Microsystem technology introduces a new way of system integration including microelectronics, sensors and actuators. The basis for that is provided by using the integrated circuit fabrication methods and especially silicon as an integration substrate. However, several supplementary technologies, especially for three-dimensional pattern generation, deposition and etching of new materials, passivation and packaging concepts etc., have to be developed. A very high priority is the development of a comprehensive CAD and simulation strategy, because these complex systems can only be designed effectively through a top-down approach. First products of microsystems, especially the monolithic integration of micromechanics and CMOS devices are already on the market. However, the development of more complex systems is still in its infancy. Due to the huge application potential of microsystem technology and its real interdisciplinarity, we also need new concepts for cooperation between system indus try, component manufacturers and research centers.