Challenges and methods for the design of 3D-integrated smart systems

More than Moore technologies like 3D-integration opens new paths to highly integrated smart systems. While manufacturing technologies are still in development, it is also needed to develop related design methods. The design of an interposer with wide I/O memory interface is demonstrated. It considers manufacturability and costs. Without interposers, the codesign of die stack and package is required. A preliminary 3D floor planning flow with electrical and thermal optimization is shown.