https://publica.fraunhofer.de/entities/publication/de1b51fe-0243-47b3-98f0-c3d03511efd0
https://publica.fraunhofer.de/entities/publication/de1b6106-150d-4f2c-97c5-c8b3746e7b57
https://publica.fraunhofer.de/entities/publication/de1b7b57-3a64-4682-8e2e-8b3144531037
https://publica.fraunhofer.de/entities/publication/de1b7b97-9627-4a58-af32-d6660d3cb1fa
https://publica.fraunhofer.de/entities/publication/de1b8bcd-91f8-4972-95e0-50e541b24f74
https://publica.fraunhofer.de/entities/publication/de1b8ef8-7096-4a59-9f3b-117ae157957f
https://publica.fraunhofer.de/entities/publication/de1b94dd-ca14-4671-a995-c3cdbdd59156
https://publica.fraunhofer.de/entities/event/de1bba28-d8bb-44f1-8b93-5436c8c7bceb
https://publica.fraunhofer.de/entities/publication/de1bf0d6-f25d-4f7f-be2c-b9553275dc7d
https://publica.fraunhofer.de/entities/publication/de1c1acc-1b6f-4788-8185-06b73c394d19
https://publica.fraunhofer.de/entities/event/de1c1d24-ac4e-4a57-9621-f14217fe3314
https://publica.fraunhofer.de/entities/publication/de1c1e90-d4b7-4276-a160-b70714d7a643
https://publica.fraunhofer.de/entities/patent/de1c2aa1-0cd9-4b99-9fb5-d6c3422487df
https://publica.fraunhofer.de/entities/publication/de1c369a-b1a1-46c1-a012-537b33d5f7dd
https://publica.fraunhofer.de/entities/publication/de1d4123-d7bc-4991-b218-efa5de92df77
https://publica.fraunhofer.de/entities/journal/de1d72e7-5e54-49e6-b405-7ac58ff67a61
https://publica.fraunhofer.de/entities/event/de1dd2af-3ee8-452d-915a-c329e0286cee
https://publica.fraunhofer.de/entities/mainwork/de1dd2e6-7257-44e9-a05e-221f82932d5e
https://publica.fraunhofer.de/entities/publication/de1df04c-363f-4d37-a8e7-dbc21b8d2943
https://publica.fraunhofer.de/entities/publication/de1e040c-ca80-44e6-90d0-375840b0ecd1
https://publica.fraunhofer.de/entities/publication/de1e4fbc-eb66-499b-860f-a5b1fecf2b88
https://publica.fraunhofer.de/entities/publication/de1e5900-f2f3-4ca1-bbc8-ec60d74fd568
https://publica.fraunhofer.de/entities/person/de1e85f1-a5c9-45cf-939c-2caa00f75b91
https://publica.fraunhofer.de/entities/publication/de1e8688-1558-4354-acaf-83ea0dd2e82a
https://publica.fraunhofer.de/entities/event/de1ebae1-f03e-4679-8336-7ce3453f5396
https://publica.fraunhofer.de/entities/mainwork/de1edfe1-ba95-4d8f-bd9e-9ee5ee647dfc
https://publica.fraunhofer.de/entities/publication/de1f0613-6685-44a1-a64f-21082ae51bc9
https://publica.fraunhofer.de/entities/publication/de1f0ef8-a3a3-48aa-9edd-8edc3ca3acc2
https://publica.fraunhofer.de/entities/mainwork/de1f37a6-6524-466b-9a36-9ffa056f9050
https://publica.fraunhofer.de/entities/event/de1f50e1-edd4-4eb7-94c8-a8699be198e6
https://publica.fraunhofer.de/entities/publication/de1f5f0b-50cd-409a-aedd-8ea9f0bf80b2
https://publica.fraunhofer.de/entities/event/de1f9a3d-f43e-4d61-9cee-d43ed92eec50
https://publica.fraunhofer.de/entities/publication/de1fbca9-4b27-4c87-84ec-f4ed9dc34748
https://publica.fraunhofer.de/entities/publication/de1ffc61-2bba-461b-8b85-9596e4576baf
https://publica.fraunhofer.de/entities/patent/de2044f8-227a-4cec-8672-03b1e4ba3728
https://publica.fraunhofer.de/entities/event/de207a4e-cd31-4e35-bae0-9b0d0f5a2a0e
https://publica.fraunhofer.de/entities/project/de207e3f-ff9b-4757-905a-edd62ff8ef66
https://publica.fraunhofer.de/entities/publication/de20c267-e08d-4e1b-a4f3-fe8c26908bfe
https://publica.fraunhofer.de/entities/mainwork/de2134ff-d4c4-43d2-82bc-1a72a29f033b
https://publica.fraunhofer.de/entities/event/de214647-d0df-42e9-8b53-b3ccad319afc
https://publica.fraunhofer.de/entities/project/de21493f-81c0-436a-bdd1-a6a114845fb0
https://publica.fraunhofer.de/entities/event/de21514c-92fc-4986-840b-01dc64453251
https://publica.fraunhofer.de/entities/publication/de215ca6-e5d9-4596-b6be-76446c083b68
https://publica.fraunhofer.de/entities/event/de217dcc-c310-4052-8b48-da0b019df1a1
https://publica.fraunhofer.de/entities/mainwork/de2186dd-431b-42b9-bf61-858525dbcd49
https://publica.fraunhofer.de/entities/publication/de218851-099c-49c3-8ad6-17734d5ed935
https://publica.fraunhofer.de/entities/publication/de219c52-06a1-411b-a2ab-b8047005b18b
https://publica.fraunhofer.de/entities/publication/de220008-ec5a-4b4a-94a7-7dc2edc95305
https://publica.fraunhofer.de/entities/orgunit/de2201cc-1672-4d8b-a34a-80f7b4d27351
https://publica.fraunhofer.de/entities/event/de2202fb-9d11-4b85-bb36-35fecd1c2cc0
https://publica.fraunhofer.de/entities/publication/de221d50-3440-45f6-a631-89dd8ca2fc46
https://publica.fraunhofer.de/entities/publication/de224712-d1ec-4b1e-b30d-674a9c9a0701
https://publica.fraunhofer.de/entities/project/de22c9ec-35e2-46f1-9bc9-b8c5f53ba19a
https://publica.fraunhofer.de/entities/publication/de22ee02-32d7-4f82-b116-3005943a79f5
https://publica.fraunhofer.de/entities/patent/de230ffc-553e-44ec-8cd3-b6af3531ce12
https://publica.fraunhofer.de/entities/publication/de232c01-0373-4e32-aa81-2a74ea93c967
https://publica.fraunhofer.de/entities/publication/de2343ec-0965-48db-9fd9-ad7e8ecab195
https://publica.fraunhofer.de/entities/orgunit/de235083-2a02-45cd-85fa-0445bdf9cdb4
https://publica.fraunhofer.de/entities/publication/de23672d-b5c5-452a-b8ee-85b2d843c127
https://publica.fraunhofer.de/entities/publication/de23930f-2ebe-4c6b-80da-9ce7db0bbf22
https://publica.fraunhofer.de/entities/event/de23a5a5-0961-42bc-b05c-d53e029dbccd
https://publica.fraunhofer.de/entities/publication/de23bdc6-98c3-4cec-8580-d17dfff01ad6
https://publica.fraunhofer.de/entities/publication/de241268-52f8-4c23-9f2a-4880a00e39cd
https://publica.fraunhofer.de/entities/event/de243230-b6ab-4614-aef8-e9e4661f4c1e
https://publica.fraunhofer.de/entities/event/de247169-26e2-496a-9595-31f57b71897f
https://publica.fraunhofer.de/entities/publication/de2492b7-5182-4b40-bb64-bd332310321a
https://publica.fraunhofer.de/entities/publication/de24e77f-895e-4b73-b811-8bad62f2f202
https://publica.fraunhofer.de/entities/event/de2580f9-3c1b-4f45-9af2-2f11fec5d26a
https://publica.fraunhofer.de/entities/event/de25b1bb-880c-4c93-868f-0e0ed17ddbcd
https://publica.fraunhofer.de/entities/event/de25b6c1-f25b-4378-81aa-72b77221a1e9
https://publica.fraunhofer.de/entities/publication/de25c286-b745-4f4a-875a-bbe930fac8e9
https://publica.fraunhofer.de/entities/project/de25cb6b-3199-48b8-bc11-f2cb96ebfec5
https://publica.fraunhofer.de/entities/publication/de25ccec-7b03-4228-b178-ab567d35db81
https://publica.fraunhofer.de/entities/publication/de264482-6b01-4c7d-9fc1-c4a58f890de1
https://publica.fraunhofer.de/entities/mainwork/de265c3f-bae3-44df-9c20-453439fc85cc
https://publica.fraunhofer.de/entities/publication/de267c5a-51bc-4769-89bd-bda901782102
https://publica.fraunhofer.de/entities/publication/de2698b0-91e1-4494-ae37-b1c7230da283
https://publica.fraunhofer.de/entities/publication/de269e86-9f06-4ddb-937e-38ee834f612e
https://publica.fraunhofer.de/entities/publication/de26e2a0-c9a5-44e3-994c-c0b8b94df512
https://publica.fraunhofer.de/entities/publication/de26ef80-3f2b-4e62-ac23-7ee1144d70b8
https://publica.fraunhofer.de/entities/publication/de26f192-c1de-457d-94d8-f7c948c87552
https://publica.fraunhofer.de/entities/publication/de26f46c-f9aa-44c9-9d3d-ec9626d77214
https://publica.fraunhofer.de/entities/person/de273256-f727-430a-b38b-8382ba8cf29d
https://publica.fraunhofer.de/entities/publication/de275869-dda5-4833-896d-8989ecc714cd
https://publica.fraunhofer.de/entities/journal/de276ac1-5e16-4c0f-a495-b365fa81734f
https://publica.fraunhofer.de/entities/journal/de27c6ec-0911-439b-a0e8-aff87df2833b
https://publica.fraunhofer.de/entities/orgunit/de27cfcd-516c-4a19-8375-8c71952cf60c
https://publica.fraunhofer.de/entities/mainwork/de281297-8c40-4dc1-a80f-720d67db2438
https://publica.fraunhofer.de/entities/publication/de2821c4-105b-433b-8cfd-bb5a779aa59e
https://publica.fraunhofer.de/entities/publication/de282539-909c-4e72-bbb0-f1914361042c
https://publica.fraunhofer.de/entities/mainwork/de283699-89cd-46aa-bdc4-11b5330d7d4a
https://publica.fraunhofer.de/entities/event/de2850a8-1dbb-480f-8a12-7dca9d68f112
https://publica.fraunhofer.de/entities/publication/de2852fe-6915-4431-a125-a2015a01cc3f
https://publica.fraunhofer.de/entities/publication/de28b67e-ad2c-4b80-97c4-491515c67604
https://publica.fraunhofer.de/entities/publication/de28be13-fb34-499b-9797-fd079a2ba9a9
https://publica.fraunhofer.de/entities/mainwork/de291947-5c8e-4684-b3e6-0743902a535b
https://publica.fraunhofer.de/entities/publication/de2981ad-81e6-4258-805d-4d0080d2c25e
https://publica.fraunhofer.de/entities/publication/de29ba9b-5779-4603-a049-c7a3661c79d7
https://publica.fraunhofer.de/entities/event/de29c310-84a2-446f-a72b-6aaefb63be62
https://publica.fraunhofer.de/entities/patent/de2a6616-9a51-4150-b784-ac75b862400b
https://publica.fraunhofer.de/entities/project/de2ada22-28f0-4198-ba70-6e060502dccb
https://publica.fraunhofer.de/entities/publication/de2ae3d2-0c62-4194-9f1c-7f071df04253
https://publica.fraunhofer.de/entities/publication/de2b1787-e3e1-4e03-a081-193636def308
https://publica.fraunhofer.de/entities/publication/de2b4e8e-c364-42f3-906e-6acba86915be
https://publica.fraunhofer.de/entities/patent/de2b850b-989d-4761-b2ed-432e88671a60
https://publica.fraunhofer.de/entities/journal/de2bc1f1-e515-406f-a379-0a285a331764
https://publica.fraunhofer.de/entities/event/de2bd402-d009-4cda-9d9e-08937004eb31
https://publica.fraunhofer.de/entities/publication/de2be76a-9b36-46dc-a657-0cbc165f3117
https://publica.fraunhofer.de/entities/publication/de2c2a04-9474-4e7a-be9e-4a3000026641
https://publica.fraunhofer.de/entities/publication/de2cb5fb-bdac-4cb6-bae1-ec5d10a86c16
https://publica.fraunhofer.de/entities/publication/de2cc1cd-e408-4c1c-9676-39fc552e6129
https://publica.fraunhofer.de/entities/publication/de2d174f-d758-456e-a35a-88925212f5df
https://publica.fraunhofer.de/entities/journal/de2d5742-4773-429f-b1c1-6ffacdde87f8
https://publica.fraunhofer.de/entities/patent/de2da2bc-651e-4bdf-ae48-75810354ce88
https://publica.fraunhofer.de/entities/journal/de2dc3c4-7236-494f-86b5-252aa426cb6a
https://publica.fraunhofer.de/entities/event/de2dd598-f98c-4ac8-b4de-81d24e33d7a9
https://publica.fraunhofer.de/entities/publication/de2e04f3-e598-4167-b96e-932e00a1ce93
https://publica.fraunhofer.de/entities/publication/de2e0fc5-877c-4eee-bd03-8f825296018f
https://publica.fraunhofer.de/entities/publication/de2e109f-5b19-4f86-8aad-e50301234370
https://publica.fraunhofer.de/entities/publication/de2e73c4-ec66-4d41-a559-4b78f248d96c
https://publica.fraunhofer.de/entities/publication/de2e7d71-8e8d-4523-ae0c-19d1dfe1d705
https://publica.fraunhofer.de/entities/publication/de2ea517-479d-4c32-9622-b9222acb2f18
https://publica.fraunhofer.de/entities/publication/de2ed2d6-4dc2-4667-b10e-bd1c35fedbe5
https://publica.fraunhofer.de/entities/publication/de2f1a52-7d0d-48df-8ee7-da56abaabe76
https://publica.fraunhofer.de/entities/person/de2f44df-1d49-454b-b70c-170155160f50
https://publica.fraunhofer.de/entities/publication/de2fd53a-3429-443c-b59d-e9ba23609129
https://publica.fraunhofer.de/entities/mainwork/de2fe594-fcab-46a7-8353-f20d05b62124
https://publica.fraunhofer.de/entities/publication/de2ff459-d057-4600-8740-0f18f965b967
https://publica.fraunhofer.de/entities/mainwork/de301921-1555-46f4-818f-f7fd37a54379
https://publica.fraunhofer.de/entities/event/de303dae-b7f0-46f2-abc7-0141c44d1587
https://publica.fraunhofer.de/entities/publication/de307c3b-92ba-4d5a-881b-42cae99205bd
https://publica.fraunhofer.de/entities/mainwork/de309356-8f3c-4d94-9996-197f0890e034
https://publica.fraunhofer.de/entities/publication/de309ffa-2a52-4911-a923-181033c971b1
https://publica.fraunhofer.de/entities/publication/de30b5c0-7f6f-4105-90ae-fba3d5f642f2
https://publica.fraunhofer.de/entities/orgunit/de30f11a-ba16-4205-b2b6-ee6cd1c04856
https://publica.fraunhofer.de/entities/publication/de31966c-12b9-470a-9c2f-8331d57cdb2b
https://publica.fraunhofer.de/entities/publication/de3199f9-bc1b-4607-bd87-74b26c65727a
https://publica.fraunhofer.de/entities/event/de31cd82-a8c7-460a-b00a-ac9038ecf2a3
https://publica.fraunhofer.de/entities/publication/de31d93f-014c-473e-b4b3-2b1ab2b6da54
https://publica.fraunhofer.de/entities/publication/de31e287-f421-4c71-b3c2-e2f92f5284c4
https://publica.fraunhofer.de/entities/publication/de31fce9-cab4-4832-9528-d3aeb3edb158
https://publica.fraunhofer.de/entities/publication/de3255a0-55a0-4ee6-abcf-84e61b35572d
https://publica.fraunhofer.de/entities/orgunit/de32808d-26a6-4d07-b794-bc9dbea9c408
https://publica.fraunhofer.de/entities/mainwork/de32a142-d6ab-4035-99b8-d570c0611fe4
https://publica.fraunhofer.de/entities/publication/de32b928-9ccf-4f66-9f5a-6476c72fa822
https://publica.fraunhofer.de/entities/event/de32ee5b-706f-47b5-823a-e93759063362
https://publica.fraunhofer.de/entities/publication/de3379ed-e399-404c-b455-e9d8be58cf48
https://publica.fraunhofer.de/entities/publication/de337e2a-de96-4a98-922c-68ad96f08726
https://publica.fraunhofer.de/entities/publication/de33cfd3-5b7e-4134-8376-051782c892c4
https://publica.fraunhofer.de/entities/event/de33ea1f-70d0-4d65-ba8c-7c2800f3c1a4
https://publica.fraunhofer.de/entities/publication/de33fe7f-8045-478f-ab75-698f6f705ab0
https://publica.fraunhofer.de/entities/event/de340426-9829-4987-b495-ff9c938d0be4
https://publica.fraunhofer.de/entities/publication/de342127-2290-4dbe-8454-45e4fe778e27
https://publica.fraunhofer.de/entities/publication/de34b98d-8170-493f-8bfa-a90b12f87a20
https://publica.fraunhofer.de/entities/publication/de34c00d-1737-4b48-88e4-9393ee39f5a8
https://publica.fraunhofer.de/entities/publication/de350169-6bec-40f0-944f-97898a30f67d
https://publica.fraunhofer.de/entities/event/de351060-4412-4b6d-a613-4823f7be034c
https://publica.fraunhofer.de/entities/publication/de351259-6843-4e26-91bb-4e7d10f67deb
https://publica.fraunhofer.de/entities/publication/de3540aa-6ad8-48f4-a026-cc83305aa75a
https://publica.fraunhofer.de/entities/publication/de359daf-c325-4842-91a2-c8c77e3e3f00
https://publica.fraunhofer.de/entities/mainwork/de363020-1390-4e40-9e5b-b7ee6013ac32
https://publica.fraunhofer.de/entities/publication/de3644e4-487a-4ebc-bf3e-68996a2880bd
https://publica.fraunhofer.de/entities/publication/de368cff-fb23-4702-95dc-b8ee807a0ba8
https://publica.fraunhofer.de/entities/mainwork/de3757eb-f583-461e-a451-24c69cba4328
https://publica.fraunhofer.de/entities/publication/de3758b4-8b90-4808-b19e-7874d921895e
https://publica.fraunhofer.de/entities/publication/de376dbb-9f1c-4f31-816d-caded976012d
https://publica.fraunhofer.de/entities/publication/de37cc3d-1b46-47ab-9d74-c0039ccc9992
https://publica.fraunhofer.de/entities/patent/de37cece-4b69-4e8b-afd1-e3e4f89ce780
https://publica.fraunhofer.de/entities/publication/de37fd0f-642a-4f3a-9e7c-88904e94f142
https://publica.fraunhofer.de/entities/publication/de387205-5ffe-48c0-8798-e65034cfb428
https://publica.fraunhofer.de/entities/publication/de38af3c-dfa1-4649-aa33-e6336edf5792
https://publica.fraunhofer.de/entities/publication/de392192-8a4e-4dd6-8fcb-cb3c89ce11de
https://publica.fraunhofer.de/entities/publication/de393125-e679-4da6-a4af-6934538d6d70
https://publica.fraunhofer.de/entities/publication/de393631-0b7c-4e40-a730-a4504b9e764c
https://publica.fraunhofer.de/entities/publication/de396b14-2b0f-4918-bded-d6201137e748
https://publica.fraunhofer.de/entities/publication/de3989d6-af2d-4421-a5cd-b53abfbdd9fe
https://publica.fraunhofer.de/entities/orgunit/de39d52f-4b1d-450a-82da-880f61fcacab
https://publica.fraunhofer.de/entities/patent/de39d997-a687-4426-97fa-7f1c16b40abb
https://publica.fraunhofer.de/entities/publication/de39e441-85fa-4d04-8d7b-4dffb3548a6e
https://publica.fraunhofer.de/entities/journal/de3a015d-93bd-494a-8e0a-19979f11eb99
https://publica.fraunhofer.de/entities/orgunit/de3a1ed2-405d-432d-9ee3-50a774d70db3
https://publica.fraunhofer.de/entities/publication/de3a5668-4e83-428c-aa4d-9b570be0d314
https://publica.fraunhofer.de/entities/publication/de3a795b-c873-4444-9977-2fdc1f89dd98
https://publica.fraunhofer.de/entities/publication/de3ab48f-5747-4d3a-a7e0-d88c5d298d16
https://publica.fraunhofer.de/entities/publication/de3b1fd6-20a3-4efc-a338-f65ac899f9f1
https://publica.fraunhofer.de/entities/project/de3b2010-19a5-406d-9808-699940bf1019
https://publica.fraunhofer.de/entities/publication/de3b3d56-d006-4e6f-8176-94dd5f9b0863
https://publica.fraunhofer.de/entities/publication/de3b6b6b-19d3-45e3-af8e-a77f4dd1f09f
https://publica.fraunhofer.de/entities/publication/de3b7f03-837a-4738-bfba-9c2659f11629
https://publica.fraunhofer.de/entities/event/de3ba49c-c8b3-408d-acc1-7441646b1068
https://publica.fraunhofer.de/entities/publication/de3baddd-5685-44cf-bf3f-eb3409ea0a41
https://publica.fraunhofer.de/entities/event/de3bd039-0e1d-4c32-aae9-fb0daa6f595d
https://publica.fraunhofer.de/entities/publication/de3be04d-c397-496b-839f-91fe3944ce21
https://publica.fraunhofer.de/entities/publication/de3bff16-622a-4e3c-a27a-14b3d7ecf94e
https://publica.fraunhofer.de/entities/project/de3c5706-49d9-4742-bfec-a88364433665
https://publica.fraunhofer.de/entities/mainwork/de3c65e9-65f3-4fae-8ff5-4d0cc261ba96
https://publica.fraunhofer.de/entities/event/de3c6daf-3864-4279-9b6f-bace8227fc72
https://publica.fraunhofer.de/entities/event/de3c848e-4b95-444b-91a3-fe845c9e0d79
https://publica.fraunhofer.de/entities/publication/de3d142f-07f3-464a-95dc-0775a293da3b
https://publica.fraunhofer.de/entities/publication/de3d1a75-4915-4a02-9acb-6a87edad1ed6
https://publica.fraunhofer.de/entities/publication/de3d209c-12f0-4871-8889-9629650f3ce7
https://publica.fraunhofer.de/entities/publication/de3d2d52-8543-4f4e-9749-ec0d1ad710a8
https://publica.fraunhofer.de/entities/event/de3d5b5c-9b36-4133-850e-6a6758fe7aeb
https://publica.fraunhofer.de/entities/publication/de3d5d60-e5d5-4a0d-a5e0-b86291cb8249
https://publica.fraunhofer.de/entities/publication/de3d628f-0da4-420e-994c-c3033a661603
https://publica.fraunhofer.de/entities/patent/de3d6394-ef3e-4edc-9e1d-bbba542d3ed9
https://publica.fraunhofer.de/entities/mainwork/de3d6b7e-5110-4a9c-8baf-296044fa20e3
https://publica.fraunhofer.de/entities/publication/de3da2a2-3ed1-4eb9-9f9e-dd27dcd49940
https://publica.fraunhofer.de/entities/publication/de3dbc94-a138-43d1-84ae-9134e66178fc
https://publica.fraunhofer.de/entities/publication/de3dbe04-8689-4335-87ed-f52a7f822788
https://publica.fraunhofer.de/entities/event/de3dd1bd-ee66-4497-9c42-897723abe9a3
https://publica.fraunhofer.de/entities/orgunit/de3df33b-646b-4dd4-9dfe-a8a1e75b256d
https://publica.fraunhofer.de/entities/publication/de3e2e97-e4d7-4d8b-b8fc-a0104441ede1
https://publica.fraunhofer.de/entities/event/de3e304d-29ae-4018-a8a2-3b755f6ce098
https://publica.fraunhofer.de/entities/event/de3e4ed5-0ca4-4e07-8bb1-0c62e1c3678f
https://publica.fraunhofer.de/entities/publication/de3e87e6-a6db-4968-a091-c86b64216ee4
https://publica.fraunhofer.de/entities/publication/de3e8985-e81b-4586-9d24-cc499e198ecd
https://publica.fraunhofer.de/entities/mainwork/de3e9c94-502a-41d8-8fbb-71d03ac9a1a4
https://publica.fraunhofer.de/entities/publication/de3ec8ff-3509-4be5-9a84-5d2589daefa2
https://publica.fraunhofer.de/entities/event/de3ef0b9-8763-4899-b19b-aaa200e3399b
https://publica.fraunhofer.de/entities/publication/de3f4fe5-fb14-4e77-a2a0-58a2da3a5b5f
https://publica.fraunhofer.de/entities/publication/de3f62c2-fef8-47f2-b7eb-8678860f6515
https://publica.fraunhofer.de/entities/publication/de3fb716-d87e-4e25-ae7f-32c1ec5afa00
https://publica.fraunhofer.de/entities/mainwork/de404841-c007-4361-b2a2-e47c7562019d
https://publica.fraunhofer.de/entities/patent/de404f4b-982b-4590-a515-e9f606dd1274
https://publica.fraunhofer.de/entities/event/de408161-113c-4f69-b6cf-a3ff7406a471
https://publica.fraunhofer.de/entities/event/de40df86-2dae-4339-b772-446d97a7a13f
https://publica.fraunhofer.de/entities/publication/de40fdcf-bc1a-4d5c-afab-99afbdd25fcc
https://publica.fraunhofer.de/entities/journal/de412108-9e87-4eda-8895-6b67d91e858b
https://publica.fraunhofer.de/entities/publication/de4160e9-0cac-48bd-8036-c399b6645278
https://publica.fraunhofer.de/entities/publication/de41a6d4-fe3e-473d-8e1d-9b1c02a4576f
https://publica.fraunhofer.de/entities/publication/de41aa73-b931-4fc7-991a-c1800b3ed0f9
https://publica.fraunhofer.de/entities/publication/de41b3fe-28ad-4ebb-935d-471c4d93a02e
https://publica.fraunhofer.de/entities/publication/de41f78a-5d6b-4ffe-a56c-d5285c0cac7c
https://publica.fraunhofer.de/entities/patent/de420f33-1124-49af-80a8-2f21c6578841
https://publica.fraunhofer.de/entities/mainwork/de4217f7-f0ed-4fd7-a8f1-aaca8fad32c7
https://publica.fraunhofer.de/entities/mainwork/de4228a7-0567-47a5-846f-a85169842672
https://publica.fraunhofer.de/entities/mainwork/de424de5-05ca-4081-907a-aa15fbef7ec7
https://publica.fraunhofer.de/entities/mainwork/de42ad12-bb72-4de3-b622-bde5c101cbc2
https://publica.fraunhofer.de/entities/publication/de42cec5-8aa6-4b5e-8b0e-4c1f98f61a6d
https://publica.fraunhofer.de/entities/publication/de42ec22-34f8-4615-a678-398c30313cbb
https://publica.fraunhofer.de/entities/publication/de42f9a4-5270-4a38-9a10-1d9410788740
https://publica.fraunhofer.de/entities/publication/de4327df-efe0-48a3-a35a-d72e3151e511
https://publica.fraunhofer.de/entities/mainwork/de433886-4cac-4b94-ab7d-b367681b7bd1
https://publica.fraunhofer.de/entities/publication/de435ada-1a75-4319-964c-bd3daeb2b1f4
https://publica.fraunhofer.de/entities/event/de438f94-ad80-49ef-a70a-aa82a460e593
https://publica.fraunhofer.de/entities/publication/de43b3c8-5a0b-466f-a2eb-6e53e5a30776
https://publica.fraunhofer.de/entities/journal/de43c1da-4ebd-4240-b3f7-4e8bf5f373b2
https://publica.fraunhofer.de/entities/publication/de43ee08-1602-4c90-ba33-42b3f45f6118
https://publica.fraunhofer.de/entities/publication/de43fb17-5cce-461f-bff5-737232f4b313
https://publica.fraunhofer.de/entities/orgunit/de440e6d-6872-4eda-b08e-b893c411eafd
https://publica.fraunhofer.de/entities/event/de44b2e1-480b-4588-b74f-b066a3536518
https://publica.fraunhofer.de/entities/event/de44bdfb-6888-4248-94a6-111c98dca9db
https://publica.fraunhofer.de/entities/publication/de450a78-a19d-4a9e-a16e-b67b43a6e725
https://publica.fraunhofer.de/entities/publication/de451bdb-6353-4129-b4b7-fce8a4f991c7
https://publica.fraunhofer.de/entities/person/de452987-5996-46b2-8691-82b35af0c4d7
https://publica.fraunhofer.de/entities/event/de457003-5407-4ee4-ba1c-e14b7982b26f
https://publica.fraunhofer.de/entities/publication/de457e75-f14e-48cc-9265-c08c5929c441
https://publica.fraunhofer.de/entities/mainwork/de45d100-704c-47b8-ad3c-810ab18969ed
https://publica.fraunhofer.de/entities/mainwork/de45dfa0-a160-441b-895f-5639075da982
https://publica.fraunhofer.de/entities/publication/de45f2b7-4557-4ec3-8427-8cf0294285a2