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  4. Characterization of a Piezo-Resistive MEMS Microphone for Aero-Acoustic Measurements
 
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2023
Conference Paper
Title

Characterization of a Piezo-Resistive MEMS Microphone for Aero-Acoustic Measurements

Abstract
This paper presents the packaging and characterization of a piezo-resistive (PR) micro-electro-mechanical system (MEMS) microphone for aero-acoustic measurements with three different mem-brane sizes. The thickness of the square membranes is 5 μm with an edge length of 1900 μm, 2260 μm and 2660 μm, respectively. The results of the sensors characterization show a sensitivity of up to 55 dB re 1 V/Pa when exposed to an acoustic chirp signal ranging from 5-50 kHz at 70-100 dB SPL. This paper presents a test approach necessary for chips with very thin membrane and the results of a dynamic pressure frequency response test.
Author(s)
Erbacher, Kolja
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Bourquard, Claire  
ETH Zurich, Eindhoven University of Technology, Silicon Austria Labs (Austria)
Lokesh, Onteru
Wu, Lixiang
Mackowiak, Piotr  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Schneider-Ramelow, Martin  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Ngo, Ha-Duong  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Mainwork
SMSI 2023, Sensor and Measurement Science International  
Conference
Conference "Sensor and Measurement Science International" 2023  
DOI
10.5162/SMSI2023/C4.4
Additional link
Full text
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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