• English
  • Deutsch
  • Log In
    Password Login
    or
  • Research Outputs
  • Projects
  • Researchers
  • Institutes
  • Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Hauptwerk
  4. EMPC 2009, 17th European Microelectronics and Packaging Conference & Exhibition. CD-ROM
 
  • Information
  • Publications
Options
Title

EMPC 2009, 17th European Microelectronics and Packaging Conference & Exhibition. CD-ROM

Titel Supplements
June 15th-18th, 2009 , Rimini, Italy
Institut
International Microelectronics and Packaging Society -IMAPS-, Italian Chapter
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
IEEE
Verlagsort
New York, NY
Datum
2009
ISBN
0-615-29868-0
978-0-615-29868-9
978-1-4244-4722-0
Konferenz
European Microelectronics and Packaging Conference and Exhibition (EMPC) 2009
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Send Feedback
© 2022