Title

Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB

Title Supplement

Held during the AiMES 2018, ECS and SMEQ Joint International Meeting, in Cancun, Mexico, from September 30 - October 4, 2018

Person Involved

Corporate Author

Electrochemical Society -ECS-

Electrochemical Society -ECS-, Electronics and Photonics Division

Electrochemical Society -ECS-, Dielectric Science and Technology Division

Publisher

Publishing Place

Pennington, NJ

Publication Date

2018

Series

ECS transactions; 86.2018, Nr.8

ISBN

978-1-5108-7168-7

978-1-62332-541-1

978-1-62332-542-8

978-1-60768-854-9

Conference