Ormocer-Primer for Improved Adhesion of Ceramic Composite Encapsulations
Power electronics are usually packaged by silicones or epoxies. Ceramic encapsulations outperform usual package materials by their high thermal conductivity and stability. A newly developed ceramic encapsulant is presented, which is based on Alumina or Magnesia reacting with water to harden. The adhesive power of these encapsulations is rather low, which indicates the necessity of using a primer promoting the adhesion towards the electronic materials. Here, a new primer is presented, which is a mixture of organic polymers and an inorganic network. It imparts the ceramic composite an excellent adhesion up to 250°C for short-term operation and 150°C for permanent operation. SEM pictures of the primer layer are presented to identify the matrix phase as the most dominant at the interface. In addition, the primer meets the requirement of being highly insulating. Finally, the first test on actual vehicles with a MOSFET component is shown.