English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
A new CSP-technology based on chip on flex
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
1997
Conference Paper
Title
A new CSP-technology based on chip on flex
Author(s)
Azdasht, G.
Jung, E.
Zakel, E.
Reichl, H.
Mainwork
Second International Conference on Chip Scale Packaging 1997. Proceedings
Conference
International Conference on Chip Scale Packaging (CHIPCON) 1997
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
