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Fraunhofer-Gesellschaft
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2014
Conference Paper
Title

Fraunhofer cluster 3D integration

Abstract
3D integration - as a key technology - is of high significance for the realization of future innovative products. With its outstanding competencies in the fields of technology, design and reliability, Fraunhofer-Gesellschaft offers an excellent base and prerequisite for the market-oriented implementation of 3D integration for the industry in Germany, Europe and worldwide. To meet the complexity of this technological approach, the Fraunhofer institutes IZM, ENAS, IISEAS, IKTS cluster their competencies in a network to cover a broad spectrum of topics related to 3D integration. This supports the strengthening of Germany as a center of innovation and economy and its leading role as a driver for innovative products in the field of microelectronic system integration. The presentation will show the complex correlation of the different aspects of 3D integration and demonstrate the synergies that are met by the new Fraunhofer cluster and that enable the positioning as a competent and broad project, technology and service partner for industrial clients.
Author(s)
Wolf, M. Jürgen
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Schulz, Stefan  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Schneider, Peter  
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Zschech, Ehrenfried
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Mainwork
Pan Pacific Microelectronics Symposium, PAN PAC 2014  
Conference
Pan Pacific Microelectronics Symposium (PAN PAC) 2014  
Language
English
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • Mikroelektronik

  • Synergie

  • 3D integration

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