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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
A novel hermetic encapsulation approach for the protection of electronics in harsh environments
Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Anwendungen der Röntgenmikroskopie in der Mikroelektronik und Energietechnik
Sensor Systems for Extremely Harsh Environments
Characterization of anodic bondable LTCC for wafer-level packaging
Fraunhofer cluster 3D integration - key to a holistic technology and service approach
Smart sensor systems for extremely harsh environments
HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature