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  4. 3D integration processes for advanced sensor systems and high-performance RF components
 
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2018
Conference Paper
Title

3D integration processes for advanced sensor systems and high-performance RF components

Abstract
Sensor systems are the key elements of todays automotive, health care, environmental and Internet-of-Things (IoT) applications. By using MEMS sensors data like physical or electrical parameters in production equipment, gas concentration in the environment or chemical parameters in fluids can be recorded, digitized and transferred for further processing e.g. by means of big data algorithms in a server or cloud environment. For realizing such systems advanced sensors, which are in many cases based on sophisticated nano-technologies have to be combined with standard CMOS devices, which digitize the analogue sensor signals and optimize the overall data acquisition and data transmission. 3D integration processes are most suitable for high performant and reliable integration of sensor functions and electronic processing and simultaneously minimize the footprint, weight and form-factor of the sensor/IC product. 3D integration processes as fine-pitch Trough-Silicon-Vias (TSV) technology and various wafer bond technologies will be introduced in this paper.
Author(s)
Weber, Josef  
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
Fernandez-Bolanos, Montserrat
EPFL
Ionescu, Adrian
EPFL
Ramm, Peter  
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
Mainwork
Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB  
Project(s)
e-BRAINS  
Funder
European Commission EC  
Conference
Symposium "Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB" 2018  
Americas International Meeting on Electrochemistry and Solid State Science (AIMES) 2018  
Electrochemical Society (ECS Meeting) 2018  
Sociedad Mexicana de Electroquímica (SMEQ Congreso) 2018  
File(s)
Download (616.73 KB)
DOI
10.24406/publica-r-401930
10.1149/08608.0029ecst
Language
English
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
Keyword(s)
  • 3D integration

  • heterogeneous integration

  • TSV

  • wafer bonding

  • sensor

  • IoT

  • antenna

  • inductor

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