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https://publica.fraunhofer.de/entities/event/e20f1b0a-0dd7-4800-a6ba-9c98e5ac7192
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https://publica.fraunhofer.de/entities/publication/e2137138-a67f-48f5-9391-583c46acb1cd
https://publica.fraunhofer.de/entities/mainwork/e21379dd-80dc-4505-bb9c-4014a2cb8e37
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https://publica.fraunhofer.de/entities/publication/e214260f-888f-4039-a8bb-786408ec638c
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https://publica.fraunhofer.de/entities/publication/e2147144-8c95-4916-95d7-2bff33e55d8b
https://publica.fraunhofer.de/entities/event/e214d33a-a294-4e72-a7a6-0c692a4ca12d
https://publica.fraunhofer.de/entities/publication/e2151005-bf64-4376-9ce3-bac3f23f1d2d
https://publica.fraunhofer.de/entities/event/e21536a7-40cf-4273-a6d7-be877e2d28d5
https://publica.fraunhofer.de/entities/publication/e2153c2b-a210-421c-aca0-7e00fc3de4d3
https://publica.fraunhofer.de/entities/publication/e2153dce-daef-4c36-8aeb-ed4aeb07a1a3
https://publica.fraunhofer.de/entities/event/e2156ed8-a8f7-4927-8e93-aad27e92585f
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https://publica.fraunhofer.de/entities/mainwork/e21639ba-4b97-4f88-9a70-c56a9600d092
https://publica.fraunhofer.de/entities/event/e21675d4-32af-4bd1-aef2-21507702476d
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https://publica.fraunhofer.de/entities/publication/e2173d1c-1cc6-40c6-acf6-15e9d63f53c4
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https://publica.fraunhofer.de/entities/patent/e218439e-b14e-4628-8e13-17616684281f
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https://publica.fraunhofer.de/entities/publication/e2186fb0-ba1d-4497-83fd-dfc95f0e6190
https://publica.fraunhofer.de/entities/publication/e2187f38-bc2c-4be6-9e0b-68c9cc5f3808
https://publica.fraunhofer.de/entities/publication/e218b39e-a6dd-4bf6-bb78-b3c37024a79a
https://publica.fraunhofer.de/entities/publication/e218ba78-0f5d-408c-99c0-67d1a578f8eb
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https://publica.fraunhofer.de/entities/event/e219375b-0b71-4098-a0be-6972eca02266
https://publica.fraunhofer.de/entities/publication/e219641e-2dfc-4214-91c1-30988b222b00
https://publica.fraunhofer.de/entities/patent/e219b68d-a989-4bb7-b907-2c0e58c7b3c6
https://publica.fraunhofer.de/entities/publication/e219cf17-465a-4ea4-a371-07091a1236ec
https://publica.fraunhofer.de/entities/event/e21ac17d-ac2c-433f-bc52-bf9166743cb5
https://publica.fraunhofer.de/entities/publication/e21ac6f9-9457-4e8f-b8f1-edd48d92f122
https://publica.fraunhofer.de/entities/patent/e21b6f9a-bc64-4a12-9505-839a10b48a97
https://publica.fraunhofer.de/entities/orgunit/e21b72f9-eda9-4e03-88e0-e426f6408a5b
https://publica.fraunhofer.de/entities/publication/e21b8f02-722e-4a47-8bac-96f5506c75e8
https://publica.fraunhofer.de/entities/publication/e21b99d6-967a-4539-a82f-be9ce10d3f9b
https://publica.fraunhofer.de/entities/journal/e21c0de3-08c9-4283-83a4-6b9b30b28a9c
https://publica.fraunhofer.de/entities/publication/e21c176f-302d-4727-b23a-641d4aa32032
https://publica.fraunhofer.de/entities/publication/e21c6b53-81c7-446e-8458-e6fa8f7e9065
https://publica.fraunhofer.de/entities/orgunit/e21c8e26-7640-4882-80db-c11465848c85
https://publica.fraunhofer.de/entities/event/e21ce17d-baed-4dc9-b875-3d2d739446b2
https://publica.fraunhofer.de/entities/event/e21d141d-6aac-4760-b93d-63abaa19b059
https://publica.fraunhofer.de/entities/publication/e21d17a2-e003-4d4b-96a7-85d6d8c156a3
https://publica.fraunhofer.de/entities/mainwork/e21d8291-089c-4d0b-9fb2-3a6892afcd95
https://publica.fraunhofer.de/entities/publication/e21d901b-ff30-4d1c-8cd7-7d91ff5851e6
https://publica.fraunhofer.de/entities/event/e21d9227-f431-4536-8273-21e94c48efab
https://publica.fraunhofer.de/entities/publication/e21d948a-d0be-48f6-9fef-2b70fe2d88fe
https://publica.fraunhofer.de/entities/publication/e21e06d4-fb55-4049-aad9-0a4d35b9367e
https://publica.fraunhofer.de/entities/publication/e21e103a-c4ab-4ecc-bfc9-2938fc47cb10
https://publica.fraunhofer.de/entities/patent/e21e65ac-84e9-48bc-9313-78db9de31951
https://publica.fraunhofer.de/entities/publication/e21e77e8-b8e8-4b45-bd43-4bd361f307e8
https://publica.fraunhofer.de/entities/publication/e21ebe74-8f32-4324-bb8f-39081959426c
https://publica.fraunhofer.de/entities/mainwork/e21ec05b-8e6c-4c86-8758-46199b58bc46
https://publica.fraunhofer.de/entities/mainwork/e21eda76-1717-4bc0-aff5-1f5fb8c647a0
https://publica.fraunhofer.de/entities/event/e21f4cdb-7cec-4137-841b-ba2d593eeb3f
https://publica.fraunhofer.de/entities/publication/e21f8094-3e41-479d-b3f8-955a057b7ca3
https://publica.fraunhofer.de/entities/publication/e21fb793-0a31-49f0-83e4-bb1bd88dbd3a
https://publica.fraunhofer.de/entities/event/e21fd1b8-7264-4829-8e69-07de3d883edb
https://publica.fraunhofer.de/entities/publication/e21fe5af-03eb-4bd7-bc37-b53b5acc37fd
https://publica.fraunhofer.de/entities/publication/e22029bc-ccc2-441a-a656-ec22261cb958
https://publica.fraunhofer.de/entities/publication/e22059c4-ebd5-4681-bb17-955cc3b71554
https://publica.fraunhofer.de/entities/publication/e22065e8-3b9e-4b5e-810a-f8e82ceb03cb
https://publica.fraunhofer.de/entities/publication/e22073b5-42d5-4037-b356-9800c08fb161
https://publica.fraunhofer.de/entities/publication/e220b3bd-c436-49a4-a584-1a26394238cc
https://publica.fraunhofer.de/entities/publication/e220ccb2-c52a-4620-aa60-c6c2788e8871
https://publica.fraunhofer.de/entities/mainwork/e220e8f0-4a06-49f9-b754-40c0526e9cc1
https://publica.fraunhofer.de/entities/patent/e220f388-d194-4929-bbfd-f8b384391c02
https://publica.fraunhofer.de/entities/event/e2211dc5-6593-4de9-9a05-80bac383c3e8
https://publica.fraunhofer.de/entities/event/e2215bd3-bc48-43e1-9ab9-589112667a21
https://publica.fraunhofer.de/entities/publication/e2219987-5db6-4155-ba80-39cd94dde1ed
https://publica.fraunhofer.de/entities/mainwork/e221a18d-4bd7-4cbd-8d1b-a5b6e1073e75
https://publica.fraunhofer.de/entities/publication/e221ab5b-3f70-40a3-8668-65da829741be
https://publica.fraunhofer.de/entities/publication/e221d0bb-a56e-4edf-bc7b-4b0f7dba404f
https://publica.fraunhofer.de/entities/mainwork/e221d4ff-60b9-48a7-8298-991583e9e07c
https://publica.fraunhofer.de/entities/person/e221d676-ff79-4022-a091-c096a5783c6d
https://publica.fraunhofer.de/entities/mainwork/e221d6b9-9555-4d5e-9559-0ee5927d9cf6
https://publica.fraunhofer.de/entities/publication/e2222588-050f-41b3-a811-6c97bd0a12a1
https://publica.fraunhofer.de/entities/publication/e22245c3-898b-4359-8328-886ca46149b0
https://publica.fraunhofer.de/entities/publication/e2225699-514b-4151-a4c3-65ad1f13cb67
https://publica.fraunhofer.de/entities/publication/e222b0e1-fd07-4f7a-a99e-35be1b9f773e
https://publica.fraunhofer.de/entities/event/e222b2c1-7a31-42c3-afe9-6bfd067d07bf
https://publica.fraunhofer.de/entities/publication/e222bdd2-ffa0-4289-a112-5f18cb11bc78
https://publica.fraunhofer.de/entities/event/e222ca12-ce63-4d42-8fe8-735d26586944
https://publica.fraunhofer.de/entities/publication/e2233b2f-8864-4bb0-9f17-266e072487d8
https://publica.fraunhofer.de/entities/publication/e2233b94-ad99-4cc7-90d4-ae40a05af6f8
https://publica.fraunhofer.de/entities/journal/e22348da-6f26-4e3d-af60-31941beed938
https://publica.fraunhofer.de/entities/event/e2238941-b2b6-4ba4-8da7-e7fcac4b1b67
https://publica.fraunhofer.de/entities/publication/e223e366-aa9b-4246-8849-8d6f67f4cd44
https://publica.fraunhofer.de/entities/publication/e224674a-5761-4b32-8933-fc3984d0e1f5
https://publica.fraunhofer.de/entities/publication/e2247570-3f14-485b-898f-f3dccd85b4c6
https://publica.fraunhofer.de/entities/publication/e2247fdc-b318-4dfd-89c6-74dc31c0df6e
https://publica.fraunhofer.de/entities/orgunit/e224c561-06cd-4c8b-9498-9521d371c8c5
https://publica.fraunhofer.de/entities/publication/e224e5f9-824d-44d4-8873-1a56f2703b43
https://publica.fraunhofer.de/entities/project/e2251178-9459-46ef-bf0f-ca0be588d7ce
https://publica.fraunhofer.de/entities/project/e2251af1-33b2-48f4-b566-17bc21e7a300
https://publica.fraunhofer.de/entities/publication/e2251f39-1799-4fd6-9d13-f610d0d6cd16
https://publica.fraunhofer.de/entities/publication/e2254b25-9b0c-4988-afbb-d84933751eb7
https://publica.fraunhofer.de/entities/publication/e225ce4c-7e80-48b9-bc73-04b971147002
https://publica.fraunhofer.de/entities/publication/e2262521-359b-4635-b057-88502e7205ca
https://publica.fraunhofer.de/entities/publication/e226ccbf-f33c-4397-b1e6-7eec6755a09d
https://publica.fraunhofer.de/entities/mainwork/e22766b9-bf97-466c-bd84-18da5e766b2d
https://publica.fraunhofer.de/entities/publication/e227697d-bbbb-4f97-b301-d9a5239a6298
https://publica.fraunhofer.de/entities/publication/e2278472-3435-448f-b46a-f001c0ce2f1c
https://publica.fraunhofer.de/entities/publication/e2279267-fae4-4479-a102-ed8b7d43a04a
https://publica.fraunhofer.de/entities/publication/e227d131-75d4-4f2e-8e26-794bbed37244
https://publica.fraunhofer.de/entities/event/e227decf-568c-49d3-b266-08586f8a2e7a
https://publica.fraunhofer.de/entities/publication/e227e966-a170-46f4-b049-58b4e9407c05
https://publica.fraunhofer.de/entities/patent/e227f82b-99b5-46f4-a8bb-bbac4eead996
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https://publica.fraunhofer.de/entities/project/e22a138b-db35-43c3-b233-fffec0eb1f47
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https://publica.fraunhofer.de/entities/mainwork/e22b3165-f6c0-43cd-ace4-1d47910e6897
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https://publica.fraunhofer.de/entities/orgunit/e22b9cc9-4496-4423-b3f2-a3152e45c107
https://publica.fraunhofer.de/entities/publication/e22ba34a-251a-4778-b563-3c6ca115a1e6
https://publica.fraunhofer.de/entities/mainwork/e22ba7d7-931d-42ff-8eb1-c4b1882115db
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https://publica.fraunhofer.de/entities/mainwork/e22befde-8069-4c5a-99cc-50629633ca51
https://publica.fraunhofer.de/entities/funding/e22c1323-73c9-4394-904a-9a64376bf426
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https://publica.fraunhofer.de/entities/publication/e22c57ed-73b3-47f2-9afc-40d1daa92932
https://publica.fraunhofer.de/entities/publication/e22ce533-c515-4aea-b658-67fdf563dfb7
https://publica.fraunhofer.de/entities/patent/e22ceba1-0d98-40a8-b9a6-19824e3fa8df
https://publica.fraunhofer.de/entities/publication/e22cf4d9-5b26-4e53-87aa-302f03c4576d
https://publica.fraunhofer.de/entities/orgunit/e22d4bfe-d6a6-482e-af52-90cbdcc4daa3
https://publica.fraunhofer.de/entities/orgunit/e22d9053-228f-4d91-abe8-6b6fb191b015
https://publica.fraunhofer.de/entities/publication/e22db82f-cb5c-4525-8b4c-ab4be6063f2a
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https://publica.fraunhofer.de/entities/publication/e22e083f-3393-47c1-8251-55fa49fefe54
https://publica.fraunhofer.de/entities/mainwork/e22e3565-2dc9-4698-b893-ba3411fcff7a
https://publica.fraunhofer.de/entities/publication/e22e398b-7fdd-4713-9d9b-2322e775eaba
https://publica.fraunhofer.de/entities/orgunit/e22e4dad-de00-4550-902e-3362a4d8e7ca
https://publica.fraunhofer.de/entities/publication/e22e5b06-1043-4eb6-90c2-1e37ccda16f4
https://publica.fraunhofer.de/entities/publication/e22e6343-aa33-4048-973d-1560ddf413ed
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https://publica.fraunhofer.de/entities/publication/e22ec38d-0435-42f7-baa5-2ea2164428fe
https://publica.fraunhofer.de/entities/event/e22ed918-1f18-4121-ac16-7e9d16c4c2aa
https://publica.fraunhofer.de/entities/publication/e22ee8ea-bc67-4b56-8719-ec66b69080bf
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https://publica.fraunhofer.de/entities/mainwork/e22f9691-16a6-4df3-a2d5-d8637eb05ea6
https://publica.fraunhofer.de/entities/event/e22fbd91-e51b-47ef-8eed-ee4e30591344
https://publica.fraunhofer.de/entities/publication/e22fdd6e-a639-48f5-8e8f-78cf29f39727
https://publica.fraunhofer.de/entities/event/e22fec6d-ce5f-43c7-acf6-098100e3fba9
https://publica.fraunhofer.de/entities/publication/e23027eb-41d6-405e-a6e3-2ce847997751
https://publica.fraunhofer.de/entities/patent/e230cf89-dd47-4bc2-9106-c1fc79ccc5ba
https://publica.fraunhofer.de/entities/mainwork/e230dea9-4d4e-484c-8433-a979967e50ec
https://publica.fraunhofer.de/entities/event/e230e729-43c7-4cb2-9ff7-566ffb7035f2
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https://publica.fraunhofer.de/entities/mainwork/e230fea8-f633-4d81-8f4b-1aabfab65a84
https://publica.fraunhofer.de/entities/event/e2311010-7b97-465b-b0af-de563b27bc35
https://publica.fraunhofer.de/entities/mainwork/e2313909-02a8-4f66-8f8d-3d26b4c1011d
https://publica.fraunhofer.de/entities/event/e2317207-d050-4d6b-bd21-23a7b0e81d7a
https://publica.fraunhofer.de/entities/event/e231999e-dea0-4652-9d39-1d6e07a75a4f
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https://publica.fraunhofer.de/entities/publication/e231cd58-9d96-474e-954f-c9f5dbcd53e8
https://publica.fraunhofer.de/entities/event/e2327009-b4ab-41a6-80b5-63fda49a0cf3
https://publica.fraunhofer.de/entities/publication/e232b1f7-1fe3-4c41-9cde-f273f7336731
https://publica.fraunhofer.de/entities/publication/e232c525-979a-451c-b817-40ae2ef2216c
https://publica.fraunhofer.de/entities/mainwork/e232dfc7-662e-4337-b00a-8791c58ada82
https://publica.fraunhofer.de/entities/publication/e232e230-af9a-4dc0-a1a2-32b831f6c2ae
https://publica.fraunhofer.de/entities/mainwork/e232e2bd-ec6b-406e-96f8-337ba80d8e36