https://publica.fraunhofer.de/entities/publication/80b2247e-793e-4e2c-9953-1c639eeb0e79
https://publica.fraunhofer.de/entities/publication/80b23ba7-98b8-462a-8e68-f53d9bc4ffeb
https://publica.fraunhofer.de/entities/orgunit/80b240f0-91d8-4827-8d1d-371c9d5fedf3
https://publica.fraunhofer.de/entities/publication/80b273ad-b442-4562-942f-8648664bde71
https://publica.fraunhofer.de/entities/patent/80b279cf-277f-4117-b98b-2697c137562c
https://publica.fraunhofer.de/entities/project/80b285dd-6116-4f90-95bd-6758aa326c85
https://publica.fraunhofer.de/entities/publication/80b2b991-a220-492d-8e94-1b9eec126710
https://publica.fraunhofer.de/entities/publication/80b3464a-ece6-4654-9012-7e3c2cbfc5b8
https://publica.fraunhofer.de/entities/event/80b349c4-9c44-4226-9516-c640ba79e249
https://publica.fraunhofer.de/entities/event/80b374b4-0938-489b-8fe4-e376038283fd
https://publica.fraunhofer.de/entities/publication/80b376ad-9c65-4727-96d0-0badfbfe0061
https://publica.fraunhofer.de/entities/publication/80b3799a-575b-4e86-861a-48b082b9e871
https://publica.fraunhofer.de/entities/event/80b40334-bb85-4ce7-a1b1-a9237cb44ebf
https://publica.fraunhofer.de/entities/publication/80b40cc4-4c85-4fb6-9492-653404ce10f5
https://publica.fraunhofer.de/entities/publication/80b4626d-39d6-4f7e-bbcb-e88d7c392190
https://publica.fraunhofer.de/entities/publication/80b467b9-dde3-487a-bdd1-4ea4ace4f32f
https://publica.fraunhofer.de/entities/publication/80b4aa03-af6f-46d6-aac2-ea51a30568cf
https://publica.fraunhofer.de/entities/publication/80b4b39d-df1d-4e51-bd00-49806a35e005
https://publica.fraunhofer.de/entities/publication/80b4ba1e-39fa-41e5-b320-72f2c03b0a53
https://publica.fraunhofer.de/entities/orgunit/80b4c88e-4f61-4971-a99e-1e20a563a989
https://publica.fraunhofer.de/entities/publication/80b511ba-46b0-485e-9064-e9097db46947
https://publica.fraunhofer.de/entities/publication/80b54fd1-aa64-4ea6-a658-6a48ae6515ed
https://publica.fraunhofer.de/entities/publication/80b59e21-9036-4209-a018-ad6b81837be7
https://publica.fraunhofer.de/entities/publication/80b5a739-a7b3-4093-b8f7-ae77b85247ea
https://publica.fraunhofer.de/entities/patent/80b5c967-2a04-4652-89f7-0b1a9cc9bb1e
https://publica.fraunhofer.de/entities/publication/80b60c61-94da-4208-a491-bc356314b53c
https://publica.fraunhofer.de/entities/event/80b62765-7d70-47e3-9aa9-763c54fdcd78
https://publica.fraunhofer.de/entities/mainwork/80b6cc06-9b30-4365-9e82-e4b2521de1b8
https://publica.fraunhofer.de/entities/project/80b6d98b-afa1-40d0-a7bb-e33b2b555a59
https://publica.fraunhofer.de/entities/publication/80b6f32b-15e9-401f-a345-4242be8438dd
https://publica.fraunhofer.de/entities/publication/80b6f3eb-6901-4ac5-8b2b-f183d47bfc33
https://publica.fraunhofer.de/entities/publication/80b6fbec-f912-421c-8d62-fb44ff5757b7
https://publica.fraunhofer.de/entities/publication/80b6fd28-9e3c-4960-8b8d-7a25b03efb22
https://publica.fraunhofer.de/entities/event/80b7cae6-bc28-40e7-a828-cfac3f4a7d38
https://publica.fraunhofer.de/entities/publication/80b7d6fe-09c2-4872-9699-4c18c105406d
https://publica.fraunhofer.de/entities/publication/80b82c77-bff6-4033-98d5-643104033031
https://publica.fraunhofer.de/entities/event/80b82fc4-f01d-436c-909a-abd28474f7f1
https://publica.fraunhofer.de/entities/publication/80b85843-f6f3-4db0-b4f5-c525be3569dd
https://publica.fraunhofer.de/entities/event/80b85e62-3214-4a5d-9245-b566ee10014d
https://publica.fraunhofer.de/entities/publication/80b88460-da87-4c5e-b715-e36ca3f40e4e
https://publica.fraunhofer.de/entities/event/80b8bf8c-1f5c-4e25-a476-db1e7f46be31
https://publica.fraunhofer.de/entities/publication/80b92203-5930-4ac8-ad85-c92d989867f9
https://publica.fraunhofer.de/entities/publication/80b94a45-42f6-406a-bade-cb605d1879fb
https://publica.fraunhofer.de/entities/publication/80b95f2d-1676-4faa-8d04-907c3f48ccbc
https://publica.fraunhofer.de/entities/publication/80b9839b-34b2-4e66-8245-a58dd54c36ab
https://publica.fraunhofer.de/entities/journal/80b9850f-0455-475d-a39b-fd01a7aa1e91
https://publica.fraunhofer.de/entities/publication/80b99d0a-6147-4aae-b0ce-854a2d3b6d94
https://publica.fraunhofer.de/entities/publication/80b9a730-9597-4da6-834d-f81006cb21a7
https://publica.fraunhofer.de/entities/publication/80b9af6d-8827-449a-9a13-5f19b8b911f5
https://publica.fraunhofer.de/entities/publication/80b9d835-0113-426c-9df1-453213b52eb6
https://publica.fraunhofer.de/entities/publication/80b9e3d0-bb43-4ab3-9858-d82737493860
https://publica.fraunhofer.de/entities/event/80ba2a4f-45c8-40f2-af83-4cf261250bc7
https://publica.fraunhofer.de/entities/publication/80ba5177-7aa8-48e6-b655-eea4570d7853
https://publica.fraunhofer.de/entities/journal/80ba9a7c-e237-4ae3-8919-1a7519551c9b
https://publica.fraunhofer.de/entities/event/80baac52-99de-445c-9081-40f4f1d1db0d
https://publica.fraunhofer.de/entities/publication/80bad148-5aec-4ed1-82d8-ef5cc43c5f4b
https://publica.fraunhofer.de/entities/patent/80bb1d7f-2f82-444f-b013-4d9a88a0b1b9
https://publica.fraunhofer.de/entities/mainwork/80bb4f89-bdcf-404e-8ec1-273553b4d793
https://publica.fraunhofer.de/entities/publication/80bb6f74-fb6a-428b-80e0-2c2efd04e6ad
https://publica.fraunhofer.de/entities/publication/80bb7e05-0f54-493f-81e8-cfdcc9a2ad1e
https://publica.fraunhofer.de/entities/journal/80bbb4b0-993a-4ceb-b90b-574ee3da7c7d
https://publica.fraunhofer.de/entities/publication/80bc06a4-9de8-44d3-b0ea-c1e8060a0613
https://publica.fraunhofer.de/entities/publication/80bc2231-7db6-4ece-8247-604964f998d0
https://publica.fraunhofer.de/entities/publication/80bc4311-91f6-4dcd-9ef6-898c8f714380
https://publica.fraunhofer.de/entities/publication/80bc58b2-5de5-49c3-9fbd-ecc9e428de24
https://publica.fraunhofer.de/entities/publication/80bc6529-a91e-43ac-b75b-a64737ae6927
https://publica.fraunhofer.de/entities/mainwork/80bcdd2a-cf5f-4392-9505-96c38049818d
https://publica.fraunhofer.de/entities/publication/80bcfcbd-2815-41b9-ae52-227c37bbcb6a
https://publica.fraunhofer.de/entities/event/80bd05f4-e8d4-47d2-a714-49d1ff4cce54
https://publica.fraunhofer.de/entities/mainwork/80bd1827-caf1-4654-a809-e43b9a1ad072
https://publica.fraunhofer.de/entities/publication/80bd555f-ef46-4ce9-a35a-f54ae8f673a6
https://publica.fraunhofer.de/entities/publication/80bd8dff-8990-43ab-a7c0-c0eee97b2064
https://publica.fraunhofer.de/entities/publication/80bd8f3c-1a09-40b4-ba95-c7a5ea5ebad1
https://publica.fraunhofer.de/entities/publication/80bdb5f6-efa8-483e-ac46-1061ed849883
https://publica.fraunhofer.de/entities/mainwork/80bdce89-b1a8-4e62-896e-0c8a6b885b86
https://publica.fraunhofer.de/entities/publication/80bdecb5-c2df-46eb-869c-5f1d039e1299
https://publica.fraunhofer.de/entities/journal/80bdf6a9-e038-467e-82ec-e0039e4e4eed
https://publica.fraunhofer.de/entities/publication/80bdfeb4-7567-4c2e-a9c4-b997253d9902
https://publica.fraunhofer.de/entities/publication/80be2c94-2523-420b-ba43-9ba0b4b25a5c
https://publica.fraunhofer.de/entities/event/80be54d7-8592-4f9d-aad6-4ecf1d46fbe8
https://publica.fraunhofer.de/entities/journal/80bee6a1-6ca0-4d68-bf30-9921f699bf62
https://publica.fraunhofer.de/entities/publication/80bf033c-3f22-4f2a-bb31-14a1dffe3284
https://publica.fraunhofer.de/entities/publication/80bf1ca2-8c63-4021-abf5-05f7f8a16928
https://publica.fraunhofer.de/entities/publication/80bf27ee-371f-41d4-b665-981a44920220
https://publica.fraunhofer.de/entities/orgunit/80bf52e5-8a8b-40c4-b4cd-889a6fc294a5
https://publica.fraunhofer.de/entities/publication/80bf7a87-21b4-4069-a5e8-5269e785c7d7
https://publica.fraunhofer.de/entities/event/80bfb05d-77e9-4ff1-938a-bf3195da1397
https://publica.fraunhofer.de/entities/publication/80bfcf62-94a4-4ffe-b08d-778e3fcdb71e
https://publica.fraunhofer.de/entities/publication/80bfd3ec-1f5a-4aa3-8d10-b1da72ca1e70
https://publica.fraunhofer.de/entities/publication/80bff5eb-63ac-4b08-aec8-2fdb4c508d18
https://publica.fraunhofer.de/entities/publication/80c00f44-750a-42ef-b591-daf9f613570f
https://publica.fraunhofer.de/entities/publication/80c04510-4812-4a3b-a02a-1c67e795d965
https://publica.fraunhofer.de/entities/publication/80c05e1d-759a-4883-8aeb-1b47bc077db9
https://publica.fraunhofer.de/entities/publication/80c082ea-ac93-4a55-a0f0-edacf0d563c2
https://publica.fraunhofer.de/entities/publication/80c0ddf9-2b40-4d7c-8e7d-703e8a57fcd6
https://publica.fraunhofer.de/entities/event/80c0e303-5cb5-4dad-8cd8-693947ea66a7
https://publica.fraunhofer.de/entities/publication/80c0f1ad-b0a1-4df5-8d31-01c9f2cc02fa
https://publica.fraunhofer.de/entities/patent/80c10328-3e3c-4d8a-83f2-8f742e2c55b7
https://publica.fraunhofer.de/entities/patent/80c18ce9-cff3-46f0-8c17-b398984b79d3
https://publica.fraunhofer.de/entities/event/80c1ff76-55d9-4e61-9776-493ba3f00ced
https://publica.fraunhofer.de/entities/event/80c2137d-265e-44f5-8c90-4f40b97016a3
https://publica.fraunhofer.de/entities/publication/80c22699-3344-43a8-8d73-91cf0654028b
https://publica.fraunhofer.de/entities/orgunit/80c240bd-182c-450b-9fbb-030a0fc8538e
https://publica.fraunhofer.de/entities/mainwork/80c2724d-0424-49ad-80ac-4ca4a824432e
https://publica.fraunhofer.de/entities/publication/80c29986-0142-40d2-9b65-2909d75742c2
https://publica.fraunhofer.de/entities/publication/80c2a113-1312-4926-966f-85d28084e4d2
https://publica.fraunhofer.de/entities/publication/80c2c2b7-cd16-4d7d-ab8f-9a9fcca039ca
https://publica.fraunhofer.de/entities/journal/80c2d0a3-60eb-47b6-aab0-d6e7e7962cc2
https://publica.fraunhofer.de/entities/publication/80c2d4fa-5642-42f2-a9db-06fe94dec4a1
https://publica.fraunhofer.de/entities/mainwork/80c2d8b0-fb2b-4f18-848c-a27b01b27e3f
https://publica.fraunhofer.de/entities/publication/80c2ebb6-0271-48eb-9b79-f0f213a25acf
https://publica.fraunhofer.de/entities/publication/80c30dab-af04-49d9-ba52-0bef43d0e3b9
https://publica.fraunhofer.de/entities/orgunit/80c3257f-14ea-4b61-8cef-79f1c4936a39
https://publica.fraunhofer.de/entities/publication/80c32936-5188-4d78-a7a6-4ff9a62bb58b
https://publica.fraunhofer.de/entities/mainwork/80c33c82-092d-4ceb-ae88-1fa1bcd63e9a
https://publica.fraunhofer.de/entities/publication/80c353d3-6487-4d91-981c-e6ef02dcab25
https://publica.fraunhofer.de/entities/event/80c37a28-6ac7-4f4b-8ed7-7d50f1a6997c
https://publica.fraunhofer.de/entities/publication/80c3ba8a-46f0-496c-a752-120cb3752f19
https://publica.fraunhofer.de/entities/publication/80c3eadb-05ce-4fad-875c-e42f6151ab8a
https://publica.fraunhofer.de/entities/publication/80c47154-c37a-4f80-abe6-38c9b5ba0817
https://publica.fraunhofer.de/entities/publication/80c4911a-6de4-4fb7-b66b-1e467cc87819
https://publica.fraunhofer.de/entities/event/80c493cb-85fe-4ff2-958e-8669e546e6e3
https://publica.fraunhofer.de/entities/publication/80c4bdf1-4e07-41d2-b291-5f1b9f9bb964
https://publica.fraunhofer.de/entities/publication/80c4d449-bf37-49fb-bd7f-ed4b4bf7d572
https://publica.fraunhofer.de/entities/publication/80c4e1e5-1cc2-4ef9-a43e-5fa77ef58f9f
https://publica.fraunhofer.de/entities/publication/80c4f44d-2103-4fa1-ba90-e6d5e7aa92da
https://publica.fraunhofer.de/entities/publication/80c4ff90-7c40-4015-973a-724a719391ef
https://publica.fraunhofer.de/entities/project/80c520d1-b163-479e-88b1-0ce6d491a278
https://publica.fraunhofer.de/entities/publication/80c53717-5bf5-44fc-a325-281d95924df5
https://publica.fraunhofer.de/entities/mainwork/80c54a0d-5f4b-43d5-9381-43e17ea6e8a5
https://publica.fraunhofer.de/entities/publication/80c59ec7-c23e-424b-9bfb-0c58a3d53dd7
https://publica.fraunhofer.de/entities/publication/80c5d0b6-08fa-4dde-9a71-8bbe94b723b4
https://publica.fraunhofer.de/entities/event/80c61642-3304-42a3-ac6e-09cc341b71e1
https://publica.fraunhofer.de/entities/patent/80c61de8-b17a-4b85-9eb8-1c1b17fe40a8
https://publica.fraunhofer.de/entities/publication/80c63334-60ad-431a-84b1-3ca09d2c21d5
https://publica.fraunhofer.de/entities/publication/80c694ac-41f8-46fe-9435-19b545806d47
https://publica.fraunhofer.de/entities/publication/80c6b54c-9987-4ebd-8969-126a916f2deb
https://publica.fraunhofer.de/entities/publication/80c6d462-ecd0-426e-9cef-57e71fa4bfed
https://publica.fraunhofer.de/entities/publication/80c6d555-e085-4488-b43f-d8f2a287a620
https://publica.fraunhofer.de/entities/publication/80c6dc51-e0b5-465b-9bc6-fabc0a7bcfb4
https://publica.fraunhofer.de/entities/publication/80c6dfd9-a9f9-4064-9fba-88b6308a1bcd
https://publica.fraunhofer.de/entities/publication/80c723c1-ff62-4790-80f4-8abd41c2f5d5
https://publica.fraunhofer.de/entities/mainwork/80c73b8e-77e9-401a-b9ff-c2e1aa37a8a3
https://publica.fraunhofer.de/entities/publication/80c74446-1b2c-45f2-bff5-ffc663f2eff8
https://publica.fraunhofer.de/entities/event/80c7483f-2cdc-4852-aebe-a2486664e1e5
https://publica.fraunhofer.de/entities/publication/80c752fd-7b05-4a31-9390-349fad685fc7
https://publica.fraunhofer.de/entities/publication/80c799ad-9546-4dc3-8a7c-b24c4c1ccfe7
https://publica.fraunhofer.de/entities/event/80c7babd-1d7e-42c6-9093-1c43b7145023
https://publica.fraunhofer.de/entities/mainwork/80c7d176-acba-463e-9abe-c6880fe12caa
https://publica.fraunhofer.de/entities/publication/80c7d40f-2a4b-47b1-a86b-874b6936d855
https://publica.fraunhofer.de/entities/publication/80c7d5a5-62da-4df2-95ee-5be5f4c8745a
https://publica.fraunhofer.de/entities/publication/80c7dc30-c910-44e3-b68d-3eb5a35a89ad
https://publica.fraunhofer.de/entities/publication/80c7f35b-6af8-4968-bd17-a0f651968a58
https://publica.fraunhofer.de/entities/event/80c839af-aceb-4d42-bbc2-4d187c1ca55c
https://publica.fraunhofer.de/entities/publication/80c8430a-4ec9-43af-9d1f-a64946b9c1e3
https://publica.fraunhofer.de/entities/publication/80c84edc-f1a8-4740-92c2-c450dd5049c7
https://publica.fraunhofer.de/entities/event/80c88ce3-a56f-406f-ab2a-541e157c87c6
https://publica.fraunhofer.de/entities/publication/80c91db0-a32b-4d70-8f3f-c768cea96401
https://publica.fraunhofer.de/entities/publication/80c9cdd7-c9a7-4ff5-a45f-1d5ed18d144e
https://publica.fraunhofer.de/entities/publication/80c9d1f3-0bb4-427a-81c4-359fbff0a904
https://publica.fraunhofer.de/entities/event/80c9f254-618f-4be2-b316-6273ca327173
https://publica.fraunhofer.de/entities/publication/80c9f7fd-f496-41b3-a114-9176bd311ce4
https://publica.fraunhofer.de/entities/publication/80ca52d7-e94e-449f-8825-4874ac8763d1
https://publica.fraunhofer.de/entities/event/80ca53e6-67f1-42b2-b98d-7f1f23a88bc3
https://publica.fraunhofer.de/entities/mainwork/80ca8d8a-2f41-465d-8812-0bd45d8d7d21
https://publica.fraunhofer.de/entities/event/80caa2e4-4b05-4cc5-ba69-a2d27ab6d175
https://publica.fraunhofer.de/entities/mainwork/80cadea9-8baa-47ac-81f1-08823c9eed5b
https://publica.fraunhofer.de/entities/event/80cb1cfc-e525-42ab-a392-c31cd7a0e992
https://publica.fraunhofer.de/entities/publication/80cb4750-d1b3-4d9c-9b99-08bed58e82ee
https://publica.fraunhofer.de/entities/publication/80cc0858-b599-4dfb-a989-63e480b760f9
https://publica.fraunhofer.de/entities/event/80cc3661-6228-42ff-9591-ad4018ac6c2f
https://publica.fraunhofer.de/entities/publication/80cc98bf-4239-4fe8-993b-b395129b4719
https://publica.fraunhofer.de/entities/orgunit/80ccec3a-ba0e-4c9a-a151-cdde659d64be
https://publica.fraunhofer.de/entities/publication/80cd02ed-f834-41e9-b4ee-d3fc4822f0f4
https://publica.fraunhofer.de/entities/publication/80cd2849-a6cd-4d9f-9c9e-6856985a74f0
https://publica.fraunhofer.de/entities/publication/80cd29ac-0cdf-4604-a6fd-4e700a3017a2
https://publica.fraunhofer.de/entities/mainwork/80cd5987-8bed-4c11-8982-52ecdde598c2
https://publica.fraunhofer.de/entities/publication/80cd5d41-aa2d-48bb-af92-7941c3efb972
https://publica.fraunhofer.de/entities/publication/80cd6fc0-2372-45e2-b00f-850e611eab26
https://publica.fraunhofer.de/entities/event/80cd758e-1d2c-4194-a684-244c7bf61699
https://publica.fraunhofer.de/entities/orgunit/80cdc56d-8fd4-480f-8319-b85c08b47e07
https://publica.fraunhofer.de/entities/journal/80cdecec-0200-450e-b3b4-3d265b957b79
https://publica.fraunhofer.de/entities/publication/80ce4d29-90ce-4fd6-a670-3853150473f1
https://publica.fraunhofer.de/entities/mainwork/80ce6d45-b3bb-4190-a09c-5395c48535eb
https://publica.fraunhofer.de/entities/mainwork/80ce9209-0fc6-4956-a73d-11005c104ab5
https://publica.fraunhofer.de/entities/publication/80cee1d1-d9cf-41dc-b610-129645b5bc06
https://publica.fraunhofer.de/entities/publication/80cee71a-c558-4016-b28e-21cd25cae8f9
https://publica.fraunhofer.de/entities/event/80cf38a5-289c-4695-b0e9-8b85eee57c0e
https://publica.fraunhofer.de/entities/publication/80cf3b69-5850-43f5-a1da-29b68af169da
https://publica.fraunhofer.de/entities/publication/80cfa58d-4642-46c3-a5d5-aef9c9e7c50f
https://publica.fraunhofer.de/entities/publication/80cfb593-8f44-4fa8-b6c5-8ce6c3ffeb3a
https://publica.fraunhofer.de/entities/mainwork/80cfb948-6bfd-44c2-be64-6d3efb628f8c
https://publica.fraunhofer.de/entities/publication/80cfd290-4719-4144-85e4-53cecc28eb7b
https://publica.fraunhofer.de/entities/person/80cfd7fe-806b-48ff-9114-0f065c8304f6
https://publica.fraunhofer.de/entities/publication/80cfe04f-4e4b-46bb-9ffa-75c6a00f82a3
https://publica.fraunhofer.de/entities/patent/80cfe7cf-0257-4fdd-af61-d49aa9d2b7d7
https://publica.fraunhofer.de/entities/publication/80d00ff5-c5ed-4ea3-a356-53dfc96301a1
https://publica.fraunhofer.de/entities/publication/80d01e7c-665a-419a-8164-5261b84ad988
https://publica.fraunhofer.de/entities/publication/80d0c348-618d-44a7-bf31-c201bdf24eb8
https://publica.fraunhofer.de/entities/patent/80d0cbc6-59cf-4942-9777-802ac809881b
https://publica.fraunhofer.de/entities/patent/80d0f5b9-6fdb-4a20-9a48-2444e08fd1f9
https://publica.fraunhofer.de/entities/publication/80d153f2-d2a9-4115-a634-fac52d600ab9
https://publica.fraunhofer.de/entities/publication/80d16c5a-5f85-4c6c-82b4-4adce054d154
https://publica.fraunhofer.de/entities/mainwork/80d1be5b-deb3-4110-b15b-ff890e835218
https://publica.fraunhofer.de/entities/publication/80d1e205-9544-4100-a7d8-59a34306da1f
https://publica.fraunhofer.de/entities/mainwork/80d238a6-843a-4143-8dda-104f61ac3624
https://publica.fraunhofer.de/entities/publication/80d25258-3787-479a-8136-729a0a309740
https://publica.fraunhofer.de/entities/publication/80d27835-0542-4b04-aa18-c12e4f930ff5
https://publica.fraunhofer.de/entities/publication/80d2bf5e-f5b3-4c72-9a88-51d9c73b7288
https://publica.fraunhofer.de/entities/publication/80d2f895-f4c3-4108-ab67-ed51a8f46674
https://publica.fraunhofer.de/entities/publication/80d32ba8-538c-441e-a269-2a4cc18abac0
https://publica.fraunhofer.de/entities/publication/80d380e7-9b61-48e1-9f6c-b6874c24778c
https://publica.fraunhofer.de/entities/orgunit/80d38ed5-a97f-4b7f-b3cd-1a5b44ce12d7
https://publica.fraunhofer.de/entities/publication/80d3c6d7-1203-4135-86fd-e96a39924591
https://publica.fraunhofer.de/entities/publication/80d3c9bf-5e3c-440d-bb71-2d15b69b4386
https://publica.fraunhofer.de/entities/event/80d3ee2f-2476-400b-9b00-ac3963cfc17a
https://publica.fraunhofer.de/entities/patent/80d3fd51-7fd0-4915-9e50-3b76b3cf6788
https://publica.fraunhofer.de/entities/orgunit/80d52ced-d939-4f28-a3c5-fd64643f2a5f
https://publica.fraunhofer.de/entities/patent/80d53a30-d335-4a3d-9fae-b049aef48307
https://publica.fraunhofer.de/entities/event/80d551e6-b7b5-495b-a5d2-690d602b58c6
https://publica.fraunhofer.de/entities/publication/80d57a52-4777-4b59-9910-7bc4cc1420f8
https://publica.fraunhofer.de/entities/journal/80d585b2-4cc7-460a-b153-06fabeb87034
https://publica.fraunhofer.de/entities/publication/80d5c481-64b1-4251-aa72-6eb2ca6869b8
https://publica.fraunhofer.de/entities/mainwork/80d5cb91-9037-4bae-822d-371f7d3ccb03
https://publica.fraunhofer.de/entities/person/80d6528d-14c0-4a54-9c2f-7b8a0afa1ca9
https://publica.fraunhofer.de/entities/publication/80d658f1-2bc1-4aa2-81a0-49e2292b59c9
https://publica.fraunhofer.de/entities/event/80d69ec9-3123-4a2c-8ca4-a2a8d37640ec
https://publica.fraunhofer.de/entities/publication/80d6b48c-29cb-4877-b144-16066df9d437
https://publica.fraunhofer.de/entities/event/80d74b76-6321-4f40-827e-bbd16ec85a7b
https://publica.fraunhofer.de/entities/publication/80d751eb-7dac-43b2-9c88-8e727cb2d08d
https://publica.fraunhofer.de/entities/publication/80d753d0-c2f1-4b3f-8647-c7b2cd43801e
https://publica.fraunhofer.de/entities/publication/80d758ba-4da9-45a5-80da-8c83d7d42c50
https://publica.fraunhofer.de/entities/event/80d78c42-9265-4cd8-afea-650fa07a5e10
https://publica.fraunhofer.de/entities/publication/80d7fbd3-429b-48ff-8b7c-b3ecb183d2fa
https://publica.fraunhofer.de/entities/mainwork/80d819d8-fb97-4207-9354-079df5f4889c
https://publica.fraunhofer.de/entities/event/80d84c88-e4df-43b0-88dd-873cbe4a57f3
https://publica.fraunhofer.de/entities/publication/80d87413-025f-4ea1-b872-aadc7fe9c7eb
https://publica.fraunhofer.de/entities/publication/80d87449-02a8-45fb-9720-de99328c4946
https://publica.fraunhofer.de/entities/event/80d87a24-d71f-4e18-a7fb-69fba0df2129
https://publica.fraunhofer.de/entities/publication/80d8b5c0-1032-4329-8cd9-8d4c62126727
https://publica.fraunhofer.de/entities/publication/80d8d6b3-ac71-4ecb-8e49-275604dbdd01
https://publica.fraunhofer.de/entities/event/80d90895-ef4a-48dc-8333-93a4ac7aa2ac
https://publica.fraunhofer.de/entities/orgunit/80d921f7-0636-4c18-a96a-8c04a7ca4d24
https://publica.fraunhofer.de/entities/event/80d92994-d031-49b8-8913-a57fa41dc0ec
https://publica.fraunhofer.de/entities/publication/80d92f8d-ccff-4897-81fe-de474cf75ae7
https://publica.fraunhofer.de/entities/event/80d97592-4e7b-4dcc-bdba-006917245aa0
https://publica.fraunhofer.de/entities/publication/80d98c13-999d-4e11-8dcb-acd95f29f407
https://publica.fraunhofer.de/entities/publication/80d991a7-1b9f-473d-bb84-9f0ab46d0bc2
https://publica.fraunhofer.de/entities/publication/80d9afbc-3ee8-4610-974a-ba96617927c6
https://publica.fraunhofer.de/entities/publication/80d9baa0-c57e-4a3e-bc91-36c95b10be52
https://publica.fraunhofer.de/entities/orgunit/80d9c25d-07fb-4c5d-90db-77e917b831c8
https://publica.fraunhofer.de/entities/publication/80d9d718-d604-4b44-ae02-9124af4c8b77
https://publica.fraunhofer.de/entities/publication/80d9d722-2bd3-493c-89b5-426ef7138e6d
https://publica.fraunhofer.de/entities/orgunit/80d9e0ae-9620-4b0b-a870-7f27df9513e2
https://publica.fraunhofer.de/entities/patent/80da06ea-aa88-4848-803c-92fd33f09391
https://publica.fraunhofer.de/entities/project/80da118b-e5b0-4e71-947f-8f8dd17bc9ec
https://publica.fraunhofer.de/entities/publication/80da1ad1-ce09-4fd5-aca2-426857095638
https://publica.fraunhofer.de/entities/publication/80da3788-fcb9-47b3-83cc-73a1d0f310f8
https://publica.fraunhofer.de/entities/publication/8050e6f6-7349-4410-a5c3-97de7ad37532
https://publica.fraunhofer.de/entities/publication/80510350-72f6-48d4-a59f-c9931d776870
https://publica.fraunhofer.de/entities/publication/80510ca5-2629-4955-a8b6-894466b2f3e6