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Title
Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB
Title Supplement
Held during the AiMES 2018, ECS and SMEQ Joint International Meeting, in Cancun, Mexico, from September 30 - October 4, 2018
Person Involved
Corporate Author
Electrochemical Society -ECS-
Electrochemical Society -ECS-, Electronics and Photonics Division
Electrochemical Society -ECS-, Dielectric Science and Technology Division
Publisher
Publishing Place
Pennington, NJ
Publication Date
2018
Series
ECS transactions; 86.2018, Nr.8
ISBN
978-1-5108-7168-7
978-1-62332-541-1
978-1-62332-542-8
978-1-60768-854-9
Conference