https://publica.fraunhofer.de/entities/publication/b08a77fe-8121-4a59-bc95-6a5918caedd1
https://publica.fraunhofer.de/entities/publication/b08ae3a3-503e-4511-827d-dad7f392a69b
https://publica.fraunhofer.de/entities/publication/b08b75fd-fcff-4ffa-9fba-9c4cd7d9ba55
https://publica.fraunhofer.de/entities/publication/b08b8e63-9662-4dbf-904c-0d0eda87a728
https://publica.fraunhofer.de/entities/publication/b08b9712-e7f3-4f0b-8b51-825712b8ab57
https://publica.fraunhofer.de/entities/publication/b08ba390-6135-4cdc-a302-2a9c9e3f0df8
https://publica.fraunhofer.de/entities/publication/b08c21d6-1dfb-491a-854d-d3113af73a2a
https://publica.fraunhofer.de/entities/publication/b08c4ae6-dab0-4de7-8271-3bae23b516b8
https://publica.fraunhofer.de/entities/mainwork/b08c4be2-19f6-481f-98bb-cebe66a315d3
https://publica.fraunhofer.de/entities/event/b08c5c0c-53ef-47c9-83e7-f98d357526d2
https://publica.fraunhofer.de/entities/publication/b08c6417-b843-40ef-af66-d30d64ef216b
https://publica.fraunhofer.de/entities/mainwork/b08c6bce-fabd-4859-ba73-42dda1023d9f
https://publica.fraunhofer.de/entities/mainwork/b08c70bd-6b65-40cc-806d-ee6d72300273
https://publica.fraunhofer.de/entities/publication/b08cae93-6140-44ce-99e1-65c71cbedd8c
https://publica.fraunhofer.de/entities/event/b08cb425-40ea-4395-bc73-c6c558c17439
https://publica.fraunhofer.de/entities/project/b08cf335-b9de-420f-9ece-6e8648a273dc
https://publica.fraunhofer.de/entities/publication/b08d26ac-3d88-4a58-8395-28e1d808357d
https://publica.fraunhofer.de/entities/publication/b08d2936-2f1e-4017-a444-5e124ed714a0
https://publica.fraunhofer.de/entities/mainwork/b08d2aa2-f53d-460f-a97f-c3438544eddf
https://publica.fraunhofer.de/entities/publication/b08d31cd-001e-447b-b5d2-839890bef4e3
https://publica.fraunhofer.de/entities/publication/b08d9594-ae80-4454-a98d-90cbe918b447
https://publica.fraunhofer.de/entities/publication/b08db905-40b3-4f5c-8391-c7028c2dd6a3
https://publica.fraunhofer.de/entities/publication/b08dc871-bdbb-4e2c-833e-c23074dff79b
https://publica.fraunhofer.de/entities/publication/b08e22a1-9250-4fb0-b3cd-9833b9708998
https://publica.fraunhofer.de/entities/publication/b08e3974-6929-4559-ba80-bd99c76372b7
https://publica.fraunhofer.de/entities/publication/b08e3e36-75c1-4067-9432-b5f1f8d99572
https://publica.fraunhofer.de/entities/event/b08e475b-57d1-4544-bb52-131cb14b7f68
https://publica.fraunhofer.de/entities/publication/b08e4802-89c1-4749-86ca-4aecbc946007
https://publica.fraunhofer.de/entities/publication/b08e5403-cfa4-4714-8bb0-eec4db464ed9
https://publica.fraunhofer.de/entities/publication/b08e740e-faf8-4ece-954e-ac1d6765c7c1
https://publica.fraunhofer.de/entities/publication/b08e7888-8733-4162-ae05-3c17e518938c
https://publica.fraunhofer.de/entities/publication/b08e7ef2-2bc0-43af-9ab3-00ca4b653bbf
https://publica.fraunhofer.de/entities/publication/b08eede0-f121-4734-85e5-c5e214bf1892
https://publica.fraunhofer.de/entities/publication/b08ef0f0-bdf8-4a1e-a801-e289b3b91c4d
https://publica.fraunhofer.de/entities/event/b08f0468-899d-4622-ba04-fb9820d12e24
https://publica.fraunhofer.de/entities/publication/b08f0824-e75b-4056-ad38-f4e6a37936fe
https://publica.fraunhofer.de/entities/patent/b08f0c6f-4d19-4701-a64d-cb58fce3ed8a
https://publica.fraunhofer.de/entities/event/b08f3c4b-ced0-423f-b3fe-2c1a8b77d623
https://publica.fraunhofer.de/entities/publication/b08f4c4d-5949-47d0-b7fa-3073c23d96c8
https://publica.fraunhofer.de/entities/publication/b08f6083-a287-4081-bfbd-13919ea24a08
https://publica.fraunhofer.de/entities/mainwork/b08f66e9-8f80-4c94-bd72-cf3199770272
https://publica.fraunhofer.de/entities/publication/b08fbe0f-5cda-4ce0-8a19-e6fa496e5f49
https://publica.fraunhofer.de/entities/event/b08fc3f3-4e2a-457a-b9d6-269be5191e64
https://publica.fraunhofer.de/entities/publication/b08fc431-ef9f-4987-83d5-3a211cebd456
https://publica.fraunhofer.de/entities/publication/b08fee47-120d-4c8a-9065-abf195ead1ef
https://publica.fraunhofer.de/entities/publication/b0904336-6632-4cca-942f-caa740cc129a
https://publica.fraunhofer.de/entities/publication/b0905f4f-8200-46c5-9b7a-844daab529bf
https://publica.fraunhofer.de/entities/publication/b09083d5-8ddf-4b29-9cbf-7cb9dc26425f
https://publica.fraunhofer.de/entities/publication/b0909574-e893-49fb-853d-0c5e6b3d00db
https://publica.fraunhofer.de/entities/publication/b090b9e1-3759-4fdd-bc3d-3a99b20e76e9
https://publica.fraunhofer.de/entities/mainwork/b090f9c1-fb12-4b0b-a0fc-c18adaeab1bc
https://publica.fraunhofer.de/entities/publication/b0910460-fcac-49dd-935f-e9a133eeb09d
https://publica.fraunhofer.de/entities/publication/b09188c1-ac24-421b-9abe-4e8afc8a392e
https://publica.fraunhofer.de/entities/publication/b0919e95-787c-4938-9829-9e988f4c524d
https://publica.fraunhofer.de/entities/event/b091b9a2-d0b4-4dc7-a3e1-f46025e60338
https://publica.fraunhofer.de/entities/publication/b0926b0e-3bac-442a-a690-5dea3de7d2fc
https://publica.fraunhofer.de/entities/publication/b09293c9-3620-4984-b70c-00d21a680ecf
https://publica.fraunhofer.de/entities/publication/b092ba3a-fcb9-49e9-acd1-0faad330d479
https://publica.fraunhofer.de/entities/publication/b092bc9e-3f77-4a29-9bb5-51289102985a
https://publica.fraunhofer.de/entities/person/b0934d5f-9110-4d8b-905b-6e77c315ec6a
https://publica.fraunhofer.de/entities/publication/b0935737-3b6a-40f8-aecb-39388cb1e1e1
https://publica.fraunhofer.de/entities/event/b0939164-0d5c-4cd9-acb0-1c11eb066f5e
https://publica.fraunhofer.de/entities/publication/b093da9b-0702-45f3-8b4d-137386ec87c7
https://publica.fraunhofer.de/entities/publication/b0940af4-a3f5-4269-bb90-0621168528f2
https://publica.fraunhofer.de/entities/publication/b09416d0-200b-46d8-a8d1-23f86ea10db9
https://publica.fraunhofer.de/entities/event/b0942afb-eada-4b96-af54-60c7303c5f59
https://publica.fraunhofer.de/entities/publication/b0945e37-64df-4dbb-8d66-e40456dc2281
https://publica.fraunhofer.de/entities/event/b094b14f-a43f-4252-8595-e3669a280462
https://publica.fraunhofer.de/entities/publication/b094f144-c171-4d2b-983a-2306897ffc9a
https://publica.fraunhofer.de/entities/publication/b0953a8f-14f4-427e-84ab-6a9de117547f
https://publica.fraunhofer.de/entities/journal/b0954f62-f95f-4fc0-b5d4-905fa19a7657
https://publica.fraunhofer.de/entities/publication/b0961b3c-19d6-484c-9889-6517863a2cf1
https://publica.fraunhofer.de/entities/publication/b0964970-e40d-498a-b606-2bc3551ce576
https://publica.fraunhofer.de/entities/mainwork/b09651b3-f91a-48a1-b5b0-b900a2b11d44
https://publica.fraunhofer.de/entities/publication/b09672f0-d9ef-496d-a40c-6a6c3ea5f3ba
https://publica.fraunhofer.de/entities/publication/b096aa29-469f-4e75-897f-9ebc3f240a56
https://publica.fraunhofer.de/entities/publication/b096f42d-25b7-4c53-85be-7a553103274e
https://publica.fraunhofer.de/entities/publication/b096f4ea-2e24-4843-ab41-a438f19c4599
https://publica.fraunhofer.de/entities/publication/b096f6fd-44f8-4a6b-9061-ef08096a729a
https://publica.fraunhofer.de/entities/publication/b09800e0-e872-4e80-b7a8-238ac52484a6
https://publica.fraunhofer.de/entities/publication/b0981665-ec35-4f0a-aa1e-954df91159a1
https://publica.fraunhofer.de/entities/orgunit/b0982d54-b17e-4881-93c7-7a294935a792
https://publica.fraunhofer.de/entities/event/b0985327-216d-4050-8333-9954262e3c39
https://publica.fraunhofer.de/entities/publication/b09861e7-a62c-4364-82fd-0b6c32cf0413
https://publica.fraunhofer.de/entities/publication/b098658f-2fdc-4ef3-ac2f-2ec04b2f8442
https://publica.fraunhofer.de/entities/publication/b09896fe-147d-40b8-9fec-4f89fb57ff41
https://publica.fraunhofer.de/entities/event/b098a2a1-6981-40c2-bb52-821650ca7798
https://publica.fraunhofer.de/entities/publication/b09904a1-4472-4920-88e2-9ab8b2238344
https://publica.fraunhofer.de/entities/publication/b0992082-5344-4966-a130-13f9897b85c8
https://publica.fraunhofer.de/entities/publication/b09952ee-7201-470c-83cc-74ea65d37f5e
https://publica.fraunhofer.de/entities/publication/b099641c-a24e-43df-9f1d-087e67b11ced
https://publica.fraunhofer.de/entities/event/b099ae48-2697-4772-87b3-7f6e3df4b598
https://publica.fraunhofer.de/entities/publication/b099ca15-92fb-456f-8d02-a7ff6d629b4c
https://publica.fraunhofer.de/entities/publication/b099caf7-c65f-4987-ad9a-0eb6541ea27d
https://publica.fraunhofer.de/entities/mainwork/b09a1194-f96e-404a-977f-38d28625b182
https://publica.fraunhofer.de/entities/publication/b09a1250-1069-492e-a2f3-bdcf57756e37
https://publica.fraunhofer.de/entities/event/b09a4009-65b7-4abf-a748-8196a7ef7c2c
https://publica.fraunhofer.de/entities/publication/b09a4012-f116-4c6e-9b9b-fc62c3a36104
https://publica.fraunhofer.de/entities/event/b09a7ab2-d3e1-4bde-b1a6-f520d522ee53
https://publica.fraunhofer.de/entities/event/b09acfcd-bc7d-4980-a8d6-537948b3f28a
https://publica.fraunhofer.de/entities/publication/b09ad14c-8218-41b0-8b28-1dfbba21fb13
https://publica.fraunhofer.de/entities/project/b09afde5-24af-43b4-9060-55c693118f46
https://publica.fraunhofer.de/entities/mainwork/b09b1423-192f-4543-8f3f-c12c1e0ebe12
https://publica.fraunhofer.de/entities/journal/b09b2f48-c9f5-4a7d-8c03-fa2c91f92fee
https://publica.fraunhofer.de/entities/mainwork/b09b2f61-5eb0-4d61-b138-9609018772a9
https://publica.fraunhofer.de/entities/patent/b09b5ecb-b881-4a87-9f24-78be2ac91ded
https://publica.fraunhofer.de/entities/publication/b09b679a-bf2b-4723-87bd-bd3d8a57fa8e
https://publica.fraunhofer.de/entities/publication/b09b830b-681a-4dff-9ecb-0c61875ef7de
https://publica.fraunhofer.de/entities/publication/b09ba0b5-896d-4279-9a97-038583f1ec7f
https://publica.fraunhofer.de/entities/publication/b09bf231-adc3-4fbb-8431-20b4cbd81583
https://publica.fraunhofer.de/entities/publication/b09bf5c5-c621-46f5-951f-81c9dd364981
https://publica.fraunhofer.de/entities/publication/b09c1f7c-09e4-4534-82a3-aac915916b45
https://publica.fraunhofer.de/entities/publication/b09c2a47-f2a1-4da6-86b1-e5536090fbfc
https://publica.fraunhofer.de/entities/publication/b09cbe96-0cba-4134-9228-9334271e8da8
https://publica.fraunhofer.de/entities/publication/b09ce371-3e35-4aed-8b7b-76bd2818f2ca
https://publica.fraunhofer.de/entities/publication/b09ce567-dc3b-4c83-b762-6d5374f48728
https://publica.fraunhofer.de/entities/publication/b09d3445-ccd4-4840-812c-5620e744da77
https://publica.fraunhofer.de/entities/journal/b09d6f0d-3abf-4e4a-a283-1768e9ae9c3b
https://publica.fraunhofer.de/entities/publication/b09dd78f-68d3-47d9-a4d9-68395352cabb
https://publica.fraunhofer.de/entities/publication/b09df7f4-0d65-4f7c-95d0-fe75d0a49fa5
https://publica.fraunhofer.de/entities/patent/b09e595c-ddd7-446f-8e36-ac99874b339a
https://publica.fraunhofer.de/entities/publication/b09e7f63-5426-4602-b5c1-e37540cc04ce
https://publica.fraunhofer.de/entities/publication/b09e9c4f-7454-40aa-b12e-a13dcabe6021
https://publica.fraunhofer.de/entities/patent/b09e9f51-66c0-4eba-9d5f-f5b3bc74cc3c
https://publica.fraunhofer.de/entities/publication/b09eb958-d0f6-486e-8a08-80ebcba72ece
https://publica.fraunhofer.de/entities/publication/b09edba8-82d7-4309-ac32-8c96f774a3f4
https://publica.fraunhofer.de/entities/publication/b09ef2f6-b482-44dc-96c4-bc5afda35388
https://publica.fraunhofer.de/entities/journal/b09f16c6-f875-4c54-8fb0-18e0f3a36f04
https://publica.fraunhofer.de/entities/publication/b09f2278-0791-4b27-92d6-840ae039bf66
https://publica.fraunhofer.de/entities/publication/b09f4613-be5b-461f-8a7d-584ca7fdee3e
https://publica.fraunhofer.de/entities/publication/b09f7bc8-b45e-4260-a40c-c6534a564198
https://publica.fraunhofer.de/entities/event/b09fa3d9-3575-4282-a1c9-4b33702a417e
https://publica.fraunhofer.de/entities/event/b09fa98d-b58c-4f78-8a5d-db7c8b7ed20c
https://publica.fraunhofer.de/entities/publication/b09fd740-e7d7-4b16-96d6-eec36c3ed0bb
https://publica.fraunhofer.de/entities/mainwork/b09ff0b3-ce5c-4505-85fa-dc3d3c9ba4c1
https://publica.fraunhofer.de/entities/event/b09ff3eb-9cb0-4464-a083-8c111d189448
https://publica.fraunhofer.de/entities/event/b0a03ac9-2502-4968-8105-abe982268ce8
https://publica.fraunhofer.de/entities/publication/b0a03d81-d60f-4cb8-9a2c-7a04beed5a7d
https://publica.fraunhofer.de/entities/patent/b0a0534a-2faa-4058-96ad-125d6284d745
https://publica.fraunhofer.de/entities/publication/b0a0b810-7918-47ba-a239-f213750d174f
https://publica.fraunhofer.de/entities/publication/b0a0ef5e-a77a-48be-857c-e1f44e227fdd
https://publica.fraunhofer.de/entities/publication/b0a103da-0f00-46d4-9a8d-f250a2a44903
https://publica.fraunhofer.de/entities/publication/b0a1133e-f8a4-4972-a7a9-346021bef783
https://publica.fraunhofer.de/entities/event/b0a188d7-c5a2-47ef-a1c4-f5b6a8b81eb0
https://publica.fraunhofer.de/entities/mainwork/b0a192a5-f3ea-4820-afde-4a980c06edff
https://publica.fraunhofer.de/entities/publication/b0a192ee-6e1c-4a83-860b-0edec00e9ad4
https://publica.fraunhofer.de/entities/event/b0a1db49-1140-4fde-be10-afd0a7d9cc89
https://publica.fraunhofer.de/entities/orgunit/b0a1eb09-81be-42e6-a3f0-6a73573f9ead
https://publica.fraunhofer.de/entities/publication/b0a21142-f7e2-469a-95da-4c060a21f31f
https://publica.fraunhofer.de/entities/publication/b0a2714d-9902-421c-b4bb-70fcc811e8e5
https://publica.fraunhofer.de/entities/event/b0a27700-d3df-4c34-8af7-275d6bca9bb1
https://publica.fraunhofer.de/entities/event/b0a27f60-40f3-408c-932c-87564f3c7583
https://publica.fraunhofer.de/entities/mainwork/b0a288ad-4a14-42ac-b6b4-5eaacac1b1af
https://publica.fraunhofer.de/entities/publication/af8196cf-7b30-4df1-a045-fa901c11dd25
https://publica.fraunhofer.de/entities/event/af819e09-f2e2-4596-8d8f-346fa8346b71
https://publica.fraunhofer.de/entities/publication/af81b8fd-2a91-4c6f-8774-8211c8fb1906
https://publica.fraunhofer.de/entities/publication/af81c1b9-e0b1-4d2f-acac-fde3f0c92360
https://publica.fraunhofer.de/entities/publication/af8229c2-7161-4c34-b531-86690e73b42b
https://publica.fraunhofer.de/entities/publication/af826e21-a8c7-45ea-81d1-29ee0874fde6
https://publica.fraunhofer.de/entities/event/af827461-0d08-4064-879e-041eb32e4644
https://publica.fraunhofer.de/entities/publication/af827bcd-0b81-42dd-88ae-186b51221a5e
https://publica.fraunhofer.de/entities/publication/af82d7e4-df88-431f-8890-8d17e318b65c
https://publica.fraunhofer.de/entities/event/af831644-a164-477d-9bb4-56aefdd9a9c2
https://publica.fraunhofer.de/entities/publication/af83b6eb-e81d-48db-a679-76720d339adb
https://publica.fraunhofer.de/entities/mainwork/af83c980-642f-4f65-8951-07ce443ff6f4
https://publica.fraunhofer.de/entities/publication/af83cda7-4eff-4f71-8b88-ea6a314740c7
https://publica.fraunhofer.de/entities/journal/af83d916-02d8-452f-a028-2f39cfdb3e7e
https://publica.fraunhofer.de/entities/publication/af844c15-3e6a-4488-af1e-c78385a0c9c7
https://publica.fraunhofer.de/entities/publication/af84573d-5d2f-4bd4-9bcd-526f2b1df4ad
https://publica.fraunhofer.de/entities/publication/af845dc4-884f-44b0-a6a7-144ebc1c494b
https://publica.fraunhofer.de/entities/publication/af84a740-99a8-4c09-9815-150046449396
https://publica.fraunhofer.de/entities/publication/af84c6fc-e6cb-4118-98d2-3da19ac460d0
https://publica.fraunhofer.de/entities/event/af857660-6811-4f9d-a526-a0d183c0343f
https://publica.fraunhofer.de/entities/publication/af85895d-37ab-4481-93ad-c30e513ffc58
https://publica.fraunhofer.de/entities/publication/af85a6f4-c6c2-4dd8-8456-db58a7b4b5cc
https://publica.fraunhofer.de/entities/publication/af85be86-fcaf-4888-bd10-3dc0d5aa44b4
https://publica.fraunhofer.de/entities/publication/af860512-8166-4e60-9177-65792e793ff8
https://publica.fraunhofer.de/entities/event/af860ecc-34b4-41cd-911a-25b5711c7e2f
https://publica.fraunhofer.de/entities/event/af861227-beec-44d2-8289-bff7f3093d0a
https://publica.fraunhofer.de/entities/event/af8679d9-7cc4-4338-b1c2-156053dd8a61
https://publica.fraunhofer.de/entities/event/af86a302-bae0-4594-9133-6bff9d9e8b78
https://publica.fraunhofer.de/entities/patent/af86a727-d302-41d0-bb16-6d540ba31a23
https://publica.fraunhofer.de/entities/publication/af86edad-b1d8-4e64-89f7-9c30ab20f34b
https://publica.fraunhofer.de/entities/publication/af874a15-0b64-4b19-8a93-8d89c3a74024
https://publica.fraunhofer.de/entities/publication/af875aa1-dcd4-4296-819f-fb107981e348
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