English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Recent progress in encapsulation technology and reliability investigation of mechatronic, CSP and BGA packages using flip chip interconnection technology
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
1997
Conference Paper
Title
Recent progress in encapsulation technology and reliability investigation of mechatronic, CSP and BGA packages using flip chip interconnection technology
Author(s)
Ansorge, F.
Becker, K.-F.
Azdasht, G.
Ehrlich, R.
Aschenbrenner, R.
Reichl, H.
Mainwork
Third International Assembly and Packaging Foundry Conference 1997. Proceedings
Conference
International Assembly and Packaging Foundry Conference (APCON) <3, 1997, Sunnyvale/Calif)
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
