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  4. Simulation of plasma immersion ion implantation
 
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2011
Conference Paper
Title

Simulation of plasma immersion ion implantation

Other Title
Simulation von Plasma-Immersions-Ionenimplantation
Abstract
Ion implantation profiles of boron after a BF3 plasma immersion ion implantation in a plasma implanter with a pulsed voltage ion extraction were investigated both experimentally and by means of numerical simulation. Boron profiles for different ion implantation doses in the range 1E15 to 1E17 cm-2 were measured using the SIMS method. Simulations were performed using a Monte-Carlo based binary-collision approach for ion implantation. A good reproduction of the measured boron profiles was obtained using a double-exponential energetic spectrum of the boron ions.
Author(s)
Burenkov, A.  
Pichler, P.  orcid-logo
Lorenz, J.  
Spiegel, Y.
Duchaine, J.
Torregrosa, F.
Mainwork
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2011  
Conference
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2011  
Open Access
File(s)
Download (463.75 KB)
Rights
Use according to copyright law
DOI
10.24406/publica-r-372282
10.1109/SISPAD.2011.6034962
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • plasma immersion

  • ion implantation

  • simulation

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