https://publica.fraunhofer.de/entities/event/325d2244-6748-43b9-9082-e1190b9dade9
https://publica.fraunhofer.de/entities/publication/325d5a7c-f8ee-4672-bdd2-1c04f7eeb7db
https://publica.fraunhofer.de/entities/publication/325d6520-a41e-4d08-b6da-29d9bbe6939f
https://publica.fraunhofer.de/entities/publication/325d8f9a-7041-4c46-8ef0-ad7782485298
https://publica.fraunhofer.de/entities/publication/325da1dd-5eff-461d-8e05-efc49c9577c0
https://publica.fraunhofer.de/entities/orgunit/325dbbc1-5ac2-4c5a-86d1-d0891de8d8b2
https://publica.fraunhofer.de/entities/event/325dbd5e-769f-4de0-af11-d505033017a1
https://publica.fraunhofer.de/entities/mainwork/325dd0a1-d93e-4e59-97a9-5b37b57d6bf7
https://publica.fraunhofer.de/entities/publication/325e0df0-31af-4d74-bc54-0fd99dd65d60
https://publica.fraunhofer.de/entities/publication/325e38be-d695-4a84-969a-2d06a96f3859
https://publica.fraunhofer.de/entities/publication/325e40a4-6f97-465c-802f-7888c7eeb562
https://publica.fraunhofer.de/entities/event/325e4a3e-5901-4307-a0a7-a6b96475d9b2
https://publica.fraunhofer.de/entities/publication/325e63a7-4f7d-49bb-8cc6-842f04d8f4fb
https://publica.fraunhofer.de/entities/mainwork/325e7da5-551f-4b6b-9e50-23f403fa0bb3
https://publica.fraunhofer.de/entities/publication/325eac01-14cc-47a5-96de-200c1d913f89
https://publica.fraunhofer.de/entities/publication/325ef160-1371-4c6c-934d-452425ac5de0
https://publica.fraunhofer.de/entities/publication/325f0787-2b13-4cfe-b095-aaeee414cbaf
https://publica.fraunhofer.de/entities/mainwork/325f1b28-e1a6-4d1f-940e-02db964eee8c
https://publica.fraunhofer.de/entities/mainwork/325f573a-63d4-435f-8002-02754eefec17
https://publica.fraunhofer.de/entities/patent/325f7568-7fb3-4c8d-9c5f-a171c814b0b5
https://publica.fraunhofer.de/entities/publication/325f9367-66b1-4622-83fa-5bedc4f3d3b3
https://publica.fraunhofer.de/entities/event/325f93b6-beed-4b4e-b8a9-b24827e861e2
https://publica.fraunhofer.de/entities/journal/325fc051-c7b1-4415-be69-19efb039e417
https://publica.fraunhofer.de/entities/patent/325fcaac-7a88-499a-9d92-43f45a9bfea5
https://publica.fraunhofer.de/entities/mainwork/325fd6fe-1651-4385-8a66-08f1c4b0b2b9
https://publica.fraunhofer.de/entities/publication/32601f5b-65dc-474b-9f04-1c147ea2fc94
https://publica.fraunhofer.de/entities/publication/3260596c-c1e7-4562-836b-811b497c2a52
https://publica.fraunhofer.de/entities/publication/3260bb2f-b838-42ed-a881-26c046871f23
https://publica.fraunhofer.de/entities/publication/3260c4a2-a697-406e-892c-aaba17a56edc
https://publica.fraunhofer.de/entities/mainwork/3260dbb6-4b8b-4410-8b70-b8ecc52b79df
https://publica.fraunhofer.de/entities/publication/3260edb7-9b29-43fa-9de5-c1920da82f23
https://publica.fraunhofer.de/entities/publication/3260f824-0e38-4fed-a49c-69e73e83fd85
https://publica.fraunhofer.de/entities/journal/32610474-a445-4590-b002-b6f7dfb0ac82
https://publica.fraunhofer.de/entities/event/32611178-5c6a-43b7-9a2c-cf74281ebf7f
https://publica.fraunhofer.de/entities/publication/32613cd0-f4c1-42d7-8227-7b7cc1fa942d
https://publica.fraunhofer.de/entities/publication/326162db-0c48-4452-b23e-cfa74fb8366b
https://publica.fraunhofer.de/entities/publication/326165e6-d03f-4a30-b5bf-c1598410fed5
https://publica.fraunhofer.de/entities/mainwork/32617f61-0305-474a-83a0-5d369e14abfb
https://publica.fraunhofer.de/entities/publication/3261a2a2-80af-4c58-977f-82993f10bebd
https://publica.fraunhofer.de/entities/publication/3261ac9b-3e5c-43c2-a1ef-98e4fdaf0ba5
https://publica.fraunhofer.de/entities/publication/3261cde2-cee3-4664-966f-ba74497b6704
https://publica.fraunhofer.de/entities/publication/3261d65d-47c7-40ff-bb06-eee6c5a6fe42
https://publica.fraunhofer.de/entities/mainwork/3261efb6-ad6d-4ed2-8d38-e764b9529ff7
https://publica.fraunhofer.de/entities/journal/3261ff12-e378-47a9-914a-cc89fda382e6
https://publica.fraunhofer.de/entities/publication/32622110-f453-4e57-8846-7291f196282b
https://publica.fraunhofer.de/entities/publication/32626d96-b056-4da4-855c-395460fa96a8
https://publica.fraunhofer.de/entities/event/32626e65-6b0c-4e9b-9a62-6fea920c512d
https://publica.fraunhofer.de/entities/event/32627c42-c399-48ee-aee8-05bc9fd46517
https://publica.fraunhofer.de/entities/publication/32628d37-2f83-411f-912c-7d0b591c690a
https://publica.fraunhofer.de/entities/mainwork/3262d55d-b353-4c27-99e0-aef42f717d01
https://publica.fraunhofer.de/entities/mainwork/3262df7a-9625-4e8f-b8f5-48103af978cc
https://publica.fraunhofer.de/entities/publication/3262e138-6634-4b9a-880d-42fd3eb7adfb
https://publica.fraunhofer.de/entities/publication/3262f01d-19b7-48ec-bac1-2467568423e5
https://publica.fraunhofer.de/entities/mainwork/326318c8-6127-4ad5-8e0c-5a24cd4be4a9
https://publica.fraunhofer.de/entities/publication/326335f2-debf-4328-8e57-4426198b4ab5
https://publica.fraunhofer.de/entities/publication/32636a9c-8c6d-453e-b459-62189d9bcf2d
https://publica.fraunhofer.de/entities/publication/32637c76-944c-4639-a6fd-eaae218ff0bb
https://publica.fraunhofer.de/entities/publication/3263b804-698a-40d4-9be1-afc93560d6d0
https://publica.fraunhofer.de/entities/publication/3264240d-71b3-4e6f-81ad-563b9554acfa
https://publica.fraunhofer.de/entities/event/3264550e-d238-455d-abf7-a798a8e745ef
https://publica.fraunhofer.de/entities/project/326471c1-3c81-4a42-b97d-95e81d215f5c
https://publica.fraunhofer.de/entities/mainwork/32649090-7ec0-4d8c-b9e8-aea1300e2e13
https://publica.fraunhofer.de/entities/event/3264f0e6-5644-45e5-8e71-b7ba04bd702f
https://publica.fraunhofer.de/entities/publication/3264fe3f-8949-4b9c-86ab-4905cea8b3a4
https://publica.fraunhofer.de/entities/mainwork/3265021c-5395-4509-9214-da18fb5da8ba
https://publica.fraunhofer.de/entities/publication/326513f2-9c76-4f69-bade-f542b66d6dd5
https://publica.fraunhofer.de/entities/event/32652924-283d-495a-b21f-89a5d83cdbec
https://publica.fraunhofer.de/entities/publication/32654958-592a-4c13-b06c-1a4dc89285a6
https://publica.fraunhofer.de/entities/publication/32655584-d627-41ac-ad62-e13ab51a5fa2
https://publica.fraunhofer.de/entities/publication/3265a8be-0eca-4b33-9dd7-5081787957a1
https://publica.fraunhofer.de/entities/publication/3265bed8-803a-4de6-8ce2-bccf580de8ff
https://publica.fraunhofer.de/entities/mainwork/3265d940-7351-4cb3-be8b-fb38a38b983e
https://publica.fraunhofer.de/entities/event/3265f247-447c-4f83-a0ff-c1c949fc5ab8
https://publica.fraunhofer.de/entities/publication/32663a0e-7feb-4ee2-a3f1-33e1c39e696a
https://publica.fraunhofer.de/entities/publication/32665190-34c2-4855-8a79-c2ac9c703886
https://publica.fraunhofer.de/entities/publication/3266975b-5517-4f39-bb7b-ab8f16cf0048
https://publica.fraunhofer.de/entities/event/3266fcfe-65eb-4af4-b1c2-7f4e4e7a5b0d
https://publica.fraunhofer.de/entities/mainwork/32675503-7fd1-428c-95ac-d21e677ee8c6
https://publica.fraunhofer.de/entities/publication/326783c2-b75d-4dcd-9950-6c18904f13bd
https://publica.fraunhofer.de/entities/publication/3267a1d2-ea4d-4b4c-9b79-b23806fcbaff
https://publica.fraunhofer.de/entities/patent/3267ce39-1413-48a7-ba81-72991632fb38
https://publica.fraunhofer.de/entities/publication/3268037f-8551-4772-acf3-b21645e3fa50
https://publica.fraunhofer.de/entities/publication/326861b4-c37d-402c-90f1-add94a05d88b
https://publica.fraunhofer.de/entities/event/32686227-d66f-49a1-9407-78d814e9628c
https://publica.fraunhofer.de/entities/publication/32688b7f-a033-4d0e-aef2-7065a9473758
https://publica.fraunhofer.de/entities/publication/326895b6-9cd4-4f7b-9384-31272b7ec7f7
https://publica.fraunhofer.de/entities/event/3268a888-87e7-4a60-8ded-b2f6124c5b6b
https://publica.fraunhofer.de/entities/publication/3268b6e8-7af8-460d-927e-5fc93b8f47f2
https://publica.fraunhofer.de/entities/publication/3268c604-fa7d-4981-9a78-29846196ea6a
https://publica.fraunhofer.de/entities/journal/3268f1cf-24fe-4360-93bd-f696fe84ba76
https://publica.fraunhofer.de/entities/publication/3268fc67-b5e3-4dce-b062-8d56a63c78b3
https://publica.fraunhofer.de/entities/mainwork/326926d8-41c2-4af0-9a62-359534dccefe
https://publica.fraunhofer.de/entities/patent/32694acd-1ba0-4389-9e38-c00b3a101d3c
https://publica.fraunhofer.de/entities/journal/32694c9d-79bf-4455-a843-b97a20d42c64
https://publica.fraunhofer.de/entities/publication/32696e34-b49b-4799-94c2-f212360f6874
https://publica.fraunhofer.de/entities/mainwork/32697cc6-d7c1-4c84-b43d-cf1e68622be3
https://publica.fraunhofer.de/entities/publication/32698336-12f3-4099-8c80-a942051e9d36
https://publica.fraunhofer.de/entities/publication/326984f9-e71f-4c56-bf8c-7c4600b8ece0
https://publica.fraunhofer.de/entities/event/326989e7-d1b7-4b85-b84d-4946c1753a4e
https://publica.fraunhofer.de/entities/publication/3269b500-25ab-4c2e-944b-829e41efefc4
https://publica.fraunhofer.de/entities/publication/3269e625-9e26-492d-b371-eecd58c6a1c4
https://publica.fraunhofer.de/entities/event/3269ea9b-d601-406c-9ecd-0e8beb1a07da
https://publica.fraunhofer.de/entities/publication/326a16d8-555e-46f2-9907-d28e06067b87
https://publica.fraunhofer.de/entities/publication/326a20ca-3ec8-4334-b752-91d9af455fb8
https://publica.fraunhofer.de/entities/publication/326a3d7a-6c18-4feb-b3d2-2139ce02020c
https://publica.fraunhofer.de/entities/publication/326a673e-7a77-4d14-b58e-d74b2363579b
https://publica.fraunhofer.de/entities/publication/326a7e11-d423-416c-a366-61821f52499d
https://publica.fraunhofer.de/entities/publication/326a849e-ea30-42b8-bad6-f8e1a17e36f9
https://publica.fraunhofer.de/entities/event/326a9194-d427-409f-856c-a4cb2a5f240d
https://publica.fraunhofer.de/entities/publication/326a9646-e91e-4aa4-9302-5dce9b68b5cd
https://publica.fraunhofer.de/entities/publication/326aaf2e-fa39-4cb9-a6fe-feca1acdaec1
https://publica.fraunhofer.de/entities/publication/326abb8a-5a4d-4d96-87b6-e3da26223c83
https://publica.fraunhofer.de/entities/publication/326af9c8-3447-44a5-abb0-c404917dc3a8
https://publica.fraunhofer.de/entities/publication/326b0a47-cfd5-46ec-9c11-8090fc61ba03
https://publica.fraunhofer.de/entities/mainwork/326b104c-44f6-427a-91c4-1fba411db8dd
https://publica.fraunhofer.de/entities/patent/326b1720-c9fe-4840-bf18-091a022ceeb5
https://publica.fraunhofer.de/entities/publication/326b1f21-5866-4797-adee-b45933d7ae94
https://publica.fraunhofer.de/entities/mainwork/326bb62b-e4e5-4dcc-bb48-e88941a5840d
https://publica.fraunhofer.de/entities/publication/326c1d29-1064-4ae4-9d72-71b3bb65ccd0
https://publica.fraunhofer.de/entities/publication/326c2e8b-a1a9-4a95-984e-1b773988ba82
https://publica.fraunhofer.de/entities/orgunit/326c5b4d-8452-4976-bb1a-ae5702cdb29a
https://publica.fraunhofer.de/entities/project/326c5d2f-c3c0-40fd-b22f-6edb12c0f0f4
https://publica.fraunhofer.de/entities/publication/326c9d2e-291c-4ebe-876f-ea77ab32f314
https://publica.fraunhofer.de/entities/publication/326cadbd-2c2f-4f5f-aaf7-6d7519c85bf6
https://publica.fraunhofer.de/entities/project/326cfe32-5fe0-42df-9a0b-902bf1e929c6
https://publica.fraunhofer.de/entities/publication/326d1ce3-3ed3-45a0-8393-c6aed668ee8c
https://publica.fraunhofer.de/entities/mainwork/326d3596-7f8b-4a27-a473-c4a1c324e858
https://publica.fraunhofer.de/entities/event/326ddd21-9e25-4c65-bc36-821c70581674
https://publica.fraunhofer.de/entities/project/326dea54-e53d-4390-b50b-1dde854e9cb5
https://publica.fraunhofer.de/entities/publication/326df08c-18da-45c2-8ade-174eac823ce8
https://publica.fraunhofer.de/entities/publication/326e3b25-c878-488e-af69-982dd322c500
https://publica.fraunhofer.de/entities/publication/326ec090-17ff-4091-a55f-a8e3b016b417
https://publica.fraunhofer.de/entities/publication/326eccb7-f84a-4091-a561-e3bc02a6b3e6
https://publica.fraunhofer.de/entities/publication/326ecced-a22a-46ad-acc8-bd0c1a8bd378
https://publica.fraunhofer.de/entities/publication/326f3196-3e7e-4ca5-a28f-d26ffabb62de
https://publica.fraunhofer.de/entities/publication/326f4687-a538-428b-a28d-4f6ff47879cc
https://publica.fraunhofer.de/entities/event/326f626a-7720-47da-9fd3-e0451a36edd4
https://publica.fraunhofer.de/entities/project/326f82fa-87f3-4de8-987f-7a362ac07d0d
https://publica.fraunhofer.de/entities/orgunit/326f851b-063a-4feb-991b-844cf2c54314
https://publica.fraunhofer.de/entities/publication/326f8abc-1437-4eba-b312-c06c216236ad
https://publica.fraunhofer.de/entities/publication/326f8f6a-50d3-4433-9e98-2c2be4943141
https://publica.fraunhofer.de/entities/event/326fd6b8-1e0a-4393-a691-8a97ae73aafd
https://publica.fraunhofer.de/entities/publication/32702073-0113-4922-ae54-136c324f1436
https://publica.fraunhofer.de/entities/publication/327022fc-b07f-45e5-9c1b-f717cfc086ab
https://publica.fraunhofer.de/entities/publication/32702d5d-f18b-429f-a0cd-0e4a6c32c0d3
https://publica.fraunhofer.de/entities/publication/32705d15-66d5-4f8a-a9c6-1df4894823db
https://publica.fraunhofer.de/entities/event/32705eb1-3907-4e63-bfce-afbefc588e55
https://publica.fraunhofer.de/entities/publication/3270612f-4cb3-45d2-991d-2b8fa27f6846
https://publica.fraunhofer.de/entities/publication/327077a2-f024-43cb-aa71-7fdcbd675c62
https://publica.fraunhofer.de/entities/mainwork/3270ed51-2339-48af-a423-4166398bb47b
https://publica.fraunhofer.de/entities/publication/327115c8-0048-44bb-b116-cdc6a272e16f
https://publica.fraunhofer.de/entities/publication/32711a36-6910-4ee7-9ca0-b109c81332af
https://publica.fraunhofer.de/entities/publication/327124ce-1411-43b5-af04-0e9d47682e34
https://publica.fraunhofer.de/entities/orgunit/32713125-5846-4056-9bcf-7db1230175da
https://publica.fraunhofer.de/entities/mainwork/32715ad2-9020-4aa3-8c83-8683567be0e6
https://publica.fraunhofer.de/entities/person/3271792b-518a-4c98-a208-2909bf7ae1fb
https://publica.fraunhofer.de/entities/publication/32718a18-a4cc-4601-92e8-2bec3d221f94
https://publica.fraunhofer.de/entities/publication/3271a4e2-8c76-45f1-881e-5f8c0d31587d
https://publica.fraunhofer.de/entities/publication/3271cd12-9882-4148-9826-f306114d539a
https://publica.fraunhofer.de/entities/mainwork/327227c9-8bee-4b6d-bbe1-7e73a712cb4b
https://publica.fraunhofer.de/entities/publication/32722a74-9c6b-48d7-b050-206680bf8280
https://publica.fraunhofer.de/entities/orgunit/32723972-144d-4ab9-b430-612c65328e33
https://publica.fraunhofer.de/entities/publication/32723c8a-1ade-408d-97c5-a04ec5be119f
https://publica.fraunhofer.de/entities/event/3272465d-3939-41dc-8f09-3bda9174b5e7
https://publica.fraunhofer.de/entities/patent/32727c60-a37c-4cad-b3ab-bdf05d4e3524
https://publica.fraunhofer.de/entities/publication/32728511-9d3c-485b-be85-c9ff8ee00db0
https://publica.fraunhofer.de/entities/publication/3272adaa-7e6f-4a2d-8dd3-3098b0817c57
https://publica.fraunhofer.de/entities/event/32735531-d5be-4456-84c9-54bc45555209
https://publica.fraunhofer.de/entities/event/32735d9c-1614-4c0d-a438-c57a096c1aa7
https://publica.fraunhofer.de/entities/orgunit/32737785-b65a-4f44-a341-1cde2a5852e8
https://publica.fraunhofer.de/entities/event/3273c4b2-2fb7-478a-9db2-a6b2cbec64d8
https://publica.fraunhofer.de/entities/project/3273c595-4341-464d-9209-df44fd72c019
https://publica.fraunhofer.de/entities/project/3273c75d-cefc-47e0-8866-b430d585fca1
https://publica.fraunhofer.de/entities/publication/327453cf-f200-498a-a782-3bcd00aa6499
https://publica.fraunhofer.de/entities/publication/32748325-a6a3-4bba-8e02-4166898a05ac
https://publica.fraunhofer.de/entities/event/3274ad7b-bfb0-49e1-850a-8bbd169c5d27
https://publica.fraunhofer.de/entities/mainwork/3274cf85-e13b-4412-a09e-97e53a2d5ea3
https://publica.fraunhofer.de/entities/patent/32752dfd-4067-4ffe-a027-9c8500c49495
https://publica.fraunhofer.de/entities/event/327543ac-fa65-4996-9301-2a5cfd4836a6
https://publica.fraunhofer.de/entities/publication/3275553f-7ec8-4b6c-a43a-064852673d23
https://publica.fraunhofer.de/entities/publication/3275a87f-685e-477d-8a5e-88d6679d90a7
https://publica.fraunhofer.de/entities/publication/327664cb-5f24-42f4-ad0b-3ecc8347dad1
https://publica.fraunhofer.de/entities/publication/32767ec0-1892-43d1-8124-d9283e1acab8
https://publica.fraunhofer.de/entities/publication/3276905b-5522-48aa-9609-0e57c465afe6
https://publica.fraunhofer.de/entities/publication/3276a24b-30aa-4606-8b2d-43a3f762c0e7
https://publica.fraunhofer.de/entities/mainwork/3276b793-82aa-4059-b3fd-33da7f7445af
https://publica.fraunhofer.de/entities/publication/3276f2e4-f5b7-4b18-aef8-0f2abcc51c71
https://publica.fraunhofer.de/entities/publication/327766d0-ddf8-4d55-9225-a487e6172ed3
https://publica.fraunhofer.de/entities/mainwork/3277712d-1f37-40ba-8c3b-f5542b811552
https://publica.fraunhofer.de/entities/event/3277f90d-da32-47ca-9d46-c3a2646c4ef3
https://publica.fraunhofer.de/entities/publication/32780188-c492-4093-b339-8bd682f6222c
https://publica.fraunhofer.de/entities/event/32780dc2-28a9-41e4-b32c-37bb916df6d8
https://publica.fraunhofer.de/entities/publication/32781a6e-9265-44ed-b86e-a91c631bd64c
https://publica.fraunhofer.de/entities/publication/32783313-e64b-47f4-bb43-aa748a3d4858
https://publica.fraunhofer.de/entities/publication/3278453b-9ef3-46fa-8453-e257c48db9f2
https://publica.fraunhofer.de/entities/publication/32786329-2a1c-4d4c-9610-d19810e65dfb
https://publica.fraunhofer.de/entities/event/32786fbb-cc94-4cd8-8d27-0349d45514f8
https://publica.fraunhofer.de/entities/publication/3278ac41-dcc7-4d07-af57-3630ef4fb2d3
https://publica.fraunhofer.de/entities/project/3278c8a9-9a91-494d-bd81-2f1b068cd444
https://publica.fraunhofer.de/entities/mainwork/3278e560-7642-4d96-bf67-2c09d0bbeb80
https://publica.fraunhofer.de/entities/publication/3279078e-5e29-4ad2-9368-c3fc1890faa3
https://publica.fraunhofer.de/entities/mainwork/32793288-3176-4f69-89f4-0436d08d4020
https://publica.fraunhofer.de/entities/patent/32796338-6b88-4dd3-8bdf-c7b2262821f5
https://publica.fraunhofer.de/entities/publication/3279dc7c-9a9c-4004-84c9-de73e3a2cfb3
https://publica.fraunhofer.de/entities/mainwork/3279e658-6083-4a5b-9ba4-7944bb913510
https://publica.fraunhofer.de/entities/publication/3279eee5-5924-4072-a2c9-b2b20883bc93
https://publica.fraunhofer.de/entities/journal/327ab5a7-39be-417d-89a8-4224c67c39f6
https://publica.fraunhofer.de/entities/publication/327ab8de-aeaf-4f17-ba07-3e897c53f6f9
https://publica.fraunhofer.de/entities/mainwork/327ac2c3-a126-4238-9cc0-1a94605853c1
https://publica.fraunhofer.de/entities/mainwork/327ac7c2-2009-4d45-a408-50b5228a21ec
https://publica.fraunhofer.de/entities/event/327ae885-0645-41fb-9b36-b2c54e5c0558
https://publica.fraunhofer.de/entities/publication/327b0359-03c3-4896-a240-96aa7869b758
https://publica.fraunhofer.de/entities/publication/327b3ce1-dbd9-4961-aa9d-dcd64e57119b
https://publica.fraunhofer.de/entities/publication/327b61f7-8173-48a1-af21-2e1b557c5750
https://publica.fraunhofer.de/entities/publication/327bc235-2b7d-4cbc-aeb0-1c48204811aa
https://publica.fraunhofer.de/entities/event/327be765-82e1-4f1c-b2fe-b1df005fd066
https://publica.fraunhofer.de/entities/publication/327c7712-49c3-4e33-b9d1-103a521d6832
https://publica.fraunhofer.de/entities/publication/327ca1d2-bc23-4408-b388-94154613e2a0
https://publica.fraunhofer.de/entities/event/327cb072-ee9a-4d7e-b92e-6f0c5e3398db
https://publica.fraunhofer.de/entities/publication/327ccba0-f5d1-4709-ba8e-2cda948abc32
https://publica.fraunhofer.de/entities/person/327d1390-2a49-46c9-b2b7-11bafd86635a
https://publica.fraunhofer.de/entities/publication/327d5454-6833-4a56-a3d7-453117f1fcbe
https://publica.fraunhofer.de/entities/event/327dc402-1d2d-43bd-b15a-3cfdd4a6e78e
https://publica.fraunhofer.de/entities/publication/327dcdb6-aee4-4f4d-8999-d14d1ebbb334
https://publica.fraunhofer.de/entities/orgunit/327de1a0-90ec-4a10-ae68-cfa30cf177d2
https://publica.fraunhofer.de/entities/orgunit/327df59d-909c-4a45-949a-171b256908f3
https://publica.fraunhofer.de/entities/event/327e0175-5e56-496d-bcb4-ff22eb69a191
https://publica.fraunhofer.de/entities/publication/327e489d-bad9-45cf-b957-f44a807e87c4
https://publica.fraunhofer.de/entities/publication/327e52e9-3fe7-444b-8c5c-ffea89d0949b
https://publica.fraunhofer.de/entities/mainwork/327e5af9-d410-4233-a9c6-9f81eb430ae3
https://publica.fraunhofer.de/entities/publication/327ed5e2-5a42-4fad-909d-a0368e398787
https://publica.fraunhofer.de/entities/publication/327ee241-0d00-4f16-b2aa-ee56a0c7d046
https://publica.fraunhofer.de/entities/publication/327f058f-a1c0-4ac4-88d5-91f6eb70917a
https://publica.fraunhofer.de/entities/publication/327f0950-9425-4c18-95d2-35f08cc5a3fa
https://publica.fraunhofer.de/entities/publication/327f2033-0073-4c54-b750-1e8a80c9c915
https://publica.fraunhofer.de/entities/publication/327f5cec-1a6d-4209-b1de-98664585a54b
https://publica.fraunhofer.de/entities/publication/327f6149-8c3d-44e4-9585-9344ef880183
https://publica.fraunhofer.de/entities/event/327f673e-1146-4ae3-8ca8-d51a94e82fb9
https://publica.fraunhofer.de/entities/publication/327f6e12-d9b1-49b7-b350-a9d210e53f8d
https://publica.fraunhofer.de/entities/person/327f9f94-dad4-449e-bd6c-a28ed1573038
https://publica.fraunhofer.de/entities/publication/327fb0b3-888c-43df-92bb-3b5f2e4f8867
https://publica.fraunhofer.de/entities/publication/327fc3db-33a7-48e4-81b7-abc06fc2a447
https://publica.fraunhofer.de/entities/publication/327fcdc9-c4e6-45ad-a04f-f73a02fe14c4
https://publica.fraunhofer.de/entities/event/328004d4-dfe5-4869-a750-0a676a744c1a
https://publica.fraunhofer.de/entities/publication/3280288b-909c-4f9a-8a38-5a2f91f0884b
https://publica.fraunhofer.de/entities/journal/3280a37e-b35c-44f1-87b9-1291f70b6e24
https://publica.fraunhofer.de/entities/mainwork/32811499-67c3-405f-82db-9ed887411fb7
https://publica.fraunhofer.de/entities/publication/32812841-4a0c-451d-9d7c-ffd1eb32c0f5
https://publica.fraunhofer.de/entities/publication/3281385c-4dd7-4d41-8330-7eb7b480fb81
https://publica.fraunhofer.de/entities/event/3281985d-35a0-4a45-8bce-f03e19196dfe
https://publica.fraunhofer.de/entities/publication/32819931-08d2-491d-8282-07a5dfd40ac3
https://publica.fraunhofer.de/entities/mainwork/3281e148-169f-474d-9aba-8d7f42cfd11b
https://publica.fraunhofer.de/entities/publication/3281ef2c-6f6a-4f66-80bf-6d31793c9d3c
https://publica.fraunhofer.de/entities/publication/32823eca-c16a-4367-948b-10cf94f27e72
https://publica.fraunhofer.de/entities/publication/32826562-5935-4515-8995-5a3cf37eece0
https://publica.fraunhofer.de/entities/publication/328298fe-4a1c-4523-bd37-34bd6cbed52a
https://publica.fraunhofer.de/entities/publication/3282c02b-df97-44b6-9c7e-0333e520ec0b
https://publica.fraunhofer.de/entities/mainwork/3282ea58-9a28-4df8-b91f-07b8ab6db461
https://publica.fraunhofer.de/entities/publication/32831d97-9e7a-4010-96c8-80022530044c
https://publica.fraunhofer.de/entities/publication/3283413a-4ee7-4d66-822d-7ef8eda7825d
https://publica.fraunhofer.de/entities/publication/3283593d-33dc-45fd-b9c1-5e0576792ed6