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  4. Double patterning: Simulating a variability challenge for advanced transistors
 
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2013
Conference Paper
Title

Double patterning: Simulating a variability challenge for advanced transistors

Abstract
In this paper a comprehensive study of the impact of variations resulting from double patterning lithography on SRAM performance is presented. In double patterning, feature sizes are reduced by splitting one mask level into two. Besides the increase of process complexity and costs a further penalty is the introduction of uncorrelated variations between the two incremental lithography steps employed.
Author(s)
Evanschitzky, Peter  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Burenkov, Alex  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Lorenz, Jürgen  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Mainwork
18th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2013  
Project(s)
SUPERTHEME  
Funder
European Commission EC  
Conference
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2013  
DOI
10.1109/SISPAD.2013.6650585
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
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