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Solder ball bumping (SBB). A flexible equipment for FC, CSP, BGA and printed circuit boards
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1997
Conference Paper
Title
Solder ball bumping (SBB). A flexible equipment for FC, CSP, BGA and printed circuit boards
Author(s)
Kasulke, P.
Azdasht, G.
Zakel, E.
Reichl, H.
Mainwork
International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium 1997. Proceedings
Conference
International Flip Chip, Ball Grid Array, TAB, and Advanced Packaging Symposium 1997
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
