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Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects
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2007
Conference Paper
Title
Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects
Author(s)
Auersperg, J.
Klein, M.
Michel, B.
Mainwork
8th International Conference on Electronics Packaging Technology, ICEPT 2007
Conference
International Conference on Electronics Packaging Technology (ICEPT) 2007
DOI
10.1109/ICEPT.2007.4441403
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
