https://publica.fraunhofer.de/entities/publication/a29bfb61-7ef9-48bd-bef1-155f2a2772e0
https://publica.fraunhofer.de/entities/publication/a29c0dfc-d70e-44d8-af99-f929dff82eed
https://publica.fraunhofer.de/entities/patent/a29c12b2-8c97-4cd6-91dc-d6c808c4b5b7
https://publica.fraunhofer.de/entities/event/a29c1e3c-9b90-447a-adc7-ded201efdf43
https://publica.fraunhofer.de/entities/orgunit/a29c45b7-b206-44ef-9c15-52260327cd95
https://publica.fraunhofer.de/entities/mainwork/a29c8f30-c660-4f99-935e-825563cc2e45
https://publica.fraunhofer.de/entities/publication/a29cae7b-2cb3-4544-8175-dd707eb827ff
https://publica.fraunhofer.de/entities/publication/a29cbd24-f4d7-4204-900a-72fbe76daad3
https://publica.fraunhofer.de/entities/publication/a29cd448-a8a0-41da-a108-42619ddd83df
https://publica.fraunhofer.de/entities/publication/a29ce35b-62ff-45bc-bb2e-51146ba78d59
https://publica.fraunhofer.de/entities/person/a29cec7b-6744-4ba7-8881-3a115f9299c6
https://publica.fraunhofer.de/entities/publication/a29cfead-e14a-4955-870f-3a0d8ef96c99
https://publica.fraunhofer.de/entities/publication/a29d4ba7-4999-462e-b707-5aa00c6e4151
https://publica.fraunhofer.de/entities/publication/a29d58d0-5edf-454d-b90c-82d6dfdd2cd3
https://publica.fraunhofer.de/entities/publication/a29d9601-24e4-4d60-af19-8086ee5fbe7e
https://publica.fraunhofer.de/entities/publication/a29dc685-ba0b-443d-97f7-5bc071d83b04
https://publica.fraunhofer.de/entities/publication/a29dfd42-6f9c-4c84-bf44-61668c75004c
https://publica.fraunhofer.de/entities/publication/a29e1899-94ae-440d-a2ee-426f7e98309f
https://publica.fraunhofer.de/entities/publication/a29e2b6b-b257-42df-be79-bd27797ae728
https://publica.fraunhofer.de/entities/publication/a29e47c1-4095-4213-a8b1-bdf8f4939447
https://publica.fraunhofer.de/entities/event/a29ea21f-331c-472e-994c-6bdf820c9fdf
https://publica.fraunhofer.de/entities/publication/a29eb714-f915-4ceb-bb38-a80771b0d684
https://publica.fraunhofer.de/entities/publication/a29ed65c-6e84-4d13-baf6-d071038aa048
https://publica.fraunhofer.de/entities/mainwork/a29f4715-e23b-4c98-ac66-c6abd493f390
https://publica.fraunhofer.de/entities/publication/a29f588f-722d-47dd-9880-70ed63f678c2
https://publica.fraunhofer.de/entities/publication/a29f72eb-e31b-4444-bd75-865db4a9aac2
https://publica.fraunhofer.de/entities/publication/a29fb1ae-689c-4598-8ab5-9a3114be4b4f
https://publica.fraunhofer.de/entities/publication/a29fc1b8-220c-462d-aba1-7fa6e00bea56
https://publica.fraunhofer.de/entities/publication/a29ff11a-ab4d-4e7c-95e5-a7dd316b0140
https://publica.fraunhofer.de/entities/publication/a2a00d74-a7f7-4f5d-9516-6cfc7666f85f
https://publica.fraunhofer.de/entities/mainwork/a2a01e36-65be-4dd2-a2a3-705a253e0b9d
https://publica.fraunhofer.de/entities/mainwork/a2a07c67-f67c-48e0-bff9-c2448d24c3c3
https://publica.fraunhofer.de/entities/publication/a2a07d97-d1ae-4825-8116-87fd32deed8c
https://publica.fraunhofer.de/entities/mainwork/a2a08041-768d-4d2f-920a-592eab8fc959
https://publica.fraunhofer.de/entities/project/a2a09a2b-b1ef-4fd0-b50e-e4ff2da79044
https://publica.fraunhofer.de/entities/publication/a2a09d4e-4597-412d-abb5-f6f58391e99d
https://publica.fraunhofer.de/entities/publication/a2a0e1ec-3644-4678-8845-404441d56905
https://publica.fraunhofer.de/entities/publication/a2a1043a-5cd2-4152-9d1f-3c58c30f28e8
https://publica.fraunhofer.de/entities/publication/a2a13fe6-9429-4a28-8467-941fb2502349
https://publica.fraunhofer.de/entities/publication/a2a15340-15a0-4bcb-a453-5ecf1c2e0ff6
https://publica.fraunhofer.de/entities/publication/a2a15abc-1ca3-4209-98f2-a341d0441147
https://publica.fraunhofer.de/entities/publication/a2a173d3-a9bd-481c-b5b8-218ac6834997
https://publica.fraunhofer.de/entities/publication/a2a19eef-2abd-479b-ba10-f11f03498e16
https://publica.fraunhofer.de/entities/publication/a2a1be0b-a76f-4595-b09e-0fc83839cd4c
https://publica.fraunhofer.de/entities/orgunit/a2a1c82f-b434-4ab2-a688-7a19c4744f12
https://publica.fraunhofer.de/entities/publication/a2a1ca28-3a68-406f-a751-d1c1cd93048d
https://publica.fraunhofer.de/entities/publication/a2a20a13-93d1-44ec-9a9a-922f0c250d8b
https://publica.fraunhofer.de/entities/event/a2a21d4e-09a7-4547-878f-876da182402f
https://publica.fraunhofer.de/entities/publication/a2a2435d-db43-4967-b3c8-85eb34dd75b0
https://publica.fraunhofer.de/entities/publication/a2a258cb-9ace-4e7e-8b4c-a45d5eb37dcf
https://publica.fraunhofer.de/entities/publication/a2a26893-27ce-41b0-a49a-bc8a320a20bf
https://publica.fraunhofer.de/entities/publication/a2a28416-1822-41e0-8975-f86799cb3329
https://publica.fraunhofer.de/entities/publication/a2a2aea7-2516-4904-9d07-4268e5702f40
https://publica.fraunhofer.de/entities/mainwork/a2a34341-0b26-441a-b8b9-0a711daec170
https://publica.fraunhofer.de/entities/publication/a2a34e5b-c57f-4344-9f33-e2d5ee15a11f
https://publica.fraunhofer.de/entities/publication/a2a36db9-3cf6-4574-a6f0-08b268a915ce
https://publica.fraunhofer.de/entities/person/a2a39977-8831-475a-b24c-d19047b7ab05
https://publica.fraunhofer.de/entities/publication/a2a3a7e5-1806-4047-b002-31f94b138e35
https://publica.fraunhofer.de/entities/publication/a2a3b2e4-03cb-45a4-8e85-20448b56cefb
https://publica.fraunhofer.de/entities/publication/a2a3bf64-1a35-45f1-ada8-b62089775674
https://publica.fraunhofer.de/entities/publication/a2a3c50b-5b36-437a-9fef-b93bd3c055cf
https://publica.fraunhofer.de/entities/publication/a2a3f93c-ad5b-4672-9cfc-9cd9ebb5cee6
https://publica.fraunhofer.de/entities/publication/a2a40def-9720-4959-83a0-068ed5141506
https://publica.fraunhofer.de/entities/mainwork/a2a41e19-fce5-486b-8c81-5d697cba80e9
https://publica.fraunhofer.de/entities/publication/a2a44e19-2481-457a-bc5f-1b732ef67827
https://publica.fraunhofer.de/entities/publication/a2a47880-cf37-4a9d-b0a1-d18fcd848e74
https://publica.fraunhofer.de/entities/mainwork/a2a4d9b9-d7d8-4ee8-92d5-5aaf3f29d8f9
https://publica.fraunhofer.de/entities/publication/a2a4dde6-f85d-4ab7-b0df-19fcb25c2c34
https://publica.fraunhofer.de/entities/mainwork/a2a4e36f-25db-4207-acf5-8eddcac091a9
https://publica.fraunhofer.de/entities/publication/a2a54b63-ad6c-4547-8c51-5d1a92c4c400
https://publica.fraunhofer.de/entities/publication/a2a57856-6240-4801-a192-790def963843
https://publica.fraunhofer.de/entities/publication/a2a58e71-02e8-46fb-a4f0-53935ed19146
https://publica.fraunhofer.de/entities/publication/a2a6118e-cf8d-4554-99a0-59b0e0f749b4
https://publica.fraunhofer.de/entities/publication/a2a622e0-8007-4f64-8ecc-c8157c3939df
https://publica.fraunhofer.de/entities/publication/a2a63f3a-78f9-4827-a10e-01c47d173141
https://publica.fraunhofer.de/entities/publication/a2a68add-7a43-4213-8bd9-da3fe666d22a
https://publica.fraunhofer.de/entities/publication/a2a6a864-24de-4513-aab8-58e9fa849a35
https://publica.fraunhofer.de/entities/publication/a2a6dbd7-da1f-4eb3-a19e-d352fe7684ab
https://publica.fraunhofer.de/entities/publication/a2a71521-31b6-453e-8f65-b034afa84ecf
https://publica.fraunhofer.de/entities/mainwork/a2a76091-f0b2-4d40-ba09-cd79805da636
https://publica.fraunhofer.de/entities/publication/a2a7a3c4-459a-487f-844b-60bc2962c2df
https://publica.fraunhofer.de/entities/orgunit/a2a7ba7c-29aa-4703-b15f-d7958404e47e
https://publica.fraunhofer.de/entities/journal/a2a7c88b-794a-4c09-8235-17581e11a0d1
https://publica.fraunhofer.de/entities/publication/a2a8154c-384a-4892-88e6-7e7220bc1610
https://publica.fraunhofer.de/entities/publication/a2a82c98-b062-438d-bbc2-496b394bc30f
https://publica.fraunhofer.de/entities/publication/a2a8a3d2-1072-4c55-82bc-36282fd44f9b
https://publica.fraunhofer.de/entities/publication/a2a8cf60-5f8b-40e8-8749-a8dc1fe44053
https://publica.fraunhofer.de/entities/publication/a2a8f024-3933-44f2-8547-4163336a4658
https://publica.fraunhofer.de/entities/publication/a2a8fdee-9aae-48c8-8742-177a253972c6
https://publica.fraunhofer.de/entities/publication/a2a9455a-5db7-4df9-b140-83ec6c4680d3
https://publica.fraunhofer.de/entities/project/a2a96d8e-5953-4191-a52b-bcb640676fc0
https://publica.fraunhofer.de/entities/publication/a2a974ad-27ec-4bc4-8188-40c0b6c9d705
https://publica.fraunhofer.de/entities/mainwork/a2a996c5-5370-4a04-96a4-8ce34da0d258
https://publica.fraunhofer.de/entities/publication/a2a99cf3-cdbc-468e-840f-36f9324d0aff
https://publica.fraunhofer.de/entities/publication/a2a9b9b8-bccf-4425-a018-aa09e47fae4c
https://publica.fraunhofer.de/entities/project/a2a9cb38-e156-46ae-8571-0755c2d058d7
https://publica.fraunhofer.de/entities/publication/a2a9efa8-dda0-4a71-920f-817062477ec9
https://publica.fraunhofer.de/entities/event/a2aa07d9-900d-403d-bb04-1583e0a1bdd5
https://publica.fraunhofer.de/entities/patent/a2aa90f7-162e-477f-8b46-2506c12ea90b
https://publica.fraunhofer.de/entities/publication/a2aaa477-adb7-4641-a2d7-2627355a8c3f
https://publica.fraunhofer.de/entities/publication/a2aabb0a-7050-4f60-a958-70cddc43d4b3
https://publica.fraunhofer.de/entities/publication/a2aacc40-8e63-417f-968d-d2672f64c08b
https://publica.fraunhofer.de/entities/publication/a2ab0102-dbd4-4935-ab76-52ed190f6f91
https://publica.fraunhofer.de/entities/publication/a2ab03dc-6397-451f-b336-71e5a7768c3b
https://publica.fraunhofer.de/entities/publication/a2ab66d4-deee-49d0-9cf7-84a6b73526a4
https://publica.fraunhofer.de/entities/publication/a2ab6b68-f1ba-4db8-86df-9cbc7e79cd8a
https://publica.fraunhofer.de/entities/mainwork/a2aba11d-3fc1-4f27-85f7-4574b6189124
https://publica.fraunhofer.de/entities/publication/a2ac16d1-9df0-4717-b3c2-33ef959fc16e
https://publica.fraunhofer.de/entities/publication/a2ac1ecb-6381-42bc-958a-9e9a694e1bfa
https://publica.fraunhofer.de/entities/publication/a2ac2e23-7755-4bc7-a989-030f51b88565
https://publica.fraunhofer.de/entities/publication/a2ac2fb0-76f9-4952-8371-ad3972cfcb79
https://publica.fraunhofer.de/entities/publication/a2ac465d-20d5-451c-bf88-b64210831853
https://publica.fraunhofer.de/entities/publication/a2ac7115-eac8-4357-b212-15eacfedca91
https://publica.fraunhofer.de/entities/publication/a2ac783c-895f-4574-806e-938f2ecfa40d
https://publica.fraunhofer.de/entities/publication/a2ac93a7-05f1-4c82-af18-226a757e2ba6
https://publica.fraunhofer.de/entities/publication/a2ace07d-aa88-407d-8998-a348800ca3b8
https://publica.fraunhofer.de/entities/mainwork/a2ace226-1de1-4cea-9cb6-c6e6efd479e2
https://publica.fraunhofer.de/entities/publication/a2acedd2-71a7-4c2c-8f4b-5fa7ef9f20a2
https://publica.fraunhofer.de/entities/publication/a2ad1b71-ff55-4312-8b36-a09daff52243
https://publica.fraunhofer.de/entities/publication/a2ad2473-c42f-48e0-a22a-63e4caea7021
https://publica.fraunhofer.de/entities/journal/a2ad3e03-af14-43ff-b174-4cb591d3c289
https://publica.fraunhofer.de/entities/patent/a2ad8ae5-7c04-4780-b199-16c9734e4add
https://publica.fraunhofer.de/entities/publication/a2adcbae-d87c-4367-9001-1ae63bb01030
https://publica.fraunhofer.de/entities/publication/a2adf0a0-1c06-405c-a3c1-6688183173d6
https://publica.fraunhofer.de/entities/publication/a2adf230-b954-435f-b188-34b197656165
https://publica.fraunhofer.de/entities/mainwork/a2ae1fca-ecc4-4107-87fc-4f17e1696ab9
https://publica.fraunhofer.de/entities/publication/a2ae53ad-7120-4471-b3a3-972d29ba00cb
https://publica.fraunhofer.de/entities/publication/a1bb1b56-bb3f-4f89-8fa9-9f605874bf14
https://publica.fraunhofer.de/entities/event/a1bb21a0-da8f-44a5-8462-e1fc05428497
https://publica.fraunhofer.de/entities/publication/a1bb3743-315f-401c-9812-4134c169809a
https://publica.fraunhofer.de/entities/publication/a1bb707b-9ca3-4241-ae29-e852f7427824
https://publica.fraunhofer.de/entities/funding/a1bb7fc4-0dce-4b69-b9b3-bacb8be7beb5
https://publica.fraunhofer.de/entities/publication/a1bbe823-92ac-4635-ad83-f790e957199c
https://publica.fraunhofer.de/entities/publication/a1bbf0f5-0999-4024-90bc-d5bf753d6c7c
https://publica.fraunhofer.de/entities/publication/a1bc0b8d-0f46-4fa3-9d4f-c1b3cbc8cebd
https://publica.fraunhofer.de/entities/publication/a1bc1908-f5e4-4e70-a941-6166a48e5812
https://publica.fraunhofer.de/entities/publication/a1bc620d-3819-417c-8797-b30c44a46524
https://publica.fraunhofer.de/entities/journal/a1bc6dc8-86f3-458f-8fd1-75e30075d9c8
https://publica.fraunhofer.de/entities/publication/a1bcaa1f-4aa8-45e2-9d56-069cc36b3e74
https://publica.fraunhofer.de/entities/publication/a1bd1b7b-5fd0-4bca-8c1e-2c46f7d2f797
https://publica.fraunhofer.de/entities/publication/a1bd2e92-0203-4111-9754-27a7a332403d
https://publica.fraunhofer.de/entities/mainwork/a1bd46ed-1e3d-43e8-b803-ebd1de331ab2
https://publica.fraunhofer.de/entities/publication/a1bd54c4-e6ce-4545-ac09-50d47ea868ad
https://publica.fraunhofer.de/entities/event/a1bd63aa-b19f-4407-9409-147390b76bae
https://publica.fraunhofer.de/entities/publication/a1bd752d-7710-4611-9038-86dd3dd206ce
https://publica.fraunhofer.de/entities/journal/a1bd7772-e9a5-44a8-8c0d-a2e0f2d65ffd
https://publica.fraunhofer.de/entities/mainwork/a1bdd6fe-f978-4184-a859-ebc55e2c9d9d
https://publica.fraunhofer.de/entities/publication/a1bdd747-b777-4465-be4b-6b51117b934e
https://publica.fraunhofer.de/entities/publication/a1bdeaa7-68f5-4206-bd75-5d9cc47f6a5b
https://publica.fraunhofer.de/entities/publication/a1bdf552-2c61-4467-a664-62bb335c47af
https://publica.fraunhofer.de/entities/publication/a1be1048-bd06-4ad2-b10c-f83ab5b9fbb9
https://publica.fraunhofer.de/entities/publication/a1be16ab-340b-4942-be6f-493e2a591526
https://publica.fraunhofer.de/entities/publication/a1be200d-a751-4ee2-b146-c54e31af09aa
https://publica.fraunhofer.de/entities/publication/a1be2804-f3ae-46a0-8853-473a54d14839
https://publica.fraunhofer.de/entities/publication/a1be330f-5c22-4310-ac7c-ebd5c745257d
https://publica.fraunhofer.de/entities/publication/a1be4317-d749-45f3-8dc8-63a9f22605ea
https://publica.fraunhofer.de/entities/publication/a1be8e02-5bfd-4cfb-bd12-a6b56b85bc32
https://publica.fraunhofer.de/entities/publication/a1be9250-437b-4274-a6ef-9f7fe7f74b1f
https://publica.fraunhofer.de/entities/publication/a1bed78c-ee75-499a-9652-862d52c9ff74
https://publica.fraunhofer.de/entities/publication/a1bed843-53dd-406d-8bbe-c9d050ef5b15
https://publica.fraunhofer.de/entities/publication/a1bede67-3c85-4c80-9b11-04aae3a58e68
https://publica.fraunhofer.de/entities/publication/a1bee93b-e229-49b7-b0f1-1c744de03b5f
https://publica.fraunhofer.de/entities/publication/a1bf31d1-8435-4103-a9ed-242afafadb75
https://publica.fraunhofer.de/entities/publication/a1bf5eaf-d968-4dfa-b233-0c99f09d6d0e
https://publica.fraunhofer.de/entities/project/a1bf68c0-63bf-420a-bb18-597310406b4a
https://publica.fraunhofer.de/entities/publication/a1bf7bb0-da4d-4cb8-ad1a-17a0f4602c6c
https://publica.fraunhofer.de/entities/publication/a1bf8e87-ab8f-4e51-937a-7b2591cca908
https://publica.fraunhofer.de/entities/event/a1bfd5ba-adbb-43a7-8844-eee05cd0e846
https://publica.fraunhofer.de/entities/publication/a1bfdb07-973f-4eef-867c-245f63907d9a
https://publica.fraunhofer.de/entities/publication/a1c062c9-1334-4033-bb8c-33c7eb7d22d1
https://publica.fraunhofer.de/entities/orgunit/a1c08d05-96a8-4370-a526-835c1fbdedd0
https://publica.fraunhofer.de/entities/publication/a1c09498-2396-4594-940f-8f16e9edd683
https://publica.fraunhofer.de/entities/publication/a1c0a678-3811-440e-bcd5-46a0f89e8e92
https://publica.fraunhofer.de/entities/publication/a1c0ad99-8ac0-4a49-8b8f-7bdfee01c4f0
https://publica.fraunhofer.de/entities/event/a1c0c088-77e4-4b4a-9ee3-90aecdef9314
https://publica.fraunhofer.de/entities/publication/a1c12838-9aed-446e-a28f-a3536da99445
https://publica.fraunhofer.de/entities/publication/a1c179ab-fb0a-4d76-8027-c6b5b22bd532
https://publica.fraunhofer.de/entities/publication/a1c1a912-e722-4af7-867a-05ec28dd3b96
https://publica.fraunhofer.de/entities/journal/a1c1e9fd-edc7-41e2-97a4-45d8182c58ee
https://publica.fraunhofer.de/entities/publication/a1c1eae0-0c84-4303-8119-af8fe0c20e92
https://publica.fraunhofer.de/entities/mainwork/a1c21075-5b20-42f6-a339-33d53fc2ffd5
https://publica.fraunhofer.de/entities/publication/a1c2202d-c16d-464c-b3a2-f4c133295ccd
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