• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Strength analysis of etched silicon pressure sensors
 
  • Details
  • Full
Options
2005
Conference Paper
Title

Strength analysis of etched silicon pressure sensors

Abstract
The strength of relative pressure sensors are experimentally and numerically investigated. The sensors are produced with different eching processes and have different sizes because of different working pressure. The etching procedures create special geometries of membranes, around, clamped one (ECE) and a rectangular, clamped membrane with sharp notches (KOH). The paper compares the strength of different sensors and mechanical approaches that can be applied to predict the membrane strength.
Author(s)
Ebert, M.
Knaup, M.
Stelzer, T.
Bagdahn, J.
Bartuch, H.
Brokmann, G.
Mainwork
Micro System Technologies 2005  
Conference
International Conference on Micro Electro, Opto, Mechanical Systems & Components 2005  
Language
English
Fraunhofer-Institut für Werkstoffmechanik IWM  
Keyword(s)
  • pressure sensor

  • KOH etching

  • ECE etching

  • fracture test

  • finite element model

  • notch fracture thougness

  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024