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Forschungsfabrik/Verbund Mikroelektronik
Terahertz technologies for non destructive testing
Wafer level chip scale packaging
Impact of RDL Polymer on Reliability of Flip Chip Interconnects in Thermal Cycling - Correlation of Experiments with Finite Element Simulations
Characterization of thin polymer films with the focus on lateral stress and mechanical properties and their relevance to microelectronics
Chiplets - Exploring the Green Potential of Advanced Multi-Chip Packages
Glass based interposers for RF applications up to 100GHz
Development of a high density glass interposer based on wafer level packaging technologies
Klebeverfahren zum Verbinden zweier Wafer
Material and process trends for moving from FOWLP to FOPLP
Korrosionsphänomene im mikroelektronischen System