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  4. Investigations of critical structural defects in active layers of GaN-on-Si for power electronic devices
 
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2016
Conference Paper
Title

Investigations of critical structural defects in active layers of GaN-on-Si for power electronic devices

Abstract
The influence of structural defects in the active layer of GaN-on-Si substrates on the vertical leakage current was studied. The structural defects were analyzed by analytical scanning electron microscopy by means of cathodoluminescence (CL). The leakage current was determined by vertical I-V measurements. Two possibilities were found, which give potential explanations for the variations of the vertical leakage current: i) Threading dislocations, which may partially form leakage paths, were detected by CL imaging. ii) Variations of the carbon doping, which is used to tune GaN to a semi insulating material were revealed by CL spectroscopy.
Author(s)
Knetzger, M.
Meissner, E.  
Derluyn, J.
Germain, M.
Friedrich, J.  
Mainwork
Gettering and defect engineering in semiconductor technology XVI  
Conference
International Conference on Gettering and Defect Engineering in Semiconductor Technology (GADEST) 2015  
DOI
10.4028/www.scientific.net/SSP.242.417
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
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