• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Investigation of bonding behaviour of different borosilicate glasses
 
  • Details
  • Full
Options
2000
Conference Paper
Title

Investigation of bonding behaviour of different borosilicate glasses

Abstract
New investigations were carried out in order to characterise the anodic bonding behaviour of borosilicate glass Borofloat 33 in comparison with different suppliers of borosilicate glass wafers. Firstly the original surfaces were characterised. This was followed by anodic bonding experiments of the glass wafers with unpatterned and patterned silicon wafers. The compounds with unpatterned substrates were evaluated and compared with respect to the parameters bonding temperature, bonding time and current flow. Furthermore, test patterns (Chevron notches) for evaluation of bond strength were prepared, anodically bonded to the glass wafers and then loaded using the Micro Chevron Test up to the failure of the bond.
Author(s)
Wiemer, M.
Hiller, K.
Gessner, T.
Kloss, T.
Schneider, K.
Leipold-Haas, U.
Bagdahn, J.
Petzold, M.
Mainwork
MicroMat 2000. Proceedings 3rd International Conference and Exhibition Micro Materials  
Conference
Micro Materials (Micro Mat) 2000  
Language
English
Fraunhofer-Institut für Werkstoffmechanik IWM  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • borosilicate glass

  • borofloat

  • anodic bonding

  • wafer bonding

  • micro chevron test

  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024