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  4. Modeling boron profiles in silicon after pulsed excimer laser annealing
 
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2012
Conference Paper
Title

Modeling boron profiles in silicon after pulsed excimer laser annealing

Other Title
Bodellierung von Borprofilen in Silicium nach gepulster Ausheilung mit einen Excimer Laser
Abstract
In this work, we investigated four possible mechanisms which were candidates to explain the shape of boron profiles after ion implantation and melting excimer laser annealing in silicon. A laser with a wavelength of 308 nm and a pulse duration of ~180 ns was used. To simulate this process, an existing model for the temperature and phase evolution was complemented with equations for the migration of dopants. Outdiffusion, thermodiffusion, segregation, and adsorption were investigated as possible mechanisms. As a result, we found that outdiffusion and segregation can be excluded as major mechanisms. Thermodiffusion as well as adsorption could both reproduce the build-up at low melt depths, but only adsorption the one at deeper melt depths. In both cases, ion beam mixing during SIMS measureme nt had to be taken into account to reproduce the measured profiles.
Author(s)
Hackenberg, M.
Huet, K.
Negru, R.
Venturini, J.
Fisicaro, G.
La Magna, A.
Pichler, P.  orcid-logo
Mainwork
Ion Implantation Technology 2012. 19th International Conference on Ion Implantation Technology. Proceedings  
Conference
International Conference on Ion Implantation Technology (IIT) 2012  
Open Access
File(s)
Download (392.88 KB)
Rights
Use according to copyright law
DOI
10.1063/1.4766533
10.24406/publica-r-377270
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • laser thermal annealing

  • silicon

  • simulation

  • boron

  • adsorption

  • ion-beam mixing

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