• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Heat haze effects in thermal chamber tensile tests on digital image correlation
 
  • Details
  • Full
Options
2018
Conference Paper
Title

Heat haze effects in thermal chamber tensile tests on digital image correlation

Abstract
This paper presents simulation data obtained using CFD in ANSYS Fluent for thermal chambers which host tensile test experiments that yield stress-strain relationships through a combination of strain gauges and digital image correlation. These tests are performed from room temperature up to 150°C with comparable simulations in CFD to help understand the results. Problems attributed to heat haze were identified with corrective measures being explored and later implemented. In this paper thermal chamber results from experiments at various temperatures are presented where the effects of optical distortion are demonstrated. At 60°C the optical distortion starts to become significant and dominant at yet higher temperatures, to the extent that corrective measures are essential. Hence the importance of adequate insulation is highlighted and, where not possible, the judicious use of fans is demonstrated to be an acceptable technique for controlling heat haze.
Author(s)
Yuile, Adam
Universität des Saarlandes, Fachrichtung Systems Engineering
Schwerz, Robert  
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Röllig, Mike  
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Metasch, René  
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Wiese, Steffen
Universität des Saarlandes, Fachrichtung Systems Engineering
Mainwork
19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018  
Conference
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2018  
DOI
10.1109/EuroSimE.2018.8369882
Language
English
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Keyword(s)
  • digital image correlation

  • thermal

  • simulation

  • thermomechanical

  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024