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Title

Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB

Title Supplement
Held during the AiMES 2018, ECS and SMEQ Joint International Meeting, in Cancun, Mexico, from September 30 - October 4, 2018
Person Involved
Corporate Author
Electrochemical Society -ECS-
Electrochemical Society -ECS-, Electronics and Photonics Division
Electrochemical Society -ECS-, Dielectric Science and Technology Division
Publisher
ECS  
Publishing Place
Pennington, NJ
Publication Date
2018
Series
ECS transactions; 86.2018, Nr.8
ISBN
978-1-5108-7168-7
978-1-62332-541-1
978-1-62332-542-8
978-1-60768-854-9
Conference
Symposium "Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB" 2018  
Americas International Meeting on Electrochemistry and Solid State Science (AIMES) 2018  
Electrochemical Society (ECS Meeting) 2018  
Sociedad Mexicana de Electroquímica (SMEQ Congreso) 2018  
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