Title

26th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2020

Title Supplement

Sept. 14 - Oct. 9, 2020, Online

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2020

ISBN

978-1-7281-7644-4

978-1-7281-7643-7

Conference