https://publica.fraunhofer.de/entities/publication/5fff5381-f5d0-46f0-886a-f676e398438a
https://publica.fraunhofer.de/entities/publication/613e9251-684b-4214-9db9-c794bfef5a66
https://publica.fraunhofer.de/entities/publication/60c7bbc6-5482-4729-a681-f3c739712a39
https://publica.fraunhofer.de/entities/publication/612d3e31-bfc1-4872-a5f1-b9395e13712e
https://publica.fraunhofer.de/entities/publication/60bdc160-1e69-498d-b806-b3344f06c5ab
https://publica.fraunhofer.de/entities/publication/61e0ea05-f255-411d-9669-d61eeed6d40f
https://publica.fraunhofer.de/entities/publication/6144c96d-5bd9-4070-b871-0d97f7b2bafa
https://publica.fraunhofer.de/entities/publication/61ef2da7-6f15-4791-9f4a-45b6bc368f4c
https://publica.fraunhofer.de/entities/publication/60195773-8837-41d8-b616-eab6f69bf9a6
https://publica.fraunhofer.de/entities/publication/5fbb900e-2e90-41dc-b0da-5a638d2ae3c1
https://publica.fraunhofer.de/entities/publication/60f68715-3793-4844-9992-ee68d201bd3c
https://publica.fraunhofer.de/entities/publication/60e3e10c-b652-4d77-8b42-2b9cfeb9c437
https://publica.fraunhofer.de/entities/publication/5fd2274e-1028-4879-9212-3fff27c0462a
https://publica.fraunhofer.de/entities/publication/611067c7-7011-41d3-b9ca-baf03634881e
https://publica.fraunhofer.de/entities/publication/606ac01a-5940-4259-9b86-c9d497d9a54d
https://publica.fraunhofer.de/entities/publication/5fc0f0e9-4281-4195-81ca-97565d2980c2
https://publica.fraunhofer.de/entities/publication/610a53d1-449f-4d3a-99ad-58bc80a25d5b
https://publica.fraunhofer.de/entities/publication/60701b08-c61a-40c6-a9b3-1e33a20668a7
https://publica.fraunhofer.de/entities/publication/5035a5ce-9c3b-4673-9caf-eca4d4137d24
https://publica.fraunhofer.de/entities/publication/4f863403-a502-45ae-9744-2e8a2f142d7f
https://publica.fraunhofer.de/entities/publication/505e0488-6d69-4a63-9b53-e4ac2f4bb624
https://publica.fraunhofer.de/entities/publication/504d1540-078a-4d94-82ff-219f6839d9e6
https://publica.fraunhofer.de/entities/publication/4f77b975-3f22-4994-a9e1-9242f61e0f4b
https://publica.fraunhofer.de/entities/publication/608a21aa-0e01-4fd9-90ff-645b9feb5174
https://publica.fraunhofer.de/entities/publication/4f8d5481-1960-454d-9190-a4371b475155
https://publica.fraunhofer.de/entities/publication/6084e6e1-b208-4534-a20a-e249677d7210
https://publica.fraunhofer.de/entities/publication/4f82e0b9-534b-459e-a502-647cf94dbb8e
https://publica.fraunhofer.de/entities/publication/4f5016ca-5b1c-4519-bdf5-f5d1d9fa5eac
https://publica.fraunhofer.de/entities/publication/4f514084-b8e4-4de1-8ed7-494aaf8447fc
https://publica.fraunhofer.de/entities/publication/4f53c2c6-b131-4ff1-8653-efa2bd1e7ab7
https://publica.fraunhofer.de/entities/publication/4bf9b8e1-190d-4055-9f69-4470e8b2decf
https://publica.fraunhofer.de/entities/publication/4f50265b-1f2b-40be-90e3-f4b2c8ff0198
https://publica.fraunhofer.de/entities/publication/4c011234-5b19-4e9c-a734-9fb585d58aa6
https://publica.fraunhofer.de/entities/publication/50be7b00-6a6c-4616-8b72-187ce2d4b10a
https://publica.fraunhofer.de/entities/publication/4be21bfc-7f9d-4596-b3a6-d69ad01717c9
https://publica.fraunhofer.de/entities/publication/4bffd232-9263-4bbe-a0b3-e9bac0f577a9
https://publica.fraunhofer.de/entities/publication/6703d9ee-e852-49ce-ae02-a5dd8ae32a51
https://publica.fraunhofer.de/entities/publication/6714587f-56ea-43d0-a4c8-c5b0333b514b
https://publica.fraunhofer.de/entities/publication/671151c3-1cb8-4187-8bdb-02f481d311bc
https://publica.fraunhofer.de/entities/publication/670bf133-43a7-4a07-b42f-8c88308ade10
https://publica.fraunhofer.de/entities/publication/6701f94c-7de5-4131-b846-3ce182388717
https://publica.fraunhofer.de/entities/publication/670a6b06-8273-4ee3-b97c-9324d47152d4
https://publica.fraunhofer.de/entities/publication/671703e2-ca06-418f-b31e-fa07b5ed8c30
https://publica.fraunhofer.de/entities/publication/8448a9df-83d8-4f91-ad7f-a2f8a9a20b3f
https://publica.fraunhofer.de/entities/publication/7d456e46-c66e-4f6c-913c-4eaad166e9eb
https://publica.fraunhofer.de/entities/publication/a8dfa221-e111-45d3-85ef-11a8606dc992
https://publica.fraunhofer.de/entities/publication/8307e960-f569-4e60-ae8c-c67232fe9401
https://publica.fraunhofer.de/entities/publication/7d03673d-cc8a-4dee-b1ce-9c8eb2189cad
https://publica.fraunhofer.de/entities/publication/853c7a4f-ed85-4414-bd89-ea8bf9cbc8d8
https://publica.fraunhofer.de/entities/publication/833cb3d0-cb68-4bcb-b635-2bdb2a200cdd
https://publica.fraunhofer.de/entities/publication/6a7469fc-825b-4f07-b21e-032970a9642f
https://publica.fraunhofer.de/entities/publication/67b87d68-335c-4ba7-8ff0-2cd8bffca2b4
https://publica.fraunhofer.de/entities/publication/6a66d537-c735-4c31-a902-c206d8321c83
https://publica.fraunhofer.de/entities/publication/6a5e9acb-faf7-4316-a3a3-3e580b649005
https://publica.fraunhofer.de/entities/publication/67ba8507-de46-4c5b-9610-3178db9b8312
https://publica.fraunhofer.de/entities/publication/67a3039a-efab-49fd-9752-ed7747095049
https://publica.fraunhofer.de/entities/publication/6a7ba8ce-2fe1-4f3a-b520-c23f09b622cd
https://publica.fraunhofer.de/entities/publication/6a8396b3-5c4c-4c19-83bc-9eb470e44552
https://publica.fraunhofer.de/entities/publication/67c242b8-905a-4789-b736-f255a853a942
https://publica.fraunhofer.de/entities/publication/68e17d57-b4b3-4a07-806b-e857739077c7
https://publica.fraunhofer.de/entities/publication/67fff6e9-beb4-4baa-914e-4d745e7bd88f
https://publica.fraunhofer.de/entities/publication/68b5d1ac-c2e0-4436-8b8c-b68b1277e4e0
https://publica.fraunhofer.de/entities/publication/68dd18b1-55a4-4a5b-8584-bf639a723b47
https://publica.fraunhofer.de/entities/publication/68ef70dd-20ee-40b7-b761-441741192d61
https://publica.fraunhofer.de/entities/publication/68cee2b2-83cb-4fec-8748-c01640ec5a61
https://publica.fraunhofer.de/entities/publication/68e4673b-7b07-4b82-b27d-6fd830e953ea
https://publica.fraunhofer.de/entities/publication/68e496d9-6c3b-4790-9566-04341ffc706f
https://publica.fraunhofer.de/entities/publication/68d4db70-3e77-45d3-9452-e7da9628f1d6
https://publica.fraunhofer.de/entities/publication/67421c14-0150-445e-a53a-0d65bb53e57b
https://publica.fraunhofer.de/entities/publication/6736f8c3-7a13-4397-98bb-f1cbc6a9abd1
https://publica.fraunhofer.de/entities/publication/68103f0d-2235-42d8-8c3f-f31522fec9a9
https://publica.fraunhofer.de/entities/publication/6823da87-a0d8-46d5-be36-a05aafb735bf
https://publica.fraunhofer.de/entities/publication/6801b54f-cfbb-456f-adf4-1c5a1713ffd9
https://publica.fraunhofer.de/entities/publication/673ea862-5d6f-43c7-8730-02ff96c00b01
https://publica.fraunhofer.de/entities/publication/673d76f7-9eb2-4512-a7eb-c2c3933d444b
https://publica.fraunhofer.de/entities/publication/6756fc62-7f24-446c-90d1-a776181943cb
https://publica.fraunhofer.de/entities/publication/673a954a-e1d8-4734-836e-c77c9572829c
https://publica.fraunhofer.de/entities/publication/67735078-c06a-431b-8ddf-c4d7af1cabc1
https://publica.fraunhofer.de/entities/publication/677fc407-5547-4c83-8f48-dae5a4327bfb
https://publica.fraunhofer.de/entities/publication/676f9f03-9b6a-448d-9df7-968eff36b3a4
https://publica.fraunhofer.de/entities/publication/676ca71c-ff18-47c6-9ecc-1c9e8c74ad13
https://publica.fraunhofer.de/entities/publication/67724e61-ff74-4d99-b9ca-48cdacd1d4d9
https://publica.fraunhofer.de/entities/publication/67604ca2-5a8f-4b3a-b56c-1d004ed45b9e
https://publica.fraunhofer.de/entities/publication/69746b65-d485-4a2f-879f-680825d8c009
https://publica.fraunhofer.de/entities/publication/6a0efd08-3f64-4b95-a33c-f97c770aadba
https://publica.fraunhofer.de/entities/publication/6a2b87c6-a7ed-4d65-9daa-b5025f09a946
https://publica.fraunhofer.de/entities/publication/6a32423c-a717-4591-a5a7-e44753aaad0d
https://publica.fraunhofer.de/entities/publication/6c22ae75-ad28-4858-b618-60bdb1bbafb9
https://publica.fraunhofer.de/entities/publication/6c157392-9424-41e7-8ca0-86cb2fec1e32
https://publica.fraunhofer.de/entities/publication/6a265256-12a4-4ed0-8e5f-3b1239ff4ef1
https://publica.fraunhofer.de/entities/publication/6a3389fe-fe92-4597-b87e-87d322ccd3b3
https://publica.fraunhofer.de/entities/publication/6c21fc91-beac-4d03-8bce-b6bc48277706
https://publica.fraunhofer.de/entities/publication/6a1c4670-e4e9-4d13-acd2-71965a6f68fa
https://publica.fraunhofer.de/entities/publication/6c5d5287-611b-48bc-8e1c-e9b71607dd96
https://publica.fraunhofer.de/entities/publication/6be52560-05f8-41be-a5c7-93185d15b594
https://publica.fraunhofer.de/entities/publication/6c703d1b-9a43-48f4-947b-9101f834c24d
https://publica.fraunhofer.de/entities/publication/6bf58403-b6d3-42db-8885-2874642a10b3
https://publica.fraunhofer.de/entities/publication/6c50cc0f-214f-4767-89a5-16f19e4da84c
https://publica.fraunhofer.de/entities/publication/6c80d550-ab31-4a42-b501-c8b5b73dd221
https://publica.fraunhofer.de/entities/publication/6be6db58-8453-40e7-b6e8-a4ce905a8bbe
https://publica.fraunhofer.de/entities/publication/6aa13d86-8a6f-4e49-9bf4-0e7f05b894d0
https://publica.fraunhofer.de/entities/publication/6b8ab271-f1f5-4427-93ba-d6d673ec3086
https://publica.fraunhofer.de/entities/publication/6ba0d5a8-d110-4cc9-87a2-fcce6f31b9ba
https://publica.fraunhofer.de/entities/publication/6aa07b22-69c4-4ca2-ab45-cd809bcc87de
https://publica.fraunhofer.de/entities/publication/6bb00c23-7e7a-48ef-8572-133483c58dfa
https://publica.fraunhofer.de/entities/publication/6bb53172-9f11-479a-9804-52d93650fd9c
https://publica.fraunhofer.de/entities/publication/6aadba3c-0f88-4658-8c82-56cbf49a4e85
https://publica.fraunhofer.de/entities/publication/6b83cbe7-f651-4392-ab3d-f26082e4fba5
https://publica.fraunhofer.de/entities/publication/6baf8a81-8463-49a1-bdae-75ee51f9b5d9
https://publica.fraunhofer.de/entities/publication/6f099a97-bdee-4b1d-83d7-143263021ba3
https://publica.fraunhofer.de/entities/publication/75bd143e-8824-422e-b4f9-0211a04c88db
https://publica.fraunhofer.de/entities/publication/6eef5ac6-730f-46b8-a528-87e75d801d32
https://publica.fraunhofer.de/entities/publication/6b6a2497-04fb-40e5-b19c-fca89c2f6727
https://publica.fraunhofer.de/entities/publication/6eec8602-0834-4434-9c67-60c6c12edac2
https://publica.fraunhofer.de/entities/publication/6de1ff8e-d7f1-48d7-b2b5-529ea7d3da9b
https://publica.fraunhofer.de/entities/publication/6dfabbf4-b99a-47dc-bf9c-d3b3062e9ef3
https://publica.fraunhofer.de/entities/publication/6b710a47-fb38-492f-852f-06af7e4b561e
https://publica.fraunhofer.de/entities/publication/708b1785-ca49-48ec-b2d2-5bc64ac1384b
https://publica.fraunhofer.de/entities/publication/6f906c2a-82a1-4356-9c8b-58e372210807
https://publica.fraunhofer.de/entities/publication/6f8c55e4-c7c8-4506-887e-5b606baa7a63
https://publica.fraunhofer.de/entities/publication/6fb001e1-7d10-4e08-8d24-773a19945a7c
https://publica.fraunhofer.de/entities/publication/6fb7c79e-1539-4bf1-b3b7-44ccf6afaa04
https://publica.fraunhofer.de/entities/publication/6f908c87-af45-44c0-8470-5f62a341a924
https://publica.fraunhofer.de/entities/publication/6f68b2c9-2ccb-450e-b2fd-bb2005793af6
https://publica.fraunhofer.de/entities/publication/6fb5ed0e-f57d-462b-8f3c-951fffe927aa
https://publica.fraunhofer.de/entities/publication/5d45d262-1c11-4190-ab7f-878177d8e84d
https://publica.fraunhofer.de/entities/publication/5d41ca10-6b60-41fa-8e94-9e786f4b546d
https://publica.fraunhofer.de/entities/publication/5d480c0b-f60c-4984-9fcb-ec2f724825c8
https://publica.fraunhofer.de/entities/publication/5d446b74-a587-49b9-a722-f0b6f47a0b2b
https://publica.fraunhofer.de/entities/publication/5b517eb2-7bb1-410f-b303-fb38eca01057
https://publica.fraunhofer.de/entities/publication/5b451f26-585d-419f-bb2e-3cf8482bc0a9
https://publica.fraunhofer.de/entities/publication/5b3d8aaa-9e0c-464b-ad0d-305f3d8e6444
https://publica.fraunhofer.de/entities/publication/5d352dbb-d574-4fa6-84f7-e9e4265b9d88
https://publica.fraunhofer.de/entities/publication/6f1fd414-1ded-44f5-b2df-2faa3d613c86
https://publica.fraunhofer.de/entities/publication/6f3f0733-9d06-46f9-a824-f8d23f0053b2
https://publica.fraunhofer.de/entities/publication/72561f6e-8c06-4c23-8557-be2e6c834139
https://publica.fraunhofer.de/entities/publication/6f317fa4-0bb6-48f6-81ac-0f4bcbded332
https://publica.fraunhofer.de/entities/publication/6f38b74b-fb34-4b6f-ae87-a5fedb785fee
https://publica.fraunhofer.de/entities/publication/7261b5c6-6d1f-4bce-afc7-19de5c196599
https://publica.fraunhofer.de/entities/publication/6f244e39-66bd-49fc-ae29-2d2eb51664ac
https://publica.fraunhofer.de/entities/publication/72495b71-f090-4dcf-83ea-614e08173cd5
https://publica.fraunhofer.de/entities/publication/725f7579-bbfb-46fa-b0c7-a33a5e8ba1f7
https://publica.fraunhofer.de/entities/publication/26c1a7e3-494b-4f91-89c6-d248664ebdec
https://publica.fraunhofer.de/entities/publication/683271dc-734f-4706-ade0-eff34dec32fc
https://publica.fraunhofer.de/entities/publication/6f4686e7-83b4-4736-b74e-9224cbbc269e
https://publica.fraunhofer.de/entities/publication/72846762-c0c3-4cdc-ac68-33e943d0eb1a
https://publica.fraunhofer.de/entities/publication/684a568a-92c0-449f-a492-8f95b1b0bbae
https://publica.fraunhofer.de/entities/publication/72b22124-ae17-41f0-bc93-e86714611553
https://publica.fraunhofer.de/entities/publication/682d7c6c-2f32-43a4-8494-9a343d0408ad
https://publica.fraunhofer.de/entities/publication/72bfd870-16c7-4ed5-86e7-bf80c18697da
https://publica.fraunhofer.de/entities/publication/7290f918-46ce-4146-b062-ec504b29a1ec
https://publica.fraunhofer.de/entities/publication/72835662-bba6-40e7-ac22-e6086b9b4118
https://publica.fraunhofer.de/entities/publication/684d95df-508d-4a04-afaa-50bdf14ca025
https://publica.fraunhofer.de/entities/publication/691e8bfc-1943-438d-a784-f9d6577a0a7c
https://publica.fraunhofer.de/entities/publication/6854cbae-76cd-4672-a89c-87e18cedf5f5
https://publica.fraunhofer.de/entities/publication/6852a135-abb2-43c7-9840-29787f15aec0
https://publica.fraunhofer.de/entities/publication/69229f4c-5eeb-4d6d-aaa3-4cb49fd6d062
https://publica.fraunhofer.de/entities/publication/6915ff3c-6654-4580-b006-52e943dfdbf9
https://publica.fraunhofer.de/entities/publication/69240740-46b0-47cb-a8b1-9974646d874b
https://publica.fraunhofer.de/entities/publication/6935348c-3d6b-4330-9084-900f94fc3d18
https://publica.fraunhofer.de/entities/publication/689dc9be-06fe-457c-afac-e670d7641f94
https://publica.fraunhofer.de/entities/publication/6880dc7d-8483-484f-9f93-4e44110a1b2d
https://publica.fraunhofer.de/entities/publication/68868c06-2512-45a3-a16a-00d68ba8215b
https://publica.fraunhofer.de/entities/publication/689114fa-b57e-4666-8ef2-849355ddaf2d
https://publica.fraunhofer.de/entities/publication/68a01fdf-1238-4715-a29d-8f07e76d7795
https://publica.fraunhofer.de/entities/publication/66dedd6b-819d-4a85-9cec-f307eee7c2a5
https://publica.fraunhofer.de/entities/publication/66ea7d2e-7c44-4dfb-8854-58f21fc5a69f
https://publica.fraunhofer.de/entities/publication/68ad0ce6-e003-43f8-9fd8-0ab9cd4c1dff
https://publica.fraunhofer.de/entities/publication/66f0b9fe-3999-44cd-a8af-2e115d1631ed
https://publica.fraunhofer.de/entities/publication/66f622fb-52d0-402e-a18a-46964a040716
https://publica.fraunhofer.de/entities/publication/66fdca54-e01f-42dc-97bf-c2ede807be0d
https://publica.fraunhofer.de/entities/publication/67002e6c-ce6f-4e6e-b124-d5e0f71a4069
https://publica.fraunhofer.de/entities/publication/66f0c761-1248-4fe3-8595-aa1cdb60c372
https://publica.fraunhofer.de/entities/publication/66f68e4d-f025-450f-b433-4438c3b4ae02
https://publica.fraunhofer.de/entities/publication/66eac3b1-49a5-48e6-b2b8-8c50f6319ebf
https://publica.fraunhofer.de/entities/publication/6bd60979-08ff-480e-aa65-deb715fd39c1
https://publica.fraunhofer.de/entities/publication/6c37bc83-7229-4932-8e8f-31297120efdc
https://publica.fraunhofer.de/entities/publication/6bd8690e-ef0a-4944-ac1c-690b72d10426
https://publica.fraunhofer.de/entities/publication/6c245b1d-e43c-44ef-86fd-fe2459b29d0b
https://publica.fraunhofer.de/entities/publication/6bcfe601-bf9b-412d-91ce-7d2948c58c20
https://publica.fraunhofer.de/entities/publication/6be47f2e-115e-4c47-9bc2-7a6c27538f2e
https://publica.fraunhofer.de/entities/publication/6bce3a29-21bb-4fd0-9c19-a454ad59f5f1
https://publica.fraunhofer.de/entities/publication/6c254b87-ca97-4911-8714-3777b1fce625
https://publica.fraunhofer.de/entities/publication/6b5b9e45-8e08-4ded-873f-4feab24dbc91
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