Passivierte Endoberflaechen

Die Erfindung betrifft ein Verfahren zur Passivierung einer fuer die Verloetung vorgesehenen Endoberflaeche im Plasma sowie eine verbesserte passivierte Endoberflaeche, die durch dieses Verfahren erhaeltlich ist.

EP 1544320 A UPAB: 20050823 NOVELTY - In a process to manufacture a microelectronic component, a surface is rendered passive and suitable for a soldering process. In the presence of a gas plasma, the surface is de-oxidised cleaned and covered by a passive coating agent in a single process. The passive coating is removable by a soldering process. Also claimed is a suitable microelectronic component. USE - Process to manufacture a microelectronic component. ADVANTAGE - The process replaces a multi-stage process with a single-stage process.