Title

18th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2013

Title Supplement

3rd - 5th September 2013, Glasgow, Scotland

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Univ. Glasgow

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2013

ISBN

978-1-4673-5733-3

978-1-4673-5736-4

Conference