https://publica.fraunhofer.de/entities/orgunit/440ee988-c15e-43e6-9c0a-3feca8a07467
https://publica.fraunhofer.de/entities/project/440efe7a-9c48-471e-949d-001640a28bc8
https://publica.fraunhofer.de/entities/mainwork/440f06fd-c901-4cd3-be43-f2a5b763dfd1
https://publica.fraunhofer.de/entities/publication/440f0a46-d08d-4d7f-82ea-916f72509f14
https://publica.fraunhofer.de/entities/publication/440f0ece-ca75-423a-8c3a-2e82560c45ac
https://publica.fraunhofer.de/entities/publication/440f275d-d717-4e69-8a15-7651035216df
https://publica.fraunhofer.de/entities/publication/440f2a12-0195-47d1-aad0-560c5ce9ad78
https://publica.fraunhofer.de/entities/project/440f92b6-feca-4bd9-a16c-163d0fb2f8ec
https://publica.fraunhofer.de/entities/publication/440f9b1a-e00d-4012-ae7b-d1578426797b
https://publica.fraunhofer.de/entities/event/440fa47a-d8e7-4c36-866f-06532901cd7a
https://publica.fraunhofer.de/entities/publication/440fbcfe-e779-46c3-b341-5bf9e048e378
https://publica.fraunhofer.de/entities/publication/440fd8c9-079c-441c-a499-ec3e2f156746
https://publica.fraunhofer.de/entities/publication/440feede-048c-4cd5-ad61-49ff08860bf5
https://publica.fraunhofer.de/entities/publication/440fff08-94dc-4e18-86b4-0f459b02d2ab
https://publica.fraunhofer.de/entities/publication/441003fc-13ff-4f0e-92dd-603e36d6aff2
https://publica.fraunhofer.de/entities/publication/441004c8-273a-4873-af9a-802a93863a1b
https://publica.fraunhofer.de/entities/journal/44102096-854e-41ee-943c-627cc42c575a
https://publica.fraunhofer.de/entities/orgunit/44104a4c-907e-417c-b02e-757d2d73ff56
https://publica.fraunhofer.de/entities/publication/44106281-ab8b-4218-9a9e-97ce73f71a8c
https://publica.fraunhofer.de/entities/publication/441068c3-a9a6-4c2e-bfb0-e7028597a561
https://publica.fraunhofer.de/entities/publication/44107230-cacd-4a69-9346-8a618f2d61e2
https://publica.fraunhofer.de/entities/publication/4410aa5c-3a7f-4fdc-bb96-3a3622549651
https://publica.fraunhofer.de/entities/publication/4410ec84-d9de-4c64-8773-545c8a8e0d19
https://publica.fraunhofer.de/entities/publication/4410f773-813e-4eef-83e9-625c8217587d
https://publica.fraunhofer.de/entities/publication/44113c56-5264-43ca-819a-0c773e2fe490
https://publica.fraunhofer.de/entities/event/44113fd0-e294-4eff-990c-0b6cd1036045
https://publica.fraunhofer.de/entities/event/441153b2-710e-42f1-a12e-d2d614bebcd0
https://publica.fraunhofer.de/entities/publication/44116afd-e7e9-40bd-ad21-346cfb1ce111
https://publica.fraunhofer.de/entities/publication/4411912b-b9be-4639-a509-cc2abe8227cb
https://publica.fraunhofer.de/entities/event/44119334-b42c-4d2e-96e0-9e992324606c
https://publica.fraunhofer.de/entities/mainwork/4411b2f0-c9af-48f9-9b44-d463c1d460f1
https://publica.fraunhofer.de/entities/publication/4411eb2d-3a82-4a26-8c43-bc222d6df92a
https://publica.fraunhofer.de/entities/publication/44120851-6c43-418b-88e1-1589c7446ab4
https://publica.fraunhofer.de/entities/publication/44121009-2487-4760-8295-00aa82c41f4d
https://publica.fraunhofer.de/entities/journal/441249f0-3745-4741-b8c6-07c11f276c04
https://publica.fraunhofer.de/entities/event/44124cb7-530b-4f73-a00e-2f7b5a9cc236
https://publica.fraunhofer.de/entities/publication/44125c97-efb5-4e75-97ff-9f6d90d8fa44
https://publica.fraunhofer.de/entities/publication/44126bd1-beb7-4bee-a2f6-4cc91737ec88
https://publica.fraunhofer.de/entities/event/44126d4b-9748-4aaa-beff-7ea5fae7e836
https://publica.fraunhofer.de/entities/publication/4412bb15-996c-46c3-9393-163a382006b2
https://publica.fraunhofer.de/entities/publication/4412c611-0a7b-4832-bec5-782a6d310058
https://publica.fraunhofer.de/entities/publication/441344b4-11e3-4498-ac5f-0698a9d08d2a
https://publica.fraunhofer.de/entities/person/4413482b-4b3e-402f-b4fd-ff90fe9acb2b
https://publica.fraunhofer.de/entities/publication/44135011-2635-42d6-a521-831e6598ef7f
https://publica.fraunhofer.de/entities/publication/4413a380-4a6d-495d-881e-ef1fd41fa48b
https://publica.fraunhofer.de/entities/publication/4413eb02-e203-431a-8bce-3c8973772fb8
https://publica.fraunhofer.de/entities/publication/44147482-6774-4a9e-9ae2-5a0e3108e032
https://publica.fraunhofer.de/entities/publication/441474bf-1155-4f83-a352-d3a734556a9e
https://publica.fraunhofer.de/entities/orgunit/441479e4-9e7d-491d-98c5-f5bffb847269
https://publica.fraunhofer.de/entities/mainwork/44148705-b39b-4d2e-a87b-f1126e565196
https://publica.fraunhofer.de/entities/publication/4414a79e-48ff-4f9c-a8f9-53fc9c0787a2
https://publica.fraunhofer.de/entities/publication/4414b679-06e5-4662-8530-57fd0ca8af56
https://publica.fraunhofer.de/entities/journal/4414cfea-75c3-427b-9be8-84d5ddb03164
https://publica.fraunhofer.de/entities/mainwork/44150a9d-f4a3-449d-b6d9-5d372c8758f0
https://publica.fraunhofer.de/entities/mainwork/441534ee-c762-4f53-bcf1-ffb585029c92
https://publica.fraunhofer.de/entities/publication/441541c9-3021-4014-bcc6-214004a45a7d
https://publica.fraunhofer.de/entities/publication/44155848-e08b-48ad-ab73-8e3e58f36dd6
https://publica.fraunhofer.de/entities/publication/44157739-475b-4a34-abb8-e82caa101f38
https://publica.fraunhofer.de/entities/publication/4415978d-450f-475d-808e-de11f3d83db9
https://publica.fraunhofer.de/entities/publication/4415a3a4-de4a-419f-859b-841b9709d394
https://publica.fraunhofer.de/entities/publication/4415ae9a-53d8-4a7f-81da-594b90c7c2c3
https://publica.fraunhofer.de/entities/publication/4415c901-9b22-456f-bb44-2a41604ffce6
https://publica.fraunhofer.de/entities/mainwork/44163dce-2389-4a8e-becf-7a4eeb1c47a5
https://publica.fraunhofer.de/entities/publication/441656cf-19d9-498b-a09d-5a1d79a763f9
https://publica.fraunhofer.de/entities/publication/44168b91-d266-4909-bae9-04164b929a49
https://publica.fraunhofer.de/entities/mainwork/44169422-9f75-4b52-8c24-81d7eb3bdf47
https://publica.fraunhofer.de/entities/event/44169eda-24e9-4d3a-a0c8-018602a929dc
https://publica.fraunhofer.de/entities/publication/4416a443-b35c-4a01-bcbb-600d8e0423ba
https://publica.fraunhofer.de/entities/publication/4416b95f-a665-4920-8a23-af5e84c83240
https://publica.fraunhofer.de/entities/publication/441721b1-535a-4b4f-9397-f8dbf8ea7cc7
https://publica.fraunhofer.de/entities/publication/44176901-8502-40e4-964b-12683748ec5b
https://publica.fraunhofer.de/entities/mainwork/44177012-9419-4c35-baaa-a474b029590d
https://publica.fraunhofer.de/entities/project/4417862e-63c7-46ec-979c-86788d716e8b
https://publica.fraunhofer.de/entities/publication/4417cb6e-825a-4067-ab1e-486c394546ff
https://publica.fraunhofer.de/entities/publication/4417cc6f-5472-4ceb-bc8c-ab4b725d6ad0
https://publica.fraunhofer.de/entities/publication/4417e8b6-134d-4df5-84d1-c7c171dda7f5
https://publica.fraunhofer.de/entities/publication/44181e53-5774-43b9-bc75-fa5ce8ffb1f2
https://publica.fraunhofer.de/entities/publication/44187055-6fe4-44a1-9f35-93330811350c
https://publica.fraunhofer.de/entities/publication/4418d345-a8c2-4734-8507-02bb8dfb8ba8
https://publica.fraunhofer.de/entities/project/4418dd8b-056b-425d-83c2-000a125587a6
https://publica.fraunhofer.de/entities/publication/4418f593-8425-4299-89e9-63dbf6237d0c
https://publica.fraunhofer.de/entities/publication/44193fd3-dff7-4fe1-a331-1f181ce849a7
https://publica.fraunhofer.de/entities/publication/44195adb-c1cb-445a-af22-b9cac973fa5f
https://publica.fraunhofer.de/entities/patent/44199ad9-f272-46e5-b41e-d4fe2101468a
https://publica.fraunhofer.de/entities/publication/4419a09b-516b-4ffa-aeb0-ccec4b1d8c21
https://publica.fraunhofer.de/entities/mainwork/4419a140-b2c5-4433-a7c2-3ae41bd276fc
https://publica.fraunhofer.de/entities/publication/4419b2ad-9bc5-4480-8d98-9bc53b97f32d
https://publica.fraunhofer.de/entities/event/4419b8f9-ac8f-47d2-a589-db47ecd5983a
https://publica.fraunhofer.de/entities/patent/4419bd7a-f0d6-41c7-bbed-19fdab0064a2
https://publica.fraunhofer.de/entities/publication/4419d21a-067c-492e-b16d-ef1f56a95d73
https://publica.fraunhofer.de/entities/patent/4419ea20-e71c-4237-bb9e-94e8cf8672ca
https://publica.fraunhofer.de/entities/publication/441a7b61-e78f-483b-9fed-240710ae165d
https://publica.fraunhofer.de/entities/publication/441a913e-c7bb-4e1a-a736-d34ea1c924a7
https://publica.fraunhofer.de/entities/project/441a9303-7b18-4962-a2ba-f1552c483a81
https://publica.fraunhofer.de/entities/publication/441aafcb-0d1d-432b-8339-139504eb6b21
https://publica.fraunhofer.de/entities/event/441ab94f-f287-4379-8c22-3a09d91ae780
https://publica.fraunhofer.de/entities/publication/441abac1-cd70-4d61-9976-1aa061e58748
https://publica.fraunhofer.de/entities/mainwork/441b0624-f1a4-4e45-9f5a-d3dfeed863d2
https://publica.fraunhofer.de/entities/publication/441b1855-4b97-4a86-8164-643fc305e329
https://publica.fraunhofer.de/entities/mainwork/441b61f0-8dfa-4edf-a708-3f89bac87a8b
https://publica.fraunhofer.de/entities/publication/441b751f-4963-46c0-8413-452a4692ddb7
https://publica.fraunhofer.de/entities/publication/441b900c-64e4-48de-bac2-0c6b6643cd26
https://publica.fraunhofer.de/entities/event/441bacbc-513e-46d7-950e-e61fa267338a
https://publica.fraunhofer.de/entities/publication/441c02e6-b759-4c60-9a90-9f6803cf6c0d
https://publica.fraunhofer.de/entities/publication/441c1ba5-359c-4c8d-8bbc-5b2cb9b95b18
https://publica.fraunhofer.de/entities/mainwork/441c47c7-aaba-45bc-9f6e-32850bd3442d
https://publica.fraunhofer.de/entities/publication/441c679b-f5bc-4861-8061-025c5457e09c
https://publica.fraunhofer.de/entities/publication/441c6eb5-d09b-4a54-bedf-3eafc83d9b4a
https://publica.fraunhofer.de/entities/event/441d134e-92cd-4aaa-8346-e67b105c1bb3
https://publica.fraunhofer.de/entities/publication/441d1e17-0e26-42b7-b229-9cf5d60000b2
https://publica.fraunhofer.de/entities/publication/441dfd11-f541-4810-8fb1-c1435bf6234e
https://publica.fraunhofer.de/entities/publication/441e7401-4ba9-4f8b-a94e-27c620623139
https://publica.fraunhofer.de/entities/publication/441e82ea-112d-4fc8-ba57-c97d857fe343
https://publica.fraunhofer.de/entities/publication/441e9390-3690-4300-9be9-ec5b3dc38f23
https://publica.fraunhofer.de/entities/publication/441e9b77-8cfa-4446-9e99-86ebc3c8d74b
https://publica.fraunhofer.de/entities/event/441f0e0b-ae00-49f5-a256-ff77d915424d
https://publica.fraunhofer.de/entities/event/441f1bbb-f3b3-423e-8f9b-a5ae1c85d51b
https://publica.fraunhofer.de/entities/publication/441f2d91-9736-4053-880b-7490286b4594
https://publica.fraunhofer.de/entities/event/441f39c8-d240-4c77-ba77-d70aee75af71
https://publica.fraunhofer.de/entities/publication/441f7828-6812-4fc4-8c05-9670f8c403f5
https://publica.fraunhofer.de/entities/project/441f923f-8d30-41bc-8ec4-52e33902cf98
https://publica.fraunhofer.de/entities/publication/441fcf83-767e-44b1-85b1-76e808e126eb
https://publica.fraunhofer.de/entities/publication/441fe93a-51ed-42ae-a3b7-b4ee53216c95
https://publica.fraunhofer.de/entities/publication/441fea0c-7512-433a-94bb-f4f503d4b3f6
https://publica.fraunhofer.de/entities/publication/44208a9f-64a8-4b9d-a45f-cc726bce3092
https://publica.fraunhofer.de/entities/orgunit/4420bb97-0bd2-4fc6-9143-fb55ec2108d8
https://publica.fraunhofer.de/entities/publication/4420e8d1-b311-4875-b54f-4b28dfa2ee05
https://publica.fraunhofer.de/entities/publication/44210e86-1601-4689-831e-799c9e74b94d
https://publica.fraunhofer.de/entities/publication/4421174e-40f3-469b-99b2-47b3a072d80e
https://publica.fraunhofer.de/entities/publication/4421236a-6da2-4790-ad25-ddaae7d924b6
https://publica.fraunhofer.de/entities/patent/44215775-7b0c-4f3e-9590-9c9e5fc0165d
https://publica.fraunhofer.de/entities/publication/44217351-f3c8-4f23-b56d-36cd01cd152f
https://publica.fraunhofer.de/entities/publication/4421b968-8a4a-4d7d-adbd-78e5028a57e1
https://publica.fraunhofer.de/entities/orgunit/4421e60e-8461-4bf3-bed5-7e42afcd25a5
https://publica.fraunhofer.de/entities/publication/4421ec58-1919-480f-b30d-1f29b34a92f2
https://publica.fraunhofer.de/entities/publication/442224ef-7b20-4787-9b61-ed8a894165eb
https://publica.fraunhofer.de/entities/journal/442254ba-5f86-4211-aed4-963aa005104a
https://publica.fraunhofer.de/entities/publication/44226c16-f7a6-4488-aecc-3501fe4fc513
https://publica.fraunhofer.de/entities/publication/44226e45-099a-490d-be58-eb562b4e0754
https://publica.fraunhofer.de/entities/publication/442275f6-bba1-476c-9629-49dd105ae3b7
https://publica.fraunhofer.de/entities/person/44228416-be7e-4927-8819-4564bec551c7
https://publica.fraunhofer.de/entities/publication/4422fb2c-d9d5-48e4-bb38-be7dc5c88b38
https://publica.fraunhofer.de/entities/event/4423049c-abd5-46ef-a52b-35cc058c977d
https://publica.fraunhofer.de/entities/publication/44233d7f-5fb6-4200-b39d-bb3b5fcb10fb
https://publica.fraunhofer.de/entities/orgunit/44234235-b2cd-4775-962b-d4112b50b32e
https://publica.fraunhofer.de/entities/orgunit/44234c6b-3cd9-420a-97ea-4ee68273faa5
https://publica.fraunhofer.de/entities/publication/44234d89-a332-452a-af49-83b124b3baab
https://publica.fraunhofer.de/entities/publication/44236262-38f4-49d7-906f-7facad44e45b
https://publica.fraunhofer.de/entities/project/4423dd0e-eb7a-41da-8e7f-f5ab310803d8
https://publica.fraunhofer.de/entities/publication/4423fb9f-49a6-4a7f-8094-ba2766089d66
https://publica.fraunhofer.de/entities/publication/44241fcd-75e0-4828-98b2-f194325c111a
https://publica.fraunhofer.de/entities/publication/44243524-906e-4842-9006-5dc1b6fb7529
https://publica.fraunhofer.de/entities/publication/442442e6-6ab8-4c25-bdd0-974946d830ae
https://publica.fraunhofer.de/entities/publication/44244ade-bffa-455b-b954-ed83e361c041
https://publica.fraunhofer.de/entities/publication/44249252-b2b3-4020-8290-a0b0b600b61e
https://publica.fraunhofer.de/entities/publication/4424db41-79c0-455f-86c3-329d659b9ce0
https://publica.fraunhofer.de/entities/publication/4424e3ab-d027-4c60-8035-67bc3169651f
https://publica.fraunhofer.de/entities/publication/4424f314-20ad-4be9-b137-57214b835787
https://publica.fraunhofer.de/entities/publication/442505f4-acaf-4403-aeae-f871407c8c69
https://publica.fraunhofer.de/entities/publication/4425081b-dfb0-4291-9b90-205baf33ba93
https://publica.fraunhofer.de/entities/publication/44252e3c-06d8-4fd6-b7fb-b5ce4625bd6d
https://publica.fraunhofer.de/entities/publication/44257cff-78bd-4f6b-9c87-e722469c8ac9
https://publica.fraunhofer.de/entities/event/44259e76-d4d8-4514-afff-4903e01a940f
https://publica.fraunhofer.de/entities/publication/4425b10c-032c-4528-ab9e-303e5f5b9f97
https://publica.fraunhofer.de/entities/event/4425f496-0020-46d0-ada1-5b035c95a67b
https://publica.fraunhofer.de/entities/publication/44262f97-1c7a-4d26-a920-e280fd79e878
https://publica.fraunhofer.de/entities/publication/44265172-c54d-4a61-bd51-a638b3fafa28
https://publica.fraunhofer.de/entities/publication/44267beb-6b3b-4c7b-9ace-4f34860bc3f0
https://publica.fraunhofer.de/entities/event/44269d43-5e4b-4de2-b09b-ad34376bc53e
https://publica.fraunhofer.de/entities/mainwork/4426ab47-fcbc-4493-9d51-e4681059060f
https://publica.fraunhofer.de/entities/publication/44272e78-0066-4820-959c-783ea71c0f0f
https://publica.fraunhofer.de/entities/publication/442763ba-f589-4c4c-9d03-324d25fbe3d8
https://publica.fraunhofer.de/entities/patent/44276be9-9165-4b83-836a-056c9dce0372
https://publica.fraunhofer.de/entities/publication/4358a8c2-5e59-4596-b812-361df02aa762
https://publica.fraunhofer.de/entities/project/43598729-2a17-432d-b685-58ccd94d6afb
https://publica.fraunhofer.de/entities/publication/4359a225-65b0-4d39-b5f8-26fb7c514c42
https://publica.fraunhofer.de/entities/event/4359df09-667f-4315-ae19-42d1c1ac904c
https://publica.fraunhofer.de/entities/publication/4359ff97-da0a-4a67-955f-3b8635f2f721
https://publica.fraunhofer.de/entities/publication/435a3a64-6926-4e0f-a70e-d4f5ef40b14c
https://publica.fraunhofer.de/entities/publication/435a3f3e-31ea-4af7-9fe3-4f96a928dbca
https://publica.fraunhofer.de/entities/publication/435a9488-a300-4ff2-817e-17abdf5faaa4
https://publica.fraunhofer.de/entities/mainwork/435b2761-932e-410d-822b-a20db9014165
https://publica.fraunhofer.de/entities/mainwork/435b3749-31a7-49bb-a546-9c19845aa71c
https://publica.fraunhofer.de/entities/publication/435b648f-9908-4fbf-88ed-c090dc297d44
https://publica.fraunhofer.de/entities/event/435b9fdd-9b5e-4a2d-80a5-047f1f229baf
https://publica.fraunhofer.de/entities/publication/435bbbf3-0234-4625-adb2-63e276897317
https://publica.fraunhofer.de/entities/mainwork/435bd792-332c-4de8-b1a0-32ba90edec6e
https://publica.fraunhofer.de/entities/event/435c0ea4-717b-4a04-ab5c-4a294179da32
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https://publica.fraunhofer.de/entities/publication/435d7f2a-5257-414c-b89e-508619501e1b
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https://publica.fraunhofer.de/entities/publication/4364b3e8-90b2-430e-ad4a-cfa3412cb3e3
https://publica.fraunhofer.de/entities/publication/43652dba-2cd5-47cc-a966-34a06bae9bbd
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https://publica.fraunhofer.de/entities/project/4365a4c7-4cdd-4374-a100-d2ee25327e07
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https://publica.fraunhofer.de/entities/publication/4366d015-5d6c-464c-97e2-46c35e7bd8dc
https://publica.fraunhofer.de/entities/publication/4366f074-6145-485c-b41d-638de713e70a
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