Options
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
HBM and ASIC silicon interposer
Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Interposer-based smartcard system with active wireless communication
Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration
Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Energy harvesting and conversion - applications of piezoelectric transformer and transducer MEMS
Entwurfsmethoden für verbesserte robuste Batteriemanagementsysteme. Teilvorhaben
Very-Thin System-in-Package Technology for Structural Analysis
Miniaturization of power converters by piezoelectric transformers - chances and challenges
Fraunhofer cluster 3D integration