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Morphology and electromigration lifetime of copper lines with different barriers
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1998
Conference Paper
Title
Morphology and electromigration lifetime of copper lines with different barriers
Author(s)
Schulz, S.E.
Baumann, J.
Weidner, J.-O.
Hasse, W.
Koerner, H.
Gessner, T.
Mainwork
Advanced metallization and interconnect systems for ULSI applications in 1999. Proceedings of the conference
Conference
Conference on Advanced Metallization and Interconnect Systems for ULSI Applications 1997
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
