https://publica.fraunhofer.de/entities/publication/4a8f1e4b-9dd2-4519-a7a4-ab7b5e209290
https://publica.fraunhofer.de/entities/publication/4a8f39ef-2ce1-4bbe-b5c5-268af447da0b
https://publica.fraunhofer.de/entities/project/4a8f3b19-335a-4f34-8d65-ebd66146c8d5
https://publica.fraunhofer.de/entities/publication/4a8f51c6-3afd-4e30-88c9-c836ab7851f0
https://publica.fraunhofer.de/entities/publication/4a8faf43-f5cc-4bb1-a7eb-e8591ab6d522
https://publica.fraunhofer.de/entities/publication/4a8fc132-4113-4517-9b23-fe1aea233eae
https://publica.fraunhofer.de/entities/publication/4a8fdc22-68fa-4be4-abf3-140279e19ab9
https://publica.fraunhofer.de/entities/publication/4a9001d8-cdfa-4a3a-9f4e-04b560c57bdb
https://publica.fraunhofer.de/entities/publication/4a902a01-70c9-42b5-8ca4-67d3d9b341f0
https://publica.fraunhofer.de/entities/mainwork/4a902f70-86b4-4406-b3a8-351bb7493354
https://publica.fraunhofer.de/entities/publication/4a904c87-ad44-4765-8d0c-93f1ff598362
https://publica.fraunhofer.de/entities/publication/4a90a1d9-ea1f-49ba-9760-1cc86fbffc83
https://publica.fraunhofer.de/entities/publication/4a90ba37-7c5b-463d-9086-e44a78a940b5
https://publica.fraunhofer.de/entities/mainwork/4a90d076-410a-44b5-9f19-8cdd83dd01e6
https://publica.fraunhofer.de/entities/mainwork/4a91077b-1fc7-462b-8388-e11df244e3f3
https://publica.fraunhofer.de/entities/event/4a914f14-2c81-437c-bd79-a9c315e28105
https://publica.fraunhofer.de/entities/patent/4a917fbd-9a09-47d0-8350-5b0c2860a151
https://publica.fraunhofer.de/entities/event/4a9193b3-581c-404f-b7b8-79149c032232
https://publica.fraunhofer.de/entities/event/4a91a217-b34b-4f85-8cf0-a2be23560d63
https://publica.fraunhofer.de/entities/event/4a91afb6-a3e5-4d0d-9ef4-bf5e650f3f04
https://publica.fraunhofer.de/entities/publication/4a91b840-608d-4a6b-b41d-4bcb48c74fc7
https://publica.fraunhofer.de/entities/publication/4a91ca67-6d13-4efd-aad3-d0c456e9c019
https://publica.fraunhofer.de/entities/patent/4a923484-8ddb-4d5f-9704-e183c3f299bb
https://publica.fraunhofer.de/entities/event/4a92a66d-332f-4015-b8de-c838ef0072f8
https://publica.fraunhofer.de/entities/publication/4a92d19f-4ac3-4a21-ab14-c2d10a35de21
https://publica.fraunhofer.de/entities/publication/4a92e638-4929-4e42-bc0d-0343809dccf4
https://publica.fraunhofer.de/entities/event/4a9310da-9db3-40a5-bc13-2f583528244d
https://publica.fraunhofer.de/entities/publication/4a9317fe-4929-4d71-8069-2bc1371c629e
https://publica.fraunhofer.de/entities/publication/4a931f81-5191-4ed7-8c46-273f6664ca3c
https://publica.fraunhofer.de/entities/funding/4a932ebf-6e6e-4b46-9aef-236cf97f816c
https://publica.fraunhofer.de/entities/publication/4a933215-fbf0-4c7d-9423-76712c97e924
https://publica.fraunhofer.de/entities/publication/4a933821-e75d-480b-a410-6ddc913f611a
https://publica.fraunhofer.de/entities/publication/4a934258-032b-42b3-8982-f64f6b40731a
https://publica.fraunhofer.de/entities/event/4a936a55-72e2-48f8-9f83-bc7c0dc5fe68
https://publica.fraunhofer.de/entities/publication/4a93804b-e228-4ff2-b26d-dc61d2fc09ab
https://publica.fraunhofer.de/entities/publication/4a9386b2-260c-4736-8fa9-17f2e19e1afc
https://publica.fraunhofer.de/entities/publication/4a9386ef-aa04-45df-a87d-3b839406170e
https://publica.fraunhofer.de/entities/publication/4a93a92f-9193-4f3b-85c8-7fc61b13e088
https://publica.fraunhofer.de/entities/publication/4a93cce7-2eb0-479b-98a5-1c6832986f9d
https://publica.fraunhofer.de/entities/publication/4a93e15c-b13a-496e-8952-5a8875c60f2b
https://publica.fraunhofer.de/entities/event/4a94a6ec-9869-47ee-a745-55cedcd28650
https://publica.fraunhofer.de/entities/publication/4a94d663-8a2b-42f5-8545-f3fe5f6b8fbe
https://publica.fraunhofer.de/entities/publication/4a94e305-f60f-461a-869d-69d57c28b0e7
https://publica.fraunhofer.de/entities/publication/4a94e69c-c57b-44c5-82e3-d2604b17b55a
https://publica.fraunhofer.de/entities/patent/4a955467-a18d-4ce3-bd5e-0b7a20baaaa7
https://publica.fraunhofer.de/entities/mainwork/4a957efc-3ba6-4110-ad1b-aedd9008eae0
https://publica.fraunhofer.de/entities/publication/4a95ab65-f92a-4763-99a8-eecef9965e90
https://publica.fraunhofer.de/entities/publication/4a960cc9-0251-494b-9a69-178a635a58cf
https://publica.fraunhofer.de/entities/journal/4a961349-1809-4f64-98d5-5019e19a0291
https://publica.fraunhofer.de/entities/publication/4a9619d7-2842-4ed9-9cf1-950ac474ff9f
https://publica.fraunhofer.de/entities/publication/4a961c52-8b5d-4049-a800-414902fc5c8c
https://publica.fraunhofer.de/entities/publication/4a962529-a966-40f3-92b1-57c67289413a
https://publica.fraunhofer.de/entities/mainwork/4a966eac-b4b7-4b75-834d-2cde45df11c7
https://publica.fraunhofer.de/entities/publication/4a968170-196e-45b7-91a8-0e017d60794c
https://publica.fraunhofer.de/entities/publication/4a9692f2-8270-4f2b-b71c-d83feceef0be
https://publica.fraunhofer.de/entities/publication/4a96bb8a-f538-4e29-a488-954b2c498186
https://publica.fraunhofer.de/entities/publication/4a96fe2a-b560-45d3-aa02-d48eca5cac15
https://publica.fraunhofer.de/entities/event/4a970407-b552-4e52-bfd7-c43c3a61935a
https://publica.fraunhofer.de/entities/event/4a977861-fbe0-4abf-8d40-d6b4fcf166a1
https://publica.fraunhofer.de/entities/publication/4a9786a9-d173-4ede-8d50-4cee9de945c8
https://publica.fraunhofer.de/entities/publication/4a97b6fb-2545-4fe2-92ab-b20d91fbddac
https://publica.fraunhofer.de/entities/publication/4a97ddc3-e706-42ec-b531-8b6774657e30
https://publica.fraunhofer.de/entities/publication/4a9807d0-9e0a-44fd-bd4c-99a9a388fbf7
https://publica.fraunhofer.de/entities/publication/4a98202f-5733-48ab-878e-f29694cbe71b
https://publica.fraunhofer.de/entities/publication/4a98405c-7ce2-4c57-a108-be36ccf73b09
https://publica.fraunhofer.de/entities/publication/4a987818-c29d-41d9-8994-99eb2a1053d7
https://publica.fraunhofer.de/entities/publication/4a9889f8-569c-4dfa-b47c-e3366ce96f72
https://publica.fraunhofer.de/entities/publication/4a98b289-5911-4ceb-b123-6bcd89782c28
https://publica.fraunhofer.de/entities/person/4a98c9b3-30ee-4ebb-8347-48c87b8925e8
https://publica.fraunhofer.de/entities/orgunit/4a991a42-5fe8-41ec-80af-7cb28796ea38
https://publica.fraunhofer.de/entities/publication/4a993b41-ede1-4f79-9f10-bbd92b7c4c7d
https://publica.fraunhofer.de/entities/publication/4a997a45-6393-462c-8783-e9f4ed069e9d
https://publica.fraunhofer.de/entities/publication/4a998c8f-4502-4188-81de-e12fe79d561f
https://publica.fraunhofer.de/entities/publication/4a9992b0-c50b-4ea4-b25e-ca7661f4e303
https://publica.fraunhofer.de/entities/publication/4a999c79-acde-400b-a3aa-753fe0366cb4
https://publica.fraunhofer.de/entities/publication/4a99a307-3a3f-4ab0-ae91-051e9488c728
https://publica.fraunhofer.de/entities/publication/4a99b085-992b-44c9-91e1-77e0cb67710c
https://publica.fraunhofer.de/entities/event/4a9a44d7-20f8-40bd-882b-a2bc8f29edec
https://publica.fraunhofer.de/entities/publication/4a9a7f38-d1ca-40d9-8ccd-61e1cf020105
https://publica.fraunhofer.de/entities/publication/4a9a92ef-fbf6-4d6d-b536-7b5327987361
https://publica.fraunhofer.de/entities/event/4a9acb81-2c8b-4d34-b811-eeeaaea314be
https://publica.fraunhofer.de/entities/publication/4a9af9ec-cf14-40fa-a4a8-e37e40f791d5
https://publica.fraunhofer.de/entities/publication/4a9b0364-8160-431f-bafb-cb82ede9a121
https://publica.fraunhofer.de/entities/person/4a9b467f-d042-4e9c-b4e9-7846cd4952ca
https://publica.fraunhofer.de/entities/publication/4a9b7a73-d44d-49b9-acba-c91b90a512a0
https://publica.fraunhofer.de/entities/publication/4a9c0c9d-7222-4658-ba5b-6f130da48a45
https://publica.fraunhofer.de/entities/patent/4a9c2459-8b5d-4c08-8e9a-99f8879c4bc0
https://publica.fraunhofer.de/entities/event/4a9c4017-2cc1-4c68-983d-38b3150ec21b
https://publica.fraunhofer.de/entities/publication/4a9c4241-a548-4ed6-a1f3-134655df5a44
https://publica.fraunhofer.de/entities/publication/4a9c6785-193f-412f-bd0b-12affd06051c
https://publica.fraunhofer.de/entities/publication/4a9c8974-f54a-460c-86af-5be36d39bcde
https://publica.fraunhofer.de/entities/publication/4a9cb6f1-740f-4180-ba56-40400f8cea73
https://publica.fraunhofer.de/entities/event/4a9d49f5-a088-42bd-9a87-49f41d543a5b
https://publica.fraunhofer.de/entities/publication/4a9da48a-4894-490a-a02a-bc21cf616ab1
https://publica.fraunhofer.de/entities/publication/4a9db2f7-21ab-4836-87c1-6a38c4b771b2
https://publica.fraunhofer.de/entities/journal/4a9de20e-9761-4212-bbe1-8fcc2d865c74
https://publica.fraunhofer.de/entities/publication/4a9dee7e-7721-4b36-ae12-7c7c04f1a491
https://publica.fraunhofer.de/entities/event/4a9e2217-e878-46ff-9b2a-da7fb4767e46
https://publica.fraunhofer.de/entities/publication/4a9e9867-4bcb-41bc-bd13-213e7b316ba7
https://publica.fraunhofer.de/entities/event/4a9ebc72-88ec-427e-b971-182eadf4ae55
https://publica.fraunhofer.de/entities/event/4a9ec5b2-9bcd-4e91-8a92-bd30bca7417d
https://publica.fraunhofer.de/entities/publication/4a9ed01a-f495-4e70-b34a-08390bb7a9f3
https://publica.fraunhofer.de/entities/patent/4a9f0c80-8dbd-498c-b591-774b6ed326cf
https://publica.fraunhofer.de/entities/mainwork/4a9f1473-be46-4d8e-b124-6fd29c72bd72
https://publica.fraunhofer.de/entities/event/4a9f1eb6-e58f-45fd-867c-6db3b8490899
https://publica.fraunhofer.de/entities/mainwork/4a9f6dac-a151-4680-8e63-bb3a8b9ce248
https://publica.fraunhofer.de/entities/publication/4a9f89e5-2496-4d12-bf70-c03f67402745
https://publica.fraunhofer.de/entities/mainwork/4a9fdc62-64b6-4bd1-a242-d7e72217dd86
https://publica.fraunhofer.de/entities/publication/4a9ff656-e39b-427a-9853-870c94049361
https://publica.fraunhofer.de/entities/publication/4a9ffd2f-2fe3-4013-972c-858ac2dda4ba
https://publica.fraunhofer.de/entities/event/4aa006cb-98b6-4245-aab6-dc419b392737
https://publica.fraunhofer.de/entities/publication/4aa02f8c-04c0-422d-85dc-8bb8b2a0accb
https://publica.fraunhofer.de/entities/orgunit/4aa066ab-776f-44fe-ba1a-3fd18de76dd4
https://publica.fraunhofer.de/entities/publication/4aa07b85-5688-4b54-9b8f-2e0b83b06bbe
https://publica.fraunhofer.de/entities/publication/4aa0836e-24ac-4d58-8a21-ee41f422f3ce
https://publica.fraunhofer.de/entities/project/4aa0c1c3-fb7b-492d-9a95-76229bb638b5
https://publica.fraunhofer.de/entities/publication/4aa0e252-1bda-4373-9018-f5574086db03
https://publica.fraunhofer.de/entities/publication/4aa11008-1054-48b0-b24c-056502d8aa1b
https://publica.fraunhofer.de/entities/mainwork/4aa136cb-09cd-4bcd-bd03-ced0500c3788
https://publica.fraunhofer.de/entities/event/4aa150f0-468b-432e-a03a-aa3fa94e24e5
https://publica.fraunhofer.de/entities/publication/4aa16040-3139-433f-9f0c-e4771133aecc
https://publica.fraunhofer.de/entities/event/4aa169a4-6f55-441c-97ff-751f0cb08838
https://publica.fraunhofer.de/entities/publication/4aa1a6be-7055-4d85-bfa7-196770309431
https://publica.fraunhofer.de/entities/patent/4aa1caf8-7a13-42c4-94e3-807274886968
https://publica.fraunhofer.de/entities/publication/4aa22956-9d84-439f-a034-d1fd82ff0a3c
https://publica.fraunhofer.de/entities/publication/4aa22bb8-4588-470b-8e24-b807ee8672ad
https://publica.fraunhofer.de/entities/mainwork/4aa22d89-f3d3-4747-97be-0de01d5d16d8
https://publica.fraunhofer.de/entities/mainwork/4aa2483d-a144-4e46-ac88-f06a2da047de
https://publica.fraunhofer.de/entities/publication/4aa2ab21-5224-43a8-97ff-c6b64d985a57
https://publica.fraunhofer.de/entities/publication/4aa2ae43-52c1-422b-924b-78cf769aa887
https://publica.fraunhofer.de/entities/event/4aa2bda0-0977-4ab1-95f8-4bb569d8b407
https://publica.fraunhofer.de/entities/mainwork/4aa3774a-ec1b-468e-87a8-ebcdb3e7cadf
https://publica.fraunhofer.de/entities/publication/4aa38620-738e-46f1-a24f-47c96a024d6e
https://publica.fraunhofer.de/entities/publication/4aa3baf6-a986-4317-927d-c6d06b27da21
https://publica.fraunhofer.de/entities/publication/4aa3d851-f1e3-448b-96e0-75b7cd8e8fbb
https://publica.fraunhofer.de/entities/publication/4aa3e987-ddc0-40ad-86f7-071308fe4926
https://publica.fraunhofer.de/entities/publication/4aa3f89e-1c95-4d47-9939-af44eb6e3283
https://publica.fraunhofer.de/entities/publication/4aa3fd28-1ca6-4edd-98c1-5f97b8b257d2
https://publica.fraunhofer.de/entities/publication/4aa40863-abb8-4ffa-843c-258a4db52644
https://publica.fraunhofer.de/entities/patent/4aa45657-23a5-47b6-b17d-a5f491493210
https://publica.fraunhofer.de/entities/publication/4aa48025-d11a-49d8-81ce-9113a165cf79
https://publica.fraunhofer.de/entities/publication/4aa4b04e-9c5f-422e-be8c-5850e1cbeef9
https://publica.fraunhofer.de/entities/publication/4aa54f50-0d43-417f-af05-133ea4a8c94c
https://publica.fraunhofer.de/entities/mainwork/4aa55c60-03d3-4db6-9377-9287c0f4c7de
https://publica.fraunhofer.de/entities/publication/4aa56435-31d9-4ce1-9b19-d641c6a57c58
https://publica.fraunhofer.de/entities/mainwork/4aa5d71a-fa21-4bfc-a4ff-d09e4bfbe652
https://publica.fraunhofer.de/entities/publication/4aa5ebd6-797a-4e3a-b883-9621e0b7cc7b
https://publica.fraunhofer.de/entities/event/4aa5fd18-ebe9-4459-bf48-7174f78c01ab
https://publica.fraunhofer.de/entities/patent/4aa62b49-34a7-46b7-bafc-f1dfcd55f7d7
https://publica.fraunhofer.de/entities/publication/4aa62e7b-1e5b-4e04-811f-35c1874fec95
https://publica.fraunhofer.de/entities/mainwork/4aa62ef7-50fb-43c3-8295-9d345c8567f5
https://publica.fraunhofer.de/entities/publication/4aa63818-606d-4ee9-825b-8fdc2967e9b2
https://publica.fraunhofer.de/entities/mainwork/4aa6782c-64d9-436d-87f6-c762fe6ad18e
https://publica.fraunhofer.de/entities/event/4aa6a882-f841-4ab4-9ea0-adf58f83c703