• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Artikel
  4. Hybrid User Interfaces: Past, Present, and Future of Complementary Cross-Device Interaction in Mixed Reality
 
  • Details
  • Full
Options
2026
Journal Article
Title

Hybrid User Interfaces: Past, Present, and Future of Complementary Cross-Device Interaction in Mixed Reality

Abstract
We investigate hybrid user interfaces (HUIs), aiming to establish a cohesive understanding and to adopt consistent terminology for this nascent research area. HUIs combine heterogeneous devices in complementary roles, leveraging the distinct benefits of each. Our work focuses on cross-device interaction between 2D devices and mixed reality environments, which are particularly compelling, leveraging the familiarity of traditional 2D platforms while providing spatial awareness and immersion. Although prior work has prominently explored such HUIs in the context of mixed reality, we still lack a cohesive understanding of the unique design possibilities and challenges of such combinations, resulting in a fragmented research landscape. We conducted a systematic survey and present a taxonomy of HUIs that combine conventional display technology and mixed reality environments. Based on this, we discuss past and current challenges, the evolution of definitions, and prospective opportunities to tie together the past 30 years of research with our vision of future HUIs.
Author(s)
Hubenschmid, Sebastian
Satkowski, Marc  orcid-logo
Fraunhofer-Institut für Verfahrenstechnik und Verpackung IVV  
Zagermann, Johannes
Méndez, Julián
Elmqvist, Niklas
Feiner, Steven
Feuchtner, Tiare
Grønbæk, Jens Emil
Lee, Benjamin
Schmalstieg, Dieter
Dachselt, Raimund
Reiterer, Harald
Journal
IEEE transactions on visualization and computer graphics  
Open Access
DOI
10.1109/TVCG.2026.3683941
Additional link
Full text
Language
English
Fraunhofer-Institut für Verfahrenstechnik und Verpackung IVV  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024