2021
Presentation
Title

Packaging Technologies in Power Electronic Modules @Fraunhofer IISB

Title Supplement
Presentation held at 24th CS MANTECH Workshop, May 24-27, 2021
Author(s)
Bayer, Christoph Friedrich  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Conference
DOI
File(s)
Rights
Under Copyright
Language
English
Keyword(s)