Title

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2011

Title Supplement

8-10 September 2011, Osaka, Japan

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Electron Devices Society

Publisher

Publishing Place

New York, NY

Publication Date

2011

ISBN

978-1-61284-419-0

978-1-61284-416-9

Conference