• English
  • Deutsch
  • Log In
    Password Login
    or
  • Research Outputs
  • Projects
  • Researchers
  • Institutes
  • Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Fraunhofer cluster 3D integration - key to a holistic technology and service approach
 
  • Details
  • Full
Options
2014
Conference Paper
Titel

Fraunhofer cluster 3D integration - key to a holistic technology and service approach

Abstract
3D integration - as a key technology - is of high significance for the realization of future innovative products. With its outstanding competencies in the fields of technology, design and reliability, Fraunhofer-Gesellschaft offers an excellent base and prerequisite for the market-oriented implementation of 3D integration for the industry in Germany, Europe and worldwide. To meet the complexity of this technological approach, the Fraunhofer institutes IZM, ENAS, IIS-EAS, IKTS cluster their competencies in a network to cover a broad spectrum of topics related to 3D integration. The complex correlation of the different aspects of 3D integration and the synergies that are met by the Fraunhofer cluster enable a strong positioning as a competent and broad project, technology and service partner.
Author(s)
Wolf, Jürgen M.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Schulz, Stefan
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
Schneider, Peter
Fraunhofer-Institut für Integrierte Schaltungen IIS
Zschech, Ehrenfried
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS
Hauptwerk
Smart Systems Integration 2014
Konferenz
Smart Systems Integration Conference (SSI) 2014
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components 2014
Thumbnail Image
Language
English
google-scholar
Fraunhofer-Institut für Integrierte Schaltungen IIS
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Tags
  • 3D integration

  • design

  • TSV technology

  • analytics

  • reliability

  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Send Feedback
© 2022