https://publica.fraunhofer.de/entities/project/4adedb2f-1497-45e1-8ca6-317ad6740ad4
https://publica.fraunhofer.de/entities/event/4adeed0c-10cc-4495-8894-5563bbca2745
https://publica.fraunhofer.de/entities/publication/4adf3a2c-eb90-41c3-bccd-a0a7cb428cee
https://publica.fraunhofer.de/entities/publication/4adf9783-aa00-4bb7-b4ec-0cb7c29b405e
https://publica.fraunhofer.de/entities/publication/4adfd6a6-40a0-4a8d-a2f2-fdcaf86e9f40
https://publica.fraunhofer.de/entities/publication/4ae03ef3-a9be-4725-8fc8-729aeae1c532
https://publica.fraunhofer.de/entities/publication/4ae0a189-b49a-4ecb-9e5d-bc2cb459488a
https://publica.fraunhofer.de/entities/publication/4ae0ac6d-2cf2-4eaf-a31a-18df695ab3ba
https://publica.fraunhofer.de/entities/funding/4ae0d20c-4b19-4736-a14c-f76cfb1512d9
https://publica.fraunhofer.de/entities/publication/4ae0dd90-6c9c-4241-90f3-0db4446d96ba
https://publica.fraunhofer.de/entities/event/4ae140a9-5729-46d2-968b-f2c3ba354e2b
https://publica.fraunhofer.de/entities/mainwork/4ae17a36-71f4-403d-9c97-7043a9edc947
https://publica.fraunhofer.de/entities/mainwork/4ae18c1f-a547-4939-b77e-7c3bc3f5da65
https://publica.fraunhofer.de/entities/project/4ae18d2c-286a-41db-8266-4b6d9409cdd4
https://publica.fraunhofer.de/entities/publication/4ae1976e-d28b-4ada-be8c-f909a443581a
https://publica.fraunhofer.de/entities/funding/4ae1b730-9e69-481e-927b-e96e45959d5b
https://publica.fraunhofer.de/entities/journal/4ae1c58a-5129-45b8-9a70-fbc5515353c5
https://publica.fraunhofer.de/entities/publication/4ae1fab6-e967-47a5-80eb-6fca711183b6
https://publica.fraunhofer.de/entities/patent/4ae231d8-18c7-42d7-a720-377c8742c288
https://publica.fraunhofer.de/entities/publication/4ae27997-d6e5-4961-a1b4-7160dc2c936a
https://publica.fraunhofer.de/entities/publication/4ae28438-692c-42cd-b639-67657ff68db2
https://publica.fraunhofer.de/entities/project/4ae28a84-acdb-4c0e-a6fd-551a5198ced2
https://publica.fraunhofer.de/entities/mainwork/4ae28e07-2520-4742-a5dd-083e7eeb88cb
https://publica.fraunhofer.de/entities/publication/4ae2bfc3-e269-408a-8254-60221c8d740c
https://publica.fraunhofer.de/entities/publication/4ae2da25-ed38-40bc-9a7f-3cf723a9d132
https://publica.fraunhofer.de/entities/publication/4ae2dcf5-ad76-4adc-b765-249233deae11
https://publica.fraunhofer.de/entities/mainwork/4ae359f9-4d22-4ba7-98a3-17a302b600c3
https://publica.fraunhofer.de/entities/publication/4ae35dbd-0ea2-41ce-b344-5215a35ea583
https://publica.fraunhofer.de/entities/mainwork/4ae384ca-c873-41b2-a5b5-303ce233671c
https://publica.fraunhofer.de/entities/publication/4ae3a523-5954-47da-93aa-508e3babbf63
https://publica.fraunhofer.de/entities/publication/4ae3ab75-505f-436b-9d70-bc12b62d5592
https://publica.fraunhofer.de/entities/publication/4ae40722-8724-4591-81d8-bc3ed0239052
https://publica.fraunhofer.de/entities/publication/4ae41ab4-142a-4003-ba4d-77e603fdc1dc
https://publica.fraunhofer.de/entities/publication/4ae420fe-8f2a-41ae-b97e-7cfe06ff1724
https://publica.fraunhofer.de/entities/orgunit/4ae4439b-9bb7-4502-b026-1fc6cd18f410
https://publica.fraunhofer.de/entities/patent/4ae44df1-456b-48a8-90da-4600edfd6c0f
https://publica.fraunhofer.de/entities/mainwork/4ae47699-31da-4a11-8d7d-2fd9f909487b
https://publica.fraunhofer.de/entities/journal/4ae4aaf2-0793-4d49-a50b-2949e0bc9301
https://publica.fraunhofer.de/entities/mainwork/4ae4ccb4-2a96-48d5-8bec-23aa4d1ed1f1
https://publica.fraunhofer.de/entities/mainwork/4ae4d448-46a1-4bab-ab29-66efc539ac57
https://publica.fraunhofer.de/entities/publication/4ae511e3-f889-4216-be53-f15a62d5daa6
https://publica.fraunhofer.de/entities/publication/4ae53be7-290f-487d-8913-bcb8a57f0661
https://publica.fraunhofer.de/entities/publication/4ae548a4-316a-476e-b060-6ab5a0c2c1c9
https://publica.fraunhofer.de/entities/publication/4ae57c60-c9dc-48a5-9484-f343c0cddbfe
https://publica.fraunhofer.de/entities/publication/4ae5b796-29c0-4dc5-be82-87afcaf3f5ce
https://publica.fraunhofer.de/entities/publication/4ae5e493-58fe-496b-9f5b-b40407ab8509
https://publica.fraunhofer.de/entities/publication/4ae60884-07b5-4b6e-bfd6-b2217a99b574
https://publica.fraunhofer.de/entities/event/4ae63616-8b4e-4be0-9494-078f700708b3
https://publica.fraunhofer.de/entities/mainwork/4ae69632-6d18-425b-a52c-e80ba97d7dd1
https://publica.fraunhofer.de/entities/publication/4ae6a693-e717-4f36-adc7-0f9dab881d12
https://publica.fraunhofer.de/entities/publication/4ae6d656-3b29-47a4-adaa-d999c1ec2ba0
https://publica.fraunhofer.de/entities/mainwork/4ae70a1a-79e2-46c8-bf46-4f9b68c0e5b4
https://publica.fraunhofer.de/entities/publication/4ae71d44-3f09-48ce-ae80-9954686ea715
https://publica.fraunhofer.de/entities/patent/4ae75f28-3232-4271-9476-dfcb0a470cee
https://publica.fraunhofer.de/entities/publication/4ae790d3-f2ea-462f-9f56-d150469804ce
https://publica.fraunhofer.de/entities/publication/4ae7ee0c-99cd-4cc1-8231-f7f1f8b87434
https://publica.fraunhofer.de/entities/journal/4ae7fa09-d2dc-4130-ab3f-6855b95f453e
https://publica.fraunhofer.de/entities/orgunit/4ae80c96-7d49-44bb-a417-28f71e784219
https://publica.fraunhofer.de/entities/mainwork/4ae82a2b-07e6-4772-8965-59a0b0e67a3f
https://publica.fraunhofer.de/entities/mainwork/4ae85a0a-c997-4b64-a822-ed54e0d00db9
https://publica.fraunhofer.de/entities/mainwork/4ae8b961-bb7c-4856-b945-6290dff8762d
https://publica.fraunhofer.de/entities/mainwork/4ae8d850-b037-45bb-b8e3-fc68f9f7e572
https://publica.fraunhofer.de/entities/publication/4ae8d8dc-a5e3-4648-8836-8e1fd9b79d63
https://publica.fraunhofer.de/entities/publication/4ae919ae-504b-4cff-b008-b4591d402af7
https://publica.fraunhofer.de/entities/publication/4ae92a63-0099-4c42-8d0a-265a20e5db9d
https://publica.fraunhofer.de/entities/mainwork/4ae99516-c112-477a-a6ef-e83a2bb5e059
https://publica.fraunhofer.de/entities/publication/4ae998ad-3cac-423a-ae00-70ea101e3057
https://publica.fraunhofer.de/entities/publication/4ae9a03a-71e6-4324-92c6-f6d383c5345e
https://publica.fraunhofer.de/entities/publication/4ae9cb36-1e4a-40d5-bb7f-bac3837c85ca
https://publica.fraunhofer.de/entities/publication/4ae9cd1d-948f-4764-9e7c-d70cc92b00a9
https://publica.fraunhofer.de/entities/publication/4aea2ad6-d8df-4774-a7a2-52ce461dca7c
https://publica.fraunhofer.de/entities/publication/4aea5924-9bad-4249-8e45-09e13ebf0c9f
https://publica.fraunhofer.de/entities/publication/4aea6585-88f7-44bf-ab20-0d5421800e7a
https://publica.fraunhofer.de/entities/publication/4aea6dab-f0d3-49c5-9712-5c710c200a0f
https://publica.fraunhofer.de/entities/publication/4aea77e4-80fc-4bae-aa6a-cfce8b3d87c9
https://publica.fraunhofer.de/entities/publication/4aeac39e-42b3-4073-95f5-ab9dc3f59dcb
https://publica.fraunhofer.de/entities/publication/4aeb3f22-df94-41b4-bc51-c7aed851d000
https://publica.fraunhofer.de/entities/publication/4aeb594f-b23f-4e60-b2da-768d93341ef1
https://publica.fraunhofer.de/entities/publication/4aeb702f-df0a-4e45-ad15-f738c134b8ee
https://publica.fraunhofer.de/entities/journal/4aeb7f7e-4ecc-4bfa-85ce-cc36ab8af8cc
https://publica.fraunhofer.de/entities/publication/4aebb838-8ebd-4b96-b429-f9e1e30f4b20
https://publica.fraunhofer.de/entities/publication/4aebd856-898d-41cb-8d7e-f7404a25596e
https://publica.fraunhofer.de/entities/publication/4aebfcba-8c4a-4045-a964-a01971862eae
https://publica.fraunhofer.de/entities/publication/4aec0118-162e-462d-a955-cd2af3f50aac
https://publica.fraunhofer.de/entities/mainwork/4aec446e-6337-4fb0-9822-d6f26f700c9d
https://publica.fraunhofer.de/entities/publication/4aec7781-e8bc-4ed9-9516-5c8f000c5e29
https://publica.fraunhofer.de/entities/publication/4aecce5e-141c-4b17-8031-b91e7e23edac
https://publica.fraunhofer.de/entities/patent/4aed01da-fbb0-4b72-a2aa-8807b7a00fd1
https://publica.fraunhofer.de/entities/event/4aed1592-1a92-43aa-9161-c63b623028f7
https://publica.fraunhofer.de/entities/mainwork/4aed4080-e76a-4081-8c6f-1230dfab0662
https://publica.fraunhofer.de/entities/publication/4aed47c6-a182-4563-a236-c1f9d4b994f6
https://publica.fraunhofer.de/entities/mainwork/4aed5e09-41ac-479f-8763-9b20b4b4f81a
https://publica.fraunhofer.de/entities/publication/4aedf8ac-9b0d-4da6-95fe-3be164d4a3ff
https://publica.fraunhofer.de/entities/publication/4aee5ac5-c53d-4873-9118-6a716c17f4ad
https://publica.fraunhofer.de/entities/event/4aee72b2-4759-4696-8eb8-6477298ad158
https://publica.fraunhofer.de/entities/publication/4aee8c40-ff15-4b8f-a105-e6bd4c2dbeb1
https://publica.fraunhofer.de/entities/publication/4aeebe65-16a5-4dde-87e0-fd86c855ab63
https://publica.fraunhofer.de/entities/publication/4aeef28f-de3c-4ae8-a8e7-1e339db74e1e
https://publica.fraunhofer.de/entities/publication/4aeef887-cc95-47a0-9085-df443441fc0b
https://publica.fraunhofer.de/entities/publication/4aef48e5-44e6-4246-8b5f-0d5b4b7bb254
https://publica.fraunhofer.de/entities/publication/4aef538c-d599-4b20-b99e-1f33522245e0
https://publica.fraunhofer.de/entities/publication/4aef5a8d-26ec-482b-a7fc-caf87e9d5b55
https://publica.fraunhofer.de/entities/publication/4aef62b6-8791-477b-9bd9-122023df7a46
https://publica.fraunhofer.de/entities/publication/4aef789e-4e28-4041-b128-7a1dc7f44d78
https://publica.fraunhofer.de/entities/orgunit/4aef9cd6-c54e-4a47-8fd9-47e7896de598
https://publica.fraunhofer.de/entities/publication/4af02497-716a-4c2c-a934-5d042e6b6fcc
https://publica.fraunhofer.de/entities/event/4af04236-0fc1-4776-b3f8-e01596606e9b
https://publica.fraunhofer.de/entities/publication/4af057f6-868a-4d2f-b51b-e74d479dce9c
https://publica.fraunhofer.de/entities/publication/4af0798e-d54d-4d40-a2e2-578e47450044
https://publica.fraunhofer.de/entities/publication/4af09f2f-e20a-4efc-90ec-b34059700035
https://publica.fraunhofer.de/entities/publication/4af0b889-5143-480d-924e-0df6d17c2b72
https://publica.fraunhofer.de/entities/journal/4af0eb2e-be42-4dcb-92c5-d1a97d609f07
https://publica.fraunhofer.de/entities/publication/4af13cc5-1bf5-4416-b68d-b64755e514a6
https://publica.fraunhofer.de/entities/event/4af1859b-d60b-4c3e-82e6-ab92f72c3211
https://publica.fraunhofer.de/entities/publication/4af1a10a-f7e3-44a8-9c94-7cc6418aea63
https://publica.fraunhofer.de/entities/orgunit/4af1ab74-abe2-4170-b19c-be0766b80d4f
https://publica.fraunhofer.de/entities/event/4af1f3aa-3c9b-4c55-a528-f443a2b67276
https://publica.fraunhofer.de/entities/publication/4af1fc15-1306-4c49-aed9-bd8ed0872b6b
https://publica.fraunhofer.de/entities/publication/4af23f21-0bb1-4586-9d38-03cbab598ab0
https://publica.fraunhofer.de/entities/publication/4af241df-078e-4eb7-bd5c-133ee3c32842
https://publica.fraunhofer.de/entities/event/4af298eb-ceaa-4dfc-8471-caca17d472a4
https://publica.fraunhofer.de/entities/publication/4af2d9cb-7d7f-4e28-937e-26e501f320e3
https://publica.fraunhofer.de/entities/publication/4af2f08d-1bd0-45a3-a542-a201b96b5f9e
https://publica.fraunhofer.de/entities/publication/4af30cd3-d0b9-4751-8d22-0b32a8071c40
https://publica.fraunhofer.de/entities/orgunit/4af30ef4-be23-4901-ae7b-6341eb6a0f7d
https://publica.fraunhofer.de/entities/publication/4af3257b-421c-40da-8e0b-3df2bd86e057
https://publica.fraunhofer.de/entities/orgunit/4af33b9b-69be-43e8-8a6f-c42034c361a7
https://publica.fraunhofer.de/entities/mainwork/4af3b5cd-1741-48e8-97cb-abf869d3326a
https://publica.fraunhofer.de/entities/publication/4af3fecf-38bd-469a-a4e8-c55d8eee49a9
https://publica.fraunhofer.de/entities/publication/4af43bc1-1026-4edb-bdce-1d67de1dc3b6
https://publica.fraunhofer.de/entities/publication/4af44cb3-57e8-420f-ad5a-933407f5bea4
https://publica.fraunhofer.de/entities/mainwork/4af45e54-3c16-4c78-920c-55bd63a862b8
https://publica.fraunhofer.de/entities/publication/4af4ee5d-ac89-43e1-bb9e-0ecf7aa88922
https://publica.fraunhofer.de/entities/publication/4af51e01-ecf7-47f2-8cdf-92066600e7e9
https://publica.fraunhofer.de/entities/mainwork/4af54de0-320e-4ca9-b2ba-429582fa0bb4
https://publica.fraunhofer.de/entities/event/4af58abe-4d51-4ff6-b195-214c35bc4256
https://publica.fraunhofer.de/entities/publication/4af5df12-323d-4a96-b83b-ef5d0a5a5cc4
https://publica.fraunhofer.de/entities/publication/4af5eba5-e00e-436d-a4d4-c257c3d47b6a
https://publica.fraunhofer.de/entities/event/4af60344-6325-4dca-a24b-79ab4f4d8569
https://publica.fraunhofer.de/entities/publication/4af61742-2685-4916-b093-bec66a9a7dad
https://publica.fraunhofer.de/entities/publication/4af62523-a714-4d98-aacd-470d832e4385
https://publica.fraunhofer.de/entities/publication/4af6345f-9bce-48e4-80c7-f48ae084f7b4
https://publica.fraunhofer.de/entities/project/4af64b8f-f943-48de-9e17-8b0a96de91ff
https://publica.fraunhofer.de/entities/event/4af67669-e8a2-4fbf-97b3-9ba79f3b0330
https://publica.fraunhofer.de/entities/publication/4af68c2f-46ac-4614-b8cd-2fb3f7c8d8ad
https://publica.fraunhofer.de/entities/publication/4af69580-4253-4cf5-9003-cc51e9599a0f
https://publica.fraunhofer.de/entities/publication/4af6b4a4-9139-4fd9-abbd-8a2a9e44abbf
https://publica.fraunhofer.de/entities/publication/4af6bdac-a7ab-45cf-991e-45a462c7e6d7
https://publica.fraunhofer.de/entities/publication/4af6e283-a878-4dbc-a4cd-cfd2dc5a4b33
https://publica.fraunhofer.de/entities/publication/4af73d8d-1645-4c6d-a1da-13d1713a307c
https://publica.fraunhofer.de/entities/publication/4af77a86-2515-47d9-ba6e-639cc4865b82
https://publica.fraunhofer.de/entities/publication/4af7a62d-6004-4f11-ad57-69151ce58af0
https://publica.fraunhofer.de/entities/mainwork/4af7bcb3-0379-4b8f-af37-776502b0a909
https://publica.fraunhofer.de/entities/mainwork/4af7d8f3-962b-41df-ada4-7ad690294268
https://publica.fraunhofer.de/entities/publication/4af80a50-6bd2-420e-880f-23996f9ef516
https://publica.fraunhofer.de/entities/publication/4af81b10-d853-40c4-ad42-4b42a0f0b87e
https://publica.fraunhofer.de/entities/publication/4af821af-92fb-43d7-8f5d-5e51aaad18af
https://publica.fraunhofer.de/entities/publication/4af83373-4495-459c-956c-4c5ec504b0e2
https://publica.fraunhofer.de/entities/mainwork/4af8984e-3495-4b04-97a7-16f1e6a9e131
https://publica.fraunhofer.de/entities/publication/4af89eda-42f6-454f-adf1-68caf7b0c412
https://publica.fraunhofer.de/entities/publication/4af8c08b-dcf0-4637-a843-738f604a98cd
https://publica.fraunhofer.de/entities/event/4af8de69-9058-4003-9e15-9dbb2b16f835
https://publica.fraunhofer.de/entities/mainwork/4af8e2df-f8ec-4c1c-96d4-5728cb499834
https://publica.fraunhofer.de/entities/mainwork/4af8ff3f-52c9-4b29-86cd-975d7c401b01
https://publica.fraunhofer.de/entities/project/4af91527-50d2-4de2-861e-1ba3c7d85de2
https://publica.fraunhofer.de/entities/publication/4af922f6-8a27-4f1a-838e-086ad0e706b5
https://publica.fraunhofer.de/entities/publication/4af99551-fa42-400a-902e-1f434924e8c7
https://publica.fraunhofer.de/entities/publication/4af9a786-5798-4904-ab32-c1479a34bf26
https://publica.fraunhofer.de/entities/event/4af9c2b0-a7da-4108-94e5-4ff5e678779e
https://publica.fraunhofer.de/entities/mainwork/4af9ec07-a60d-4737-81a8-c9d207923d9d
https://publica.fraunhofer.de/entities/publication/4af9f683-5e2f-46bc-9092-1788afb46c88
https://publica.fraunhofer.de/entities/orgunit/4afa3e75-1422-49eb-8764-490706312246
https://publica.fraunhofer.de/entities/publication/4afa637e-f822-4391-9344-d1f6346e7ad0
https://publica.fraunhofer.de/entities/mainwork/4afa830c-4d72-4392-8e76-ef56bf19a1db
https://publica.fraunhofer.de/entities/journal/4afb21c1-e882-41ec-b540-54595063a7e7
https://publica.fraunhofer.de/entities/event/4afb21c6-c828-4f95-b228-647dd3578796
https://publica.fraunhofer.de/entities/publication/4afb7312-4004-4460-9d6a-2b9308af9227
https://publica.fraunhofer.de/entities/patent/4afb7a9a-db44-465f-862f-f8551416aa90
https://publica.fraunhofer.de/entities/publication/4afb8e04-7127-4c05-a69c-0c30bc4a4dbd
https://publica.fraunhofer.de/entities/person/4afbe20d-6ffe-4a8f-999f-8b562c767930
https://publica.fraunhofer.de/entities/event/4afbe812-b57d-44ac-8088-2e036ad66537
https://publica.fraunhofer.de/entities/mainwork/4afbe83b-13b2-4264-b464-db5b7dab6135
https://publica.fraunhofer.de/entities/publication/4afc21f2-990c-437d-aad8-bf5f5b8ae852
https://publica.fraunhofer.de/entities/publication/4afc2505-a376-4d0b-8ac8-4d5b92c1778a
https://publica.fraunhofer.de/entities/publication/4afc3a20-85cb-4b22-ba35-013bad1f9e9e
https://publica.fraunhofer.de/entities/publication/4afcc53c-b85a-40ef-b280-da574255e8c1
https://publica.fraunhofer.de/entities/publication/4afce911-6a7a-4bc5-b65d-4e3d31c5e1ea
https://publica.fraunhofer.de/entities/publication/4afd1546-0370-49ea-9b02-8f07ff414dd1
https://publica.fraunhofer.de/entities/publication/4afd15d0-c59b-4b29-b604-eb1d9bb1d38a
https://publica.fraunhofer.de/entities/publication/4afd1dfc-1846-466e-9715-8455a8f8ce34
https://publica.fraunhofer.de/entities/publication/4afd21b2-77f3-4b33-aef9-f460e0277004
https://publica.fraunhofer.de/entities/publication/4afe07aa-5cb3-4493-b6bd-968428183a30
https://publica.fraunhofer.de/entities/event/4afe4933-711d-4f9e-936f-4c53a9807868
https://publica.fraunhofer.de/entities/orgunit/4afe9eab-9bc8-46e5-a059-5d74229ecc26
https://publica.fraunhofer.de/entities/publication/4afea21b-7f66-49a3-a59c-31990e02f166
https://publica.fraunhofer.de/entities/publication/4afea2bc-5ae8-4e2c-b60c-41cf66b93235
https://publica.fraunhofer.de/entities/publication/4afeb199-da45-429c-9267-020bbd39b105
https://publica.fraunhofer.de/entities/event/4afeb856-d521-4ca8-845a-eb3a78c7b197
https://publica.fraunhofer.de/entities/project/4aff1e07-45f4-4857-83d2-b6745b0fbd1e
https://publica.fraunhofer.de/entities/mainwork/4aff4b96-2364-4f93-98f8-af9e8d838ec6
https://publica.fraunhofer.de/entities/event/4aff80f9-b6fd-489c-af49-b56beeb25334
https://publica.fraunhofer.de/entities/publication/4affa6b4-7fcb-43b3-95ee-af0f872f6b66
https://publica.fraunhofer.de/entities/project/4affed44-01b7-4c45-b05d-6ca4a0434c0f
https://publica.fraunhofer.de/entities/orgunit/4b004df6-1c21-4259-b3e5-941dfa449f1f
https://publica.fraunhofer.de/entities/orgunit/4b008be0-4e50-4ec4-9e36-2d0a87002e57
https://publica.fraunhofer.de/entities/publication/4b00dcd5-5fdf-4fe9-b419-61b40781dd58
https://publica.fraunhofer.de/entities/event/4b00ed39-d2fb-455c-b823-d0cdc5015ed3
https://publica.fraunhofer.de/entities/publication/4b00ff78-25da-46cf-867f-e749bc3945b6
https://publica.fraunhofer.de/entities/person/4b010b58-217e-4a5e-a8ad-f61a770e4443
https://publica.fraunhofer.de/entities/publication/4b011e49-3bdb-4cd3-bd5f-16b50b64f332
https://publica.fraunhofer.de/entities/mainwork/4b012c52-dd7e-475a-aefe-c417b74e0420
https://publica.fraunhofer.de/entities/publication/4b012e86-a28a-449a-b8a0-c922297f3264
https://publica.fraunhofer.de/entities/publication/4b013c92-3312-4019-9ec8-658a91d6b660
https://publica.fraunhofer.de/entities/publication/4b0162ea-f99f-4978-aeb1-59482c720f5a
https://publica.fraunhofer.de/entities/publication/4b016ab8-ded5-4247-8792-4f6793c56f78
https://publica.fraunhofer.de/entities/publication/4b017823-4962-4481-8633-91805d0b9a3a
https://publica.fraunhofer.de/entities/publication/4b0182b8-dae9-418b-ac6c-a40bf0394e5b
https://publica.fraunhofer.de/entities/publication/4b01951b-9802-4bc1-a985-1ba4c1b584d1
https://publica.fraunhofer.de/entities/publication/4b01c01d-b2aa-4c1b-ab17-84ce58fddf90
https://publica.fraunhofer.de/entities/event/4b0205cc-4c7b-4413-a339-8b4ee34454a9
https://publica.fraunhofer.de/entities/publication/4b024719-070a-4fbc-922a-3f34d0c65141
https://publica.fraunhofer.de/entities/publication/4b026673-bcac-463f-a3a3-452cfa4e6f6d
https://publica.fraunhofer.de/entities/publication/4b02679a-c452-4049-b829-490b3f3b8b7a
https://publica.fraunhofer.de/entities/publication/4b0268cd-1ef5-47b0-a59f-bddb8deb0645
https://publica.fraunhofer.de/entities/publication/4b0279ad-c04f-4b0e-9737-2f7f497e2e4e
https://publica.fraunhofer.de/entities/event/4b02836b-52e1-44b1-9a5b-289938e319f8
https://publica.fraunhofer.de/entities/publication/4b02b824-e9fa-44c5-9574-f488a496f8e1
https://publica.fraunhofer.de/entities/project/4b02cfec-0a39-4daa-b40d-303223b23625
https://publica.fraunhofer.de/entities/journal/4b02d931-7508-43f8-bc48-38ac5cf29776
https://publica.fraunhofer.de/entities/event/4b02e8e4-9013-4608-a7d1-96713dc4e195
https://publica.fraunhofer.de/entities/publication/4b030443-4cea-4b79-a3cc-cf693a2fa1dd
https://publica.fraunhofer.de/entities/event/4b0314fe-6a78-41cf-a03c-c6fccb62fffb
https://publica.fraunhofer.de/entities/publication/4b03222d-5314-450d-a5cf-9f22e17638e7
https://publica.fraunhofer.de/entities/publication/4b0330f2-334e-4868-94c5-02bc4fd545bf
https://publica.fraunhofer.de/entities/mainwork/4b033547-5bb9-4d4d-90f0-48ec56707424
https://publica.fraunhofer.de/entities/event/4b0340e7-af97-4b6a-92ac-1c769b979481
https://publica.fraunhofer.de/entities/publication/4b034851-d592-468d-9201-ecc86dadfd23
https://publica.fraunhofer.de/entities/publication/4b0357e6-323c-4c61-ae48-008bdaabbe2f
https://publica.fraunhofer.de/entities/journal/4b0377af-d947-455e-bcc8-6d4e23c8827d
https://publica.fraunhofer.de/entities/publication/4b0382a9-ac5a-45fe-80fe-157ca316afde
https://publica.fraunhofer.de/entities/orgunit/4b03926d-b609-4a0b-a0d5-f6ea6cb79c49
https://publica.fraunhofer.de/entities/publication/4b03bcd3-a1ee-4ba7-86cb-8cebe0f352fa
https://publica.fraunhofer.de/entities/publication/4c1b70da-f8e2-4e1b-b805-8c6b353ad2df
https://publica.fraunhofer.de/entities/mainwork/4c1b9670-9492-40ff-adb8-1580cb236a8c
https://publica.fraunhofer.de/entities/publication/4c1b98de-802b-44eb-93c6-25ea73d46d4d
https://publica.fraunhofer.de/entities/publication/4c1ba0b4-e8d5-4c7e-9cfb-e61a0805b61a
https://publica.fraunhofer.de/entities/orgunit/4c1bf162-0820-4b36-bb1e-e4e98fb6272a
https://publica.fraunhofer.de/entities/publication/4c1c24f7-6a3d-42ca-ae9a-e097846e1f61
https://publica.fraunhofer.de/entities/publication/4c1c2ff4-b847-4c5f-a1b1-a9912e8de16c
https://publica.fraunhofer.de/entities/orgunit/4c1c4f45-236c-4c73-9597-af473f7c8d7a
https://publica.fraunhofer.de/entities/publication/4c1c6cf8-fc00-4e81-8754-f477ad51e9f0
https://publica.fraunhofer.de/entities/mainwork/4c1c8851-30b4-4498-8007-ca76e1714ba6
https://publica.fraunhofer.de/entities/publication/4c1c8b5f-3603-4e84-a4bc-ede5a86b1355
https://publica.fraunhofer.de/entities/publication/4c1ccc68-33d2-456b-9c38-2b0a8dda45bd
https://publica.fraunhofer.de/entities/event/4c1db9e7-a67a-4e53-afce-5fc9c48c643f
https://publica.fraunhofer.de/entities/publication/4c1dda98-dd8e-4512-b796-fbaf47dec5d5
https://publica.fraunhofer.de/entities/publication/4c1de0af-441e-4fa8-8fdf-2f7672cd8190
https://publica.fraunhofer.de/entities/publication/4c1e4f1b-4be0-48d1-a3a9-2b0ca49d98ec
https://publica.fraunhofer.de/entities/patent/4c1e54fa-47e4-4952-a9a4-4048de7814f7
https://publica.fraunhofer.de/entities/publication/4c1e8b37-92b5-49bf-a39e-19218e60c99d