Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Publication
    Modular Ultra-Low-Power IoT-Core - Bridging the Gap Between Power Electronics and Distributed Sensor Networks
    ( 2022)
    Brockmann, Carsten
    ;
    Al-Magazachi, Samer
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    Rezaei, Alireza
    ;
    Hefer, Jan
    ;
    Hager, Jan
    ;
    Gerstner, Holger
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    Matlok, Stefan
    ;
    Eckardt, Bernd
    ;
    Eppel, Markus
    ;
    Milosiu, Heinrich
    ;
    Oehler, Frank
    In this paper, the authors present an innovative ultra-low-power IoT-Core that can be used as an extension for efficient DC/DC converters. The module equips the overall system with computation and communication capabilities for Industry 4.0 and IIoT applications without adding significant power requirements. The research focuses on optimizing energy consumption by taking an overarching view of hardware and software at the system level. In the active state, the IoT-Core can adjust its power consumption at runtime by matching the application demands to the existing energy budget. In sleep state, the module uses a novel Wake-Up Receiver in the 868 MHz frequency band with an average power consumption of 3.5µW, allowing the system to wake up in 32ms. The results are demonstrated on a DC/DC converter, with an efficiency of up to 99.8%, which uses the plug-and-play IoT-Core to become a smart device that can save additional energy when being in idle mode.
  • Publication
    Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
    ( 2019)
    Becker, Karl-Friedrich
    ;
    Böttcher, Mathias
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    Schiffer, Michael
    ;
    Pötter, Harald
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    Brockmann, Carsten
    ;
    Freimund, Damian
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    Tschoban, Christian
    ;
    Windrich, Frank
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    Braun, Tanja
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    Hopsch, Fabian
    ;
    Heinig, Andy
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    Voigt, Sven
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    Baum, Mario
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    Hofmann, Lutz
    ;
    Lang, Klaus-Dieter
    Diese Veröffentlichung stellt das Konzept und die dazugehörige Packaginglösung einer universellen IoT Sensorplattformmit einer System-on-Chip (SoC) Familie als zentrale Steuer- und Recheneinheit vor. Die Plattform besteht aus 4 Ebenen, die angefangen vom hochintegrierten SoC, über die Montagemöglichkeit von gehäusten wie auch ungehäusten Sensoren bis hin zum System Board, was die üblichsten drahtgebundenen und drahtlosen Schnittstellen zur Verfügung stellt. Das Layout zur Sensormontage kann auf individuelle Kundenwünsche angepasst werden, um so spezielle Anforderungen an die Messaufgabe zu ermöglichen. Die Kerntechnologie des Packages besteht aus einem Moldpackage in Fan-Out Technologiemit unterseitiger Umverdrahtung des SoC zu den Balling Pads und Durchführungen zur oberseitigen Umverdrahtungfür die Montage der Sensoren.
  • Publication
    HBM and ASIC silicon interposer
    ( 2019)
    Puschmann, René
    ;
    Heinig, Andy
    The presented project shows the realization and selected analyses results of the first stage of a passive interposer chip for high performance data transfer between processor and memory dies, a 2D HBM (high bandwidth memory) interposer. The realized interposer chip can carry 8 HBM dies with each having 10'000 connections and one ASIC die with 80'000connections. A complex design was reduced from 5 to 3 levels of redistribution layers, which significantly saves manufacturing costs. By using line/space dimensions of 4 mm a mask aligner could be utilized for exposure. Therefore big interposer dies of 44 mm by 44 mm can be produced using relatively simple lithography technology at high per wafer yield. All technology is demonstrated on 300 mm silicon wafers.
  • Publication
    Very-Thin System-in-Package Technology for Structural Analysis
    ( 2019)
    Hopsch, Fabian
    ;
    Heinig, Andy
    ;
    Böttcher, Mathias
    The integration of very-thin electronic systems will enable new application fields like structural analysis of components used in aviation, windmills or other critical applications. Presented are two integration options, by using flexible substrates or a RDLFirst packaging approach suitable for multiple device assembly. The RDLFirst is very thin and the flip-chip devices can be thinned also, so that the overall system gets very thin. One main difference to flexible substrate is the possible line space, which is in the region of 100um for flexible substrates and down to some um for RDLFirst.
  • Publication
    Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
    ( 2018)
    Rülke, Steffen
    ;
    Beyer, Volkhard
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    Zorn, Wolfgang
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    Meinig, Marco
    ;
    Wecker, Julia
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    Reuter, Danny
    ;
    Deicke, Frank
    ;
    Clausner, André
    ;
    Werner, Thomas
    Functional integration on the micro/nano scales enables smart functionalities in mechanical engineering systems. Here, exemplarily shown for a ball screw drive, a structure-integrated wireless sensor technology is implemented into a manufacturing system for advanced process control and status monitoring - even at machine components being not yet accessible or difficult to access. This includes also a miniaturized, networked and energy-efficient information and communication technology (ICT) integrated into the machine.
  • Publication
    Interposer-based smartcard system with active wireless communication
    ( 2017)
    Hopsch, Fabian
    ;
    Heinig, Andy
    ;
    Böttcher, Mathias
    The trend to integrate more and more functionality into smaller and smaller devices is still ongoing. Most smart systems are communicating wireless, while non-stationary systems require an integrated power supply. This paper presents a system, which is integrated into a standardized smartcard format and is capable of active wireless transmission and can be used for location detection, ranging, localization or access control. The dimension of an ISO 7816 ID-1 smartcard, which is the most common used smartcard, is about 86 by 54 mm. Integrating a smart system on this dimensions is not an problem. But the maximal height of a smartcard is only 0.76 millimeters. So integrating functionality by using multiple components is still an issue.
  • Publication
    Fraunhofer cluster 3D integration - key to a holistic technology and service approach
    ( 2014)
    Wolf, Jürgen M.
    ;
    Schulz, Stefan
    ;
    Schneider, Peter
    ;
    Zschech, Ehrenfried
    3D integration - as a key technology - is of high significance for the realization of future innovative products. With its outstanding competencies in the fields of technology, design and reliability, Fraunhofer-Gesellschaft offers an excellent base and prerequisite for the market-oriented implementation of 3D integration for the industry in Germany, Europe and worldwide. To meet the complexity of this technological approach, the Fraunhofer institutes IZM, ENAS, IIS-EAS, IKTS cluster their competencies in a network to cover a broad spectrum of topics related to 3D integration. The complex correlation of the different aspects of 3D integration and the synergies that are met by the Fraunhofer cluster enable a strong positioning as a competent and broad project, technology and service partner.
  • Publication
    Fraunhofer cluster 3D integration
    ( 2014)
    Wolf, M. Jürgen
    ;
    Schulz, Stefan
    ;
    Schneider, Peter
    ;
    Zschech, Ehrenfried
    3D integration - as a key technology - is of high significance for the realization of future innovative products. With its outstanding competencies in the fields of technology, design and reliability, Fraunhofer-Gesellschaft offers an excellent base and prerequisite for the market-oriented implementation of 3D integration for the industry in Germany, Europe and worldwide. To meet the complexity of this technological approach, the Fraunhofer institutes IZM, ENAS, IISEAS, IKTS cluster their competencies in a network to cover a broad spectrum of topics related to 3D integration. This supports the strengthening of Germany as a center of innovation and economy and its leading role as a driver for innovative products in the field of microelectronic system integration. The presentation will show the complex correlation of the different aspects of 3D integration and demonstrate the synergies that are met by the new Fraunhofer cluster and that enable the positioning as a competent and broad project, technology and service partner for industrial clients.
  • Publication
    Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration
    ( 2014)
    Wojnowski, M.
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    Pressel, K.
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    Beer, G.
    ;
    Heinig, Andy
    ;
    Dittrich, Michael
    ;
    Wolf, Jürgen
    In this paper we investigate two vertical interconnect options for high-frequency system-in-package (SiP) integration: through encapsulant via (TEV) applied to the embedded wafer level ball grid array (eWLB) technology and through silicon via (TSV). We compare both solutions in terms of size and electrical performance. We use analytic expressions and electromagnetic simulations for our analysis and present measurement results of selected structures for verification. The results show that the choice of TEV and TSV depends on application and cost window.