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19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
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Title
19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
Titel Supplements
15-18 April 2018, Toulouse, France
Hrsg
Driel, W.D. van
University of Technology <Delft, Netherlands>
Institut
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
IEEE
Verlagsort
Piscataway, NJ
Datum
2018
Konferenz
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2018