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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
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PatentVerfahren zur Verbindung eines flexiblen Substrats mit einem Chip( 2004)
;Azdasht, G. ;Zakel, E.Reichl, H.Process for the thermal binding of contact elements (14, 15) of a flexible substrate (10) with contact metallizations (17) of an electronic component (12), whereby the flexible substrate has a substrate (13) made of plastic and the contact elements are applied with energy from their rear, i.e. in the form of a laser beam (11), whereby the transparency of the substrate (19), the absorption of the contact elements (14, 15) and the wavelength of the laser beam (11) are matched so that the laser beam is guided mainly through the substrate (13) and is absorbed in the contact elements (14, 15), and the substrate (10) is applied with pressure in such a way that the contact elements (14, 15) of the substrate (10) and the contact metallizations (17) of the component (12) are in contact with each other when the laser beam (11) is applied to them. -
PatentGehaeustes Bauelement und Verfahren zu dessen Herstellung( 2003)
;Reichl, H. ;Aschenbrenner, R. ;Ansorge, F. ;Becker, K. ;Ehrlich, R. ;Oppermann, H.Azdasht, G.NOVELTY - At least one component is located and contacted on the first region (102) of the substrate (100). The substrate flexible third region (106) is shaped such that the first and second region (104) are bent together to opposite each other and enclose at least one component. The coupling lines of the component(s) are brought out on a main surface (112) of the first and/or second substrate region outside, when folded over. USE - For dual in line package, quad flat package, multichip module, ball grid array module systems. ADVANTAGE - Small surface required for module assembly and flexible rewiring geometry. -
PatentVerfahren zum Bekeimen und/oder Implantieren und/oder Beschichten und/oder Strukturieren einer Oberflaeche und Lasersputteranlage zur Durchfuehrung des Verfahrens( 1999)
;Azdasht, G.Reichl, H.NOVELTY - A laser beam (101) is directed through an optical system (109,102) onto one or more target materials (103) in a nozzle housing (104), in order to evaporate these materials into target material particles. The target material particles thus produced are carried by a flow of a gaseous medium (113) through the opening (115) onto the surface (119,106) to be treated. USE - For production of contact layers on electronic component, for example. ADVANTAGE - Arbitrarily shaped, very small metallization structures of high accuracy and homogeneity can be produced by means of low-cost, simple equipment. DESCRIPTION OF DRAWING(S) - The drawing shows the proposed installation. Laser beam 101 Optical system 102, 109 Target materials 103 Nozzle housing 104 Surface to be treated 106, 119 Gaseous medium 113 Nozzle opening 115 -
PublicationFluxless die bonding of high power laser bars using the AuSn-metallurgy( 1997)
;Weiß, S. ;Bader, V. ;Azdasht, G. ;Kasulke, P. ;Zakel, E.Reichl, H. -
PublicationSolder ball bumping (SBB). A flexible equipment for FC, CSP, BGA and printed circuit boards( 1997)
;Kasulke, P. ;Azdasht, G. ;Zakel, E.Reichl, H. -
PublicationTutorial chip size package( 1997)
;Oppermann, H.H. ;Azdasht, G. ;Zakel, E.Reichl, H. -
PublicationRecent progress in encapsulation technology and reliability investigation of mechatronic, CSP and BGA packages using flip chip interconnection technology( 1997)
;Ansorge, F. ;Becker, K.-F. ;Azdasht, G. ;Ehrlich, R. ;Aschenbrenner, R.Reichl, H. -
PublicationA new CSP-technology based on chip on flex( 1997)
;Azdasht, G. ;Jung, E. ;Zakel, E.Reichl, H. -
PublicationRecent progress in flexible molding and reliability investigation of CSP and BGA-packages using advanced interconnection technology( 1997)
;Becker, K.-F. ;Ansorge, F. ;Ehrlich, R. ;Azdasht, G. ;Bader, V. ;Aschenbrenner, R.Reichl, H. -
PublicationA new approach to chip size package using meniscus soldering and FPC-bonding( 1997)
;Kallmayer, C. ;Jung, E. ;Kasulke, P. ;Azadeh, R. ;Azdasht, G. ;Zakel, E.Reichl, H.